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A series of vinyl versatate (VV10) modified poly(vinyl acetate) adhesive (HVPVAc) were prepared using soap-free emulsion polymerization. Attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy was used to characterize the structure of the modified poly(vinyl acetate) latex. The effect of the VV10 content on particle size, viscosity, mechanical properties, and T-peel strength of the modified poly(vinyl acetate) was determined. No absorption peak at 1675–1500 cm−1 in the ATR-FTIR spectrum was observed as a result of the carbon-carbon double bond reacting completely. With the occurrence of -C-O-C and the disappearance of the carbon-carbon double bond in the FTIR spectrum, a more complex structure formed. The structure improves the mechanical properties. Increasing the VV10 content resulted in an increase in particle size from 63 nm to 221 nm, a steady increase in the viscosity of the HVPVAc latex, an increase in tensile strength from 7 MPa to 13.4 MPa, and a decrease in breaking elongation from 1310% to 1004%. As the VV10 content increased from 0 to 30% by weight, the T-peel strength of the HVPVAc adhesive increased from 8.35 N/mm to 18.97 N/mm, indicating improved adhesive performance. [ABSTRACT FROM AUTHOR]

Transfer printing techniques based on tunable adhesives that enable heterogeneous integration of materials in desired layouts are essential for developing existing and envisioned systems such as flexible electronics and micro‐LED (µ‐LED) displays. Here, a novel thermal controlled tunable adhesive, which not only has the ability of eliminating the interfacial adhesion for printing but also provides a new strategy for enhancing the interfacial adhesion for pick‐up is reported. The tunable adhesive features cavities filled with air on the surface. This simple construct offers thermal controlled suction and thrust with their amplitudes on the order of a few tens of kPa within 100 °C temperature change, which enables a reliable damage‐free transfer printing. Systematically theoretical and experimental studies reveal the underlying thermal induced pressure change mechanism and provide insights into the design and operation of the thermal controlled tunable adhesive. Demonstrations of this smart adhesive in manipulation of various surfaces and transfer printing of micro‐scale Si inks and µ‐LEDs illustrate its unusual capabilities for deterministic assembly by transfer printing. [ABSTRACT FROM AUTHOR]