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Improved fabrication processes of an all-polyimide micro electroosmotic flow pump using hot embossing are described. Microchannels in the micropump were fabricated by hot embossing on a transparent polyimide substrate. A silicon micromachined mold was pressed into the transparent polyimide substrate at a temperature of 300 oC to form microchannel patterns on the substrate. The depth and width of the microchannels were 25 μm and 50 μm, respectively. A UV ozone treatment was performed to improve adhesion between the transparent polyimide substrate and film capping layer. This UV ozone treatment enhanced adhesion and resulted in the reduction of the adhesion temperature as low as 100 oC, and nearly no deformation of the microchannels was observed. As a result, the electroosmotic flow pump exhibited the flow rate of 0.7 μl/min when a voltage of 50 V was given between the electrodes separated 20 mm each other.

Improved fabrication processes of a micro electroosmotic flow pump using hot embossing are described. The microchannels in the micropump were fabricated by hot embossing on a polymethylmethacrylate (PMMA) substrate. A silicon micromachined mold was pressed into the PMMA substrate at a temperature of 145 °C to form microchannel patterns on the substrate. The depth and width of the microchannels were 50 μm and 100 μm, respectively. Aluminum electrodes were deposited using thermal vacuum deposition. A UV ozone treatment was performed to improve adhesion between the PMMA substrate and a PMMA capping layer. This UV ozone treatment enhanced adhesion and resulted in the reduction of the adhesion temperature as low as 70 °C, and nearly no deformation of the microchannels was observed. As a result, the electroosmotic flow pump exhibited the flow rate of 0.5 μl/min when a voltage of 50 V was given between the electrodes separated 8 mm each other.