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The research aims to investigate the indicators for evaluation of sustainable development of Taiwan’s indigenous tribal environment. For that matter, the indicators for evaluation of sustainable development of Taiwan’s indigenous tribal environment are obtained from literature reviews and further 1nalysed through two questionnaire surveys by the Delphi method and the Fuzzy Analytic Hierarchy Process (FAHP).The research findings are summarized as follows: (1) Five first-class indicators and 24 second-class indicators for evaluation of sustainable development of Taiwan’s indigenous tribal environment are derived; (2) First-class indicators are life culture, art culture, historical site, natural environment and tribe experience according to their weights from high to low; (3) Nines key factors for evaluation of sustainable development of Taiwan’s indigenous tribal environment are celebration of festival, traditional cuisine, life etiquette & custom, architectural feature, ancient monument, traditional artistry, life experience, life style and industrial activity. The research findings as suggestions for sustainable development of Taiwan’s indigenous tribal environment will be submitted to the relevant organizations or other researchers who are interested in our research in their follow-up studies.

Wrinkling behavior of buried pressure pipeline under strike-slip fault movement was investigated by finite element method. And effects of fault displacement, internal pressure, diameter-thick ratio and dip angle on the wrinkling modes and axial strain of pipeline were discussed. The results show that there are two wrinkling locations of buried pipeline under strike-slip fault displacement. There is only one wrinkle on A part, but more than two wrinkles on B part. Buckling mode of buried steel pipeline presents three states under different internal pressures. They are collapse state, critical state between collapse and wrinkling, and wrinkling state. The greater diameter-thick ratio can enhance the ability to resistance to bending moment. Bending curve of pipeline changes from S-shape to Z-shape with the increasing of diameter-thick ratio. Wrinkling is more serious with the increasing of fault displacement and diameter-thick ratio. There are two wrinkling modes of B part pipeline when dip angle β=0°~45°.DOI: http://dx.doi.org/10.5755/j01.mech.21.3.8891

In this article, we describe the effect of ethanolamine (EA) surface treat-ment on the inverted InP quantum dot light-emitting diodes (QD-LEDs) with inorganic metal oxide layers. The efficiency of the inverted QD-LEDs was significantly enhanced by EA treatment and optimization of the ZnO annealing temperature.

DRS history in microbolometer and uncooled focal plane array (UFPAA) development mimics that of the entire industry. The history extends over fifteen years as array pitches moved ever-smaller from 51uum to 25um to 17um, and now something smaller than 17uum. The uncooled microbolometer makers have transitioned through smaller pitches about every six years. This has been done while maintaining a noise equivalent temperature difference (NNETD) performance of 20-50mK, and maintaining a thermal time constant (TTTC) of 10-20mmSec. Once a newer pitch is developed to a performance level matching the previous pitch, development on the next smaller pitch is already underway. In this manner, the industry has progressed through smaller pitches without a fundamental performance improvement when measured in NNETD or in TTTC, or more specifically in NNETD*TTC product. Hence, a more-encompassing metric for tracking performance through time would involve the NNETD, the TTCC, and some indicator of bolometer size. Ann NETD*TTC**Area metric, as the appropriate metric for including bolometer size, will be proposed, theoretically justified, and discussed here. A rank-ordering of bolometers which have been published through 22013 is also presented in three charts, one for NETTD, one for NEETD*TTC, and lastly one for NETD*TTC**Area.

Low cost wafer-level chip-scale vacuum packaging (WLCSVP) imposes unique constraints on potential implementation of through-silicon vias (TSVs). A WLCSVP requires a relatively thick substrate to prevent mechanical failure. Two approaches for integrating TSVs in thick silicon wafers have been successfully demonstrated. Both approaches enable TSV formation from the backside of a device wafer and are compatible with the requirements of subsequent packaging operations. We achieved low contact resistance between TSVs and frontside Ti/Cu and Al metallization, while demonstrating high isolation resistance and high TSV yield.

