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The effectiveness of ZrSiN/Zr bilayered films to serve as diffusion barriers in Cu/Si contacts has been investigated. Annealing studies for Cu/ZrSiN/Zr/Si contact systems were carried out in N2/H2(10%) ambient. X-ray diffraction data suggest that Cu film has preferential (111) crystal orientation and Cu silicide cannot be observed up to 700 °C. Scanning electron microscopy micrographs show that the Cu film was integrated and free from agglomeration after annealing at 700 °C. Auger electron spectroscopy depth profiles of the Cu/ZrSiN(10 nm)/Zr(20 nm)/Si samples have no noticeable change except Zr silicide grows with annealing temperature up to 700 °C. The results indicate excellent barrier property for ZrSiN(10 nm)/Zr(20 nm) bilayer structure for Cu metallization. [ABSTRACT FROM AUTHOR]

Abstract: Films of Cu/Cu(Ru) and Cu(Ru) were deposited on Si substrates by magnetron sputtering. Samples were subsequently annealed and analyzed by four-point probe (FPP) measurement, X-ray diffraction (XRD), transmission electron microscopy (TEM) and Auger electron spectroscopy (AES). After annealing at 500°C, resistivity values of both systems decrease, but the reduction is more significant for Cu(Ru). Moreover, the resistivity values of annealed Cu(Ru) film are still greater than those of annealed Cu/Cu(Ru) film. XRD data suggest that Cu/Cu(Ru) film has higher thermal stability and Cu silicide cannot be observed up to 500°C. According to TEM results, after annealing at 500°C, the grain size of the Cu(Ru) film is smaller than that of Cu/Cu(Ru) film. In conjunction with AES, XRD, TEM analyses and sheet resistance measurement, it indicates that Cu/Cu(Ru) seed layers are potentially good for advanced Cu interconnects from the views of interfacial stability and low resistivity. [Copyright &y& Elsevier]