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Single-walled carbon nanotube (SWCNT) is generally used as a networked structure in the fabrication of a field-effect transistor (FET) since it is known that one-third of SWCNT is electrically metallic and the remains are semiconducting. In this case, the presence of metallic paths by metallic SWCNT (m-SWCNT) becomes a significant technical barrier which hinders the networks from achieving a semiconducting behavior, resulting in a low on/off ratio. Here, we report on an easy method of controlling the on/off ratio of a FET where semiconducting SWCNT (s-SWCNT) and m-SWCNT constitute networks between source and drain electrodes. A FET with SWCNT networks was simply sonicated under water to control the on/off ratio and network density. As a result, the FET having an almost metallic behavior due to the metallic paths by m-SWCNT exhibited a p-type semiconducting behavior. The on/off ratio ranged from 1 to 9.0 × 104 along sonication time. In addition, theoretical calculations based on Monte-Carlo method and circuit simulation were performed to understand and explain the phenomenon of a change in the on/off ratio and network density by sonication. On the basis of experimental and theoretical results, we found that metallic paths contributed to a high off-state current which leads to a low on/off ratio and that sonication formed sparse SWCNT networks where metallic paths of m-SWCNT were removed, resulting in a high on/off ratio. This method can open a chance to save the device which has been considered as a failed one due to a metallic behavior by a high network density leading to a low on/off ratio.

The balance of electron–hole charge carriers in quantum dot (QD) light-emitting diodes (QLEDs) is an important factor to achieve high efficiency. However, poor interfacial properties between QDs and their adjacent layers are likely to deteriorate the electron–hole charge balance, resulting in the poor performance of a QLED. In this paper, we report an enhanced efficiency in red-emitting inverted QLEDs by modifying the interface properties between QDs and ZnO electron transport layer (ETL) using a thin layer of non-conjugated polymer, poly(4-vinylpyridine) (PVPy). Based on the precise control of the electrical properties with PVPy, the maximum efficiency of the QLED is enhanced by 30% compared to the device without a PVPy layer. In particular, the efficiency at low current density region is significantly increased. We investigate the effect of the PVPy interlayer on the performance of QLEDs and find that this thin layer not only shifts the energy levels of the underlying ZnO ETL, but also effectively blocks the leakage current at the ETL/QD interface.

Chemical doping has been investigated as an alternative method of conventional ion implantation for two-dimensional materials. We herein report chemically doped multilayer molybdenum disulfide (MoS2) field effect transistors (FETs) through n-type channel doping, wherein triethanolamine (TEOA) is used as an n-type dopant. As a result of the TEOA doping process, the electrical performances of multilayer MoS2 FETs were enhanced at room temperature. Extracted field effect mobility was estimated to be ∼30 cm2 V−1 s−1 after the surface doping process, which is 10 times higher than that of the pristine device. Subthreshold swing and contact resistance were also improved after the TEOA doping process. The enhancement of the subthreshold swing was demonstrated by using an independent FET model. Furthermore, we found that the doping level can be effectively controlled by the heat treatment method. These results demonstrate a promising material system that is easily controlled with high performance, while elucidating the underlying mechanism of improved electrical properties by the doping effect in a multilayered scheme.

In this work, graphene field effect transistors (FETs) were fabricated on a trench structure made by carbonized poly(methylmethacrylate) to modify the graphene surface. The trench-structured devices showed different characteristics depending on the channel orientation and the pitch size of the trenches as well as channel area in the FETs. Periodic corrugations and barriers of suspended graphene on the trench structure were measured by atomic force microscopy and electrostatic force microscopy. Regular barriers of 160 mV were observed for the trench structure with graphene. To confirm the transfer mechanism in the FETs depending on the channel orientation, the ratio of experimental mobility (3.6-3.74) was extracted from the current-voltage characteristics using equivalent circuit simulation. It is shown that the number of barriers increases as the pitch size decreases because the number of corrugations increases from different trench pitches. The noise for the 140 nm pitch trench is 1 order of magnitude higher than that for the 200 nm pitch trench.