The DRS Tamarisk® 320 camera, introduced in 2011, is a low cost commercial camera based on the 17 µm pixel pitch 320×240 VOx microbolometer technology. A higher resolution 17 µm pixel pitch 640×480 Tamarisk® 640 has also been developed and is now in production serving the commercial markets. Recently, under the DARPA sponsored Low Cost Thermal Imager-Manufacturing (LCTI-M) program and internal project, DRS is leading a team of industrial experts from FiveFocal, RTI International and MEMSCAP to develop a small form factor uncooled infrared camera for the military and commercial markets. The objective of the DARPA LCTI-M program is to develop a low SWaP camera ( 3 in volume and

A mosaic array of resistively heated microbridges offers much flexibility for infrared scene simulations. Dynamic scene simulations are important for the testing of the real-time performance capability of IR camera and seeker systems. The excellent thermal properties of the emitter pixels achieved with thin films and unique thermal isolation structures make it possible to achieve high temperatures at power levels ≈ 1 μW per pixel per degree temperature rise. High radiance and high dynamic range are achieved by having pixels with high emissivity and high fill factors, which operate with the substrate and drive electronics at cryogenic temperatures to achieve low background radiance. The thermal time constants of the pixels are defined by material properties and pixel design and are in the millisecond range, making it possible to achieve dynamic frame rates in excess of 100 Hz. Two types of cryogenic resistor arrays have been fabricated and are described, 512×512 arrays with pixels on a 3.5 mil pitch, and 128×128 arrays with pixels on a 2 mil pitch.

Uncooled infrared sensor markets have grown dramatically over the past decade due to significant improvements in sensor performance, producibility and cost reductions. Current uncooled sensors are dominated by VOx and amorphous silicon based microbolometers with spectral responses in the 7-14 μm wavelength region (LWIR). The majority of uncooled microbolometer focal plane array (UFPA) formats currently in production are 160x120, 320x240, 640x480 with 20 to 38 um pixel pitch. Most suppliers have reported good UFPA performance with less than 50 mK NETD(f/1 optics, 30 -60 Hz frame rates). Recently, 17 μm pixel pitch UFPAs have been introduced to the market. The smaller detector pixel pitch allows manufacturing of larger format such as 1024x768 UFPAs without photolithographic stitching. In the past, uncooled IR sensor developments were primarily driven by military needs; however, as low cost uncooled sensors began to proliferate in the commercial market, uncooled sensors with FPA formats of 320x240 and smaller are rapidly becoming commodity items. Reduction of sensor system size, weight, and power (SWaP) as well as cost is the key driver for the next generation of uncooled sensors. This paper presents a brief overview of the uncooled sensors status, developmental trends and challenges facing the industry.

This paper provides an overview of the recent DRS RSTA, Inc. (DRS) Vanadium Oxide (VOx) uncooled focal plane arrays (UFPA), sensor electronics, and camera development activities. Presently, DRS UFPAs consist of 25 μm and 17 μm pixel pitch detectors in 320x240 and 640x480 formats. Under the Army NVESD sponsored 17 μm Large Format Uncooled FPA Development program and internal projects, DRS has developed a 17 μm pitch 1024x768 UFPA product (U8000). The 17 μm pixel pitch UFPAs provide sensor systems with significant size, weight, and power (SWaP) savings as well as cost reductions over the 25 μm pixel pitch counterparts. There is a growing demand to transition current products to the 17 μm pixel technologies. For example, next generation military systems such as thermal weapon sights (TWS), enhanced night vision goggles (ENVG), driver viewer enhancers (DVE) and unmanned aerial vehicle (UAV) infrared (IR) surveillance sensors all called for the 17 μm pixel technologies. To meet market demand, DRS has improved its production facilities to accommodate 17 μm pixel detector manufacturing. In conjunction with these efforts, DRS has also developed a family of signal processing electronics based on a new FPGA architecture for various sensor modules and cameras that can be incorporated into commercial OEM products as well as DoD weapon systems. Under the DARPA funded AWARE Multiband (formerly DUDE) program, DRS and Goodrich Sensors Unlimited, Inc are collaborating on the development of a single, integrated, twocolor detector by combining the VOx microbolometer (8-14 μm) and InGaAs (0.4 -1.6 μm) detectors into a single focal plane array. The first AWARE Multiband dual mode focal plane array fabrication is now underway.

