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In this paper, a bump-forming method for flip chip bonding using ink-jet printing technology is proposed. A flip chip bonded transmission line using ink-jet printed silver bumps consisting of conductive ink containing silver nanoparticles was fabricated to verify the electrical characteristics after the flip chip bonding process. The transmission line was designed according to microstrip theory for a frequency range of 300 kHz to 3 GHz, with the size of fabricated line being 35 (width) × 8.64 (length) × 0.5 (thickness) mm3. The electrical characteristics of a reference microstrip and the flip chip bonded line were compared with FEM simulation and measurement results. Direct current (DC) resistances of both the reference line and the flip chip bonded line were measured to be 3.1 Ω and 3.2 Ω, respectively. The discrepancy between measured insertion loss and the simulation result was only 0.04 dB at 3 GHz, and the return loss was greater than 15 dB in the measurement frequency range. As a result of the analysis, it was confirmed that the DC resistance of ink-jet printed bumps account for 0.56% of the total DC resistance, and the ink-jet printed bumps hardly affected the radio frequency (RF) characteristics of the RF transmission line at low frequencies. The results demonstrate that ink-jet printed silver bumps can be used for a simple and low-cost flip chip bonding process. We expect that the proposed method can be applied to the packaging of various electronics such as flexible, wearable devices and RF applications.

In this Letter, a flip-chip bonding based on ink-jet printing technology is proposed and verified by interconnecting a separated coplanar waveguide (CPW) samples. Before the flip-chip bonding process, diameter and height of ink-jet printed silver bumps for flip-chip bonding are measured to be about 300 and 13 µm, respectively. In a frequency range from 300 kHz to 3 GHz, return loss and insertion loss of the flip-chip bonded CPW samples are measured to be higher than 20 dB and lower than 1.8 dB, respectively, where the length of the signal line is 35 mm. There are negligible discrepancies between radio frequency (RF) characteristics of the flip-chip bonded CPW and those of a conventional CPW. These results show that the proposed flip-chip bonding can be used to integrate RF components into electronic devices with low-loss using simple procedures.

In this paper, microstrip lines that are directly patterned by Ag ink-jet printing are discussed and their RF performance is investigated on both rigid and flexible substrates, which are FR-4 and polyimide (PI) film substrates, respectively. Microstrip lines are designed by computational simulation, and the simulated results are compared with the measured RF results of the fabricated microstrip lines. The measured transmission losses of the microstrip lines are 0.24 dB/cm for the FR-4 substrate and 0.66 dB/cm for the PI film substrate at 3 GHz. To measure the RF performance of the printed microstrip lines undergoing bending tests, the distances between the ends of the bended microstrip line are varied from 5 cm to 9.2 cm. The microstrip lines are twisted by torsion angles in the range of 0–40°. The RF performance and characteristics remain nearly unchanged under bending and torsion tests except for negligible variation caused by impedance mismatching occurred during the measurement process. The measured RF performance demonstrates that the printed Ag conductive lines can be utilized in RF application such as wearable and flexible systems, which require low-cost and low-end antennae at low frequencies.

This study proposes the unique method to analyze the cleanliness of the fine metal mask (FMM) used in OLED display manufacturing after FMM cleaning process. We developed a FMM-mimic microstructure as a substitute for the FMM, which can be used for the evaluation of cleaning efficiency. The FMM-mimic microstructure was fabricated using a combination of photolithography, reactive ion etching, anodic bonding and sand blasting processes. To demonstrate the proposed cleanliness analytical method, a 1.4 μm-thick Tris-(8-hydroxyquinoline) aluminum (Alq3) film was deposited on the FMM-mimic microstructure as a contaminant by vacuum thermal evaporation. The Alq3-deposited FMM-mimic microstructure was cleaned by N-methyl-2-pyrrolidone (NMP) with changing cleaning time. We analyzed the residual contaminants on the FMM-mimic microstructure using a fluorescence microscope. The developed FMM-mimic microstructure proves very convenient for inspecting the residual contaminant inside the gap through the transparent glass by general optical and fluorescence microscopy.

In this paper, nano-silver ink-jet printed transmission lines were fabricated to investigate RF performance on both flame retardant (FR-4) and polyimide (PI) as rigid and flexible substrates. The transmission lines were printed by using the ink-jet printer with velocity of 3.5 mm/s and were sintered in a convection oven with 250 °C. The RF performance of transmission lines was simulated and measured at low frequencies. The transmission loss is measured to be 0.22 dB@1 GHz and 0.32 dB@1 GHz, respectively, for the FR-4 and PI substrates, respectively. The return loss has over 16 dB for FR-4 substrate and over 12 dB for PI substrate. The RF performance of transmission line was investigated and discussed in regard to an influence by two substrates. The measured RF performance of fabricated transmission lines results in the possibility that flexible device is explored in low frequencies application.

A reciprocating pump using a piezoelectric linear actuator is introduced as a fuel supply module for a direct methanol fuel cell (DMFC) stack. The results show that the key advantage of the pump with the linear actuator is its ability to operate at a low frequency, which enables high flow rectification performance. At the end of this study, the pump is applied to a DMFC system to demonstrate that the output voltage of a DMFC stack remains stable with time even when the pumping pressure oscillates periodically at frequencies of a few Hz. It is also demonstrated that the maximum output power of the stack exceeds 6 W with power consuming 3.5% of the stack power for the fuel pump.

The characteristics of silver inkjet printing were intensively investigated with control of surface energy and substrate temperature. A fluorocarbon (FC) film was spincoated on a silicon (Si) substrate to obtain a hydrophobic surface, and an ultraviolet (UV)/ozone (O3) treatment was performed to control the surface wettability of the FC film surface. To characterize the surface changes, we performed measurements of the static and dynamic contact angles and calculated the surface energy by Wu's harmonic mean model. The surface energy of the FC film increased with the UV/O3 treatment time, while the contact angles decreased. In silver inkjet printing, the hydrophobic FC film could reduce the diameter of the printed droplets. Merging of deposited droplets was observed when the substrate was kept at room temperature. Substrate heating was effective in preventing the merging phenomenon among the deposited droplets, and in reducing the width of printed lines. The merging phenomenon of deposited droplets was also prevented by increasing the UV/O3 treatment time. Continuous silver lines in the width range of 48.04–139.21 µm were successfully achieved by inkjet printing on the UV/O3-treated hydrophobic FC films at substrate temperatures below 90 °C.