1. Modular Data Acquisition Architecture for Thin-Film Sensors Surfaces
- Author
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Wellington Maidana, Paulo Leitão, Nelson Rodrigues, Pedro João Rodrigues, Jorge Laranjeira, José Augusto Carvalho, and José Lima
- Subjects
0209 industrial biotechnology ,business.industry ,Computer science ,010401 analytical chemistry ,Dirt ,02 engineering and technology ,Modular design ,Stamping ,Industry 4.0 ,01 natural sciences ,Temperature measurement ,Thin-film sensors surfaces ,0104 chemical sciences ,Data acquisition and signal conditioning ,020901 industrial engineering & automation ,Data acquisition ,Robustness (computer science) ,Scalability ,business ,Signal conditioning ,Computer hardware ,Digitization - Abstract
Thin-film sensors surfaces are becoming popular to collect data in several specific and complex processes, namely plastic injection or metal stamping, allowing the digitization of such processes through the use of Internet of Things technologies. A particular challenge in such thin-film sensors surfaces is the data acquisition and signal conditioning system, which implementation is complex due to the characteristics of these sensors (e.g., low amplitude and noisy signals), but even more complex when implemented in real industrial processes, which are subject to harsh conditions, namely noise, dirt and aggressive elements. This work describes a modular data acquisition and signals conditioning system for thin-film sensors surfaces, meeting the requirements of scalability, robustness and low-cost, meaning that it can be easily expanded according to the number of sensors required for the application scenario. The work reported in this paper was supported by ONSURF- Mobilizar Competências Tecnológicas em Engenharia de Superfícies, Projeto n.o POCI-01-0247-FEDER-024521. info:eu-repo/semantics/publishedVersion more...
- Published
- 2020
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