Significant progress has been made over the past decade on uncooled focal plane array (UFPA) technology development and production capacity at DRS as well as other domestic and overseas suppliers. This resulted in the proliferation of uncooled IR detectors in commercial and military markets. The uncooled detectors are widely used in firefighting, surveillance, industrial process monitoring, machine vision, and medical applications. In the military arena, uncooled detectors are fielded among diverse systems such as weapon sights, driver enhancement viewers, helmet-mounted sights, airborne and ground surveillance sensors including UAVs and robot vehicles. Pixel dimensions have continually decreased with an increase in pixel performance. This paper presents an overview of the DRS 25- and 17-micron pixel pitch uncooled VOx detector technology development and production status. The DRS uncooled FPA products include 320x240 and 640x480 arrays while the larger 1024x768 17-micron pitch array is at engineering prototype quantities. Current production of the 25-micron pitch 320x240 and 640x480 arrays exceeds 5,000 units per month, supporting U.S. military systems such as Army thermal weapon sights (TWS) and driver vision enhancers (DVE). Next generation systems are moving towards the 17-micron pixel pitch detectors. Advancement in small pixel technology has enabled the 17-micron pitch detectors performance to surpass their 25-micron pitch counterparts. To meet future production demand of the 17-micron pitch UFPAs, DRS has made significant investment in production infrastructure to upgrade its tools. These investments include a new DUV stepper, coater, and plasma etcher plus improvements in its manufacturing techniques to enhance yield. These advanced tools reduce the minimum line width in production below 0.35μm and are now being used to manufacture the 17-micron 320x240 and 640x480 arrays. To further technology development, DRS continues to engage in R&D activities focusing on VOx microbolometer detector design, packaging, test capability, materials and fabrication processes to further improve the detector performance, reliability, producibility and yield. Some of the results are summarized in this paper.

This paper provides an update of 17 micron pixel pitch uncooled microbolometer development at DRS. Since the introduction of 17 micron pitch 640x480 focal plane arrays (FPAs) in 2006, significant progress has been made in sensor performance and manufacturing processes. The FPAs are now in initial production with an FPA noise equivalent temperature difference (NETD), detector thermal time constant, and pixel operability equivalent or better than that of the current 25 micron pixel pitch production FPAs. NETD improvement was achieved without compromising detector thermal response or thermal time constant by simultaneous reduction in bolometer heat capacity and thermal conductance. In addition, the DRS unique "umbrella" microbolometer cavities were optically tuned to optimize detector radiation absorption for specific spectral band applications. The 17 micron pixel pitch FPAs are currently being considered for the next generation soldier systems such as thermal weapon sights (TWS), vehicle driver vision enhancers (DVE), digitally fused enhanced night vision goggles (DENVG) and unmanned air vehicle (UAV) surveillance sensors, because of overall thermal imaging system size, weight and power advantages.

DRS is a major supplier of the 25µm pixel pitch 640x480 and 320x240 infrared uncooled focal plane arrays (UFPAs) and camera products for commercial and military markets. The state-of-the-art 25µm pixel focal plane arrays currently in production provide excellent performance for soldier thermal weapon sights (TWS), vehicle driver vision enhancers (DVE), and aerial surveillance and industrial thermograph applications. To further improve sensor resolution and reduce the sensor system size, weight and cost, it is highly desired to reduce the UFPA pixel size. However, the 17µm pixel FPA presents significant design and fabrication challenges as compared with 25µm pixel FPAs. The design objectives, engineering trade-offs, and performance goals will be discussed. This paper presents an overview of the 17µm microblometer uncooled focal plane arrays and sensor electronics production and development activities at DRS. The 17 µm pixel performance data from several initial fabrication lots will be summarized. Relevant 25µm pixel performance data are provided for comparison. Thermal images and video from the 17µm pixel 640x480 UFPA will also be presented.