Irradiation of MoS2 field-effect transistors (FETs) fabricated on Si/SiO2 substrates with electron beams (e-beams) below 30 keV creates electron–hole pairs (EHP) in the SiO2, which increase the interface trap density (Nit ) and change the current path in the channel, resulting in performance changes. In situ measurements of the electrical characteristics of the FET performed using a nano-probe system mounted inside a scanning electron microscope show that e-beam irradiation enables both multilayer and monolayer MoS2 channels act as conductors. The e-beams mostly penetrate the channel owing to their large kinetic energy, while the EHPs formed in the SiO2 layer can contribute to the conductance by flowing into the MoS2 channel or inducing the gate bias effect. The analysis of the device parameters in the initial state and the vent-evacuation state after e-beam irradiation can clarify the effect of the interplay between the e-beam-induced EHPs and ambient adsorbates on the carrier behavior, which depends on the thickness of the MoS2 layer. DC and low frequency noise analysis reveals that the e-beam-induced EHPs increase Nit from 109–1010 to 1011 cm-2⋅eV-1 in both monolayer and multilayer devices, while the interfacial Coulomb scattering parameter αSC increases by three times in the monolayer and decreases to one-tenth of its original value in the multilayer. In other words, an MoS2 layer with a thickness of ~30 nm is less sensitive to adsorbates by surface screening. Thus, the carrier mobility in the monolayer device decreases from 45.7 to 40 cm2V-1s-1, while in the 30 nm-thick multilayer device, it increases from 4.9 to 5.6 cm2V-1s-1. This is further evidenced by simulations of the distribution of interface traps and channel carriers in the MoS2 FET before and after e-beam irradiation, demonstrating that Coulomb scattering decreases as the effective channel moves away from the interface.

With the advances in the separation and purification of carbon nanotubes (CNTs), the use of highly pure metallic or semiconducting CNTs has practical merit in electronics applications. When highly pure CNTs are applied in various fields, CNT networks are preferred to individual CNTs. In such cases, the presence of an electrical path becomes crucial in the network. In this study, we report on the electrical percolation thresholds of semiconducting single-walled carbon nanotube (s-SWCNT) networks, and their electrical characteristics in field-effect transistors (FET). Using the Monte Carlo method, s-SWCNT networks were randomly generated in the channels defined by the source-drain electrodes of the FET. On the basis of percolation theory, the percolation thresholds of s-SWCNT networks were obtained at different channel lengths (2, 6, and 10 μm) by generating random s-SWCNT networks 100 times. The network density corresponding to the electrical percolation threshold was theoretically gained at each channel length. As a result, the network densities at the percolation thresholds for the channel lengths of 2, 6, and 10 μm were 6.8, 9.0, and 9.9 tube μm(-2), respectively. In addition, SPICE calculations were performed for each s-SWCNT network, constituting an electrical path between the source and the drain electrodes of the FET. In all channel lengths, the on/off ratio of the s-SWCNT networks was enhanced with increasing network density. Finally, we found a power law relationship between the on/off ratio of the s-SWCNT networks and the network density at the percolation threshold.

We report that noise level was reduced by passivating WSe2 field effect transistors (FETs) with high-k dielectric material. Low frequency noise and I-V characteristics of the device were measured from WSe2 FETs before and after the passivation with ZrO2 to confirm the effect of passivation by high-k dielectric material. As a result, there was no significant change in the I–V characteristics. In the low frequency noise analysis, our device showed 1/f noise behaviors, in agreement with the carrier number fluctuation (CNF) model. The passivation process contributed to the reduction of trap sites at the top surface, leading to the decrease of noise level at the low current regime. Extracted volume trap densities were reduced from 2.0 × 1020 cm−3eV−1 to 8.7 × 1019 cm−3eV−1.

Doping effects in devices based on two-dimensional (2D) materials have been widely studied. However, detailed analysis and the mechanism of the doping effect caused by encapsulation layers has not been sufficiently explored. In this work, we present experimental studies on the n-doping effect in WSe2 field effect transistors (FETs) with a high-k encapsulation layer (Al2O3) grown by atomic layer deposition. In addition, we demonstrate the mechanism and origin of the doping effect. After encapsulation of the Al2O3 layer, the threshold voltage of the WSe2 FET negatively shifted with the increase of the on-current. The capacitance-voltage measurements of the metal insulator semiconductor (MIS) structure proved the presence of the positive fixed charges within the Al2O3 layer. The flat-band voltage of the MIS structure of Au/Al2O3/SiO2/Si was shifted toward the negative direction on account of the positive fixed charges in the Al2O3 layer. Our results clearly revealed that the fixed charges in the Al2O3 encapsulation layer modulated the Fermi energy level via the field effect. Moreover, these results possibly provide fundamental ideas and guidelines to design 2D materials FETs with high-performance and reliability.

The electrical characteristics of hydrogen passivated polycrystalline-silicon p-channel metal-oxide-semiconductor thin-film transistors (poly-Si PMOS TFTs) for high density memory devices have been investigated. A lightly doped offset (LDO) structure was adopted to reduce the electric field induced in the drain region. Compared with the on-current, the off-current was reduced significantly with an LDO length. As a result, the TFT with an LDO presented the enhanced on/off current ratio. However, it still has a drawback of reducing the on-current due to increased parasitic resistance. To reduce this effect, a source overlap structure was introduced. Although the on current was slightly improved at a longer source overlap length due to channel length reduction, the dependence of the on/off current ratio on a source overlap length was small compared with that on an LDO length. In the measurement of leakage currents, the lower channel and gate breakdown voltages were obtained at the longer source overlap structure.

Diagnosing of the interface quality and the interactions between insulators and semiconductors is significant to achieve the high performance of nanodevices. Herein, low-frequency noise (LFN) in mechanically exfoliated multilayer molybdenum disulfide (MoS2) (~11.3 nm-thick) field-effect transistors with back-gate control was characterized with and without an Al2O3 high-k passivation layer. The carrier number fluctuation (CNF) model associated with trapping/detrapping the charge carriers at the interface nicely described the noise behavior in the strong accumulation regime both with and without the Al2O3 passivation layer. The interface trap density at the MoS2-SiO2 interface was extracted from the LFN analysis, and estimated to be Nit ~ 10(10) eV(-1) cm(-2) without and with the passivation layer. This suggested that the accumulation channel induced by the back-gate was not significantly influenced by the passivation layer. The Hooge mobility fluctuation (HMF) model implying the bulk conduction was found to describe the drain current fluctuations in the subthreshold regime, which is rarely observed in other nanodevices, attributed to those extremely thin channel sizes. In the case of the thick-MoS2 (~40 nm-thick) without the passivation, the HMF model was clearly observed all over the operation regime, ensuring the existence of the bulk conduction in multilayer MoS2. With the Al2O3 passivation layer, the change in the noise behavior was explained from the point of formation of the additional top channel in the MoS2 because of the fixed charges in the Al2O3. The interface trap density from the additional CNF model was Nit = 1.8 × 10(12) eV(-1) cm(-2) at the MoS2-Al2O3 interface.

Modulation of electrical properties in MoS2 flakes is an attractive issue from the point of view of device applications. In this work, we demonstrate that an ambipolar behavior in MoS2 field effect transistors (FETs) can be easily obtained by heating MoS2 flakes under air atmosphere in the presence of cobalt oxide catalyst (MoS2 + O2 → MoOx + SOx). The catalytic oxidation of MoS2 flakes between source-drain electrodes resulted in lots of MoOx nanoparticles (NPs) on MoS2 flakes with thickness reduction from 64 nm to 17 nm. Consequently, N-type behavior of MoS2 FETs was converted into ambipolar transport characteristics by MoOx NPs which inject hole carriers to MoS2 flakes.