Recently, the display technologies using colloidal quantum dot (QD) materials have become one of the most important technologies in the display industry. But, the organic charge transport layer for quantum dot-light-emitting diode (QD-LED) can cause the device stability issues. In this article, we describe the QD-LED devices with inorganic charge transport layer and the solution-based oxide thin-film transistor (TFT) using non-thermal treatment. And we also show the active matrix driving using both technologies simultaneously.

DRS Technologies has designed and delivered Thermal Weapon Site (TWS) and Driver's Viewer Enhancer (DVE) system using its U3500 (320x240) and U6000 (640x480) 1-mil detector arrays. The detectors are modified to enhance its manufacturability, thermal time constant, package life time, and its reliability under shock and vibration to meet TWS and DVE requirements. The U6000 array operates at 30 Hz frame rate with NETD less than 50 mK normalized to F/1.0 optics. At a saving to the system weight and power, these arrays operate from -40°C to +65°C without the aid of a TE cooler. This is accomplished through a combination of sensor calibration and smart ROIC architecture.

This paper reviews Boeing's progress, over the last three years, in Vanadium Oxide (VO x ) uncooled microbolometer focal plane (UFPA) technology and product development. Boeing's UFPA product technology is described, including product capabilities and performance. Focal plane NETD equals 31 mK (F/1), at a 30 Hz sensor frame rate, has been demonstrated on the U3000 320 X 240 UFPA product. At a 60 Hz frame rate, the NETD (F/1) achieved on production U3000 UFPAs is typically less than 60 mK, and spatial pattern noise levels are consistently less than 33 mK after sensor level gain and offset compensation. Key improvements in VO x tin- film technology have been the achievement of a Temperature Coefficient of Resistance (TCR) approximately 3%, and the achievement of microbolometer resistance uniformity of approximately 1/3% ((sigma) /(mu) ) on the UFPA die. Looking into the future, this year Boeing expects to achieve NETD approximately 20 mK (F/1) with very low pattern noise, and within the next three years higher density 640 X 480 focal planes will be demonstrated with essentially equivalent NETD performance. Large high density uncooled LWIR focal planes, combined with low NETD, will make UFPA technology a prime candidate for higher performance FLIR applications.

A mosaic array of resistively heated microbridges offers flexibility for infra red scene simulations. The array may operate without flicker and display high-intensity dynamic scenes over a wide bandwidth. Honeywell completed fabrication of a 512 X 512 resistor array with 3.5 mils pitch for AEDC's 7V and 10V test chambers. The emitter has a broad bandwidth covering from 2 micrometers to 26 micrometers . The array operates at 20 K to simulate low radiation backgrounds in space. Up to 16,000 pixels may be turned on to simulate targets and target clusters. Each emitter element may heat up to 550 K with 1 kelvin resolution. The maximum power dissipation per pixel is 830 (mu) W for a pixel heated up to 550 K. The maximum power required is 13.2 watts for 16,000 pixels. This low power capability is derived from Honeywell's silicon nitride microbridge structure. Each emitter has approximately 85% fill factor and an average emissivity of 70% over the 2 - 26 micrometers bandwidth. Defect count in the array is less than 1% with one column out. The array may be addressed at 30 frames per second.© (1995) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Honeywell and MRC have been developing a range of thermal scene projector arrays through the Wright Laboratory Armament Directorate's cryovacuum resistive infrared scene projector (CRISP) program and the Defense Nuclear Agency's nuclear optical dynamic display system (NODDS) program. The resistive emitters are fabricated on silicon nitride structures on pitches as small as 2 mils. These structures have low thermal mass, low thermal conductance, and high fill factor. Monolithic address and pixel storage electronics provide flicker-free operation of large arrays at high frame rates. The emitters have demonstrated > 600 K blackbody temperatures, high radiance, and > 103 dynamic range at very low power when operated at 40 K temperatures to achieve low background. This paper describes the performance of a CRISP 512 X 512 array consisting of 3.5 mil pixels and a high-speed 128 X 128 NODDS array consisting of ultra-low-power emitters.