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Superconducting transition-edge sensor (TES) microcalorimeters are being developed for a variety of potential astrophysics missions, including Athena. The X-ray integral field unit instrument on this mission requires close-packed pixels on a 0.25 mm pitch, and high quantum efficiency between 0.2 and 12 keV. In this work, we describe a new approach with 50 μm square TESs consisting of a Mo/Au bilayer, deposited on silicon nitride membranes to provide a weak thermal conductance to a ~ 50 mK heat bath. Larger TESs usually have additional normal metal stripes on top of the bilayer to reduce the noise. However, we have found that excellent spectral performance can be achieved without the need for any normal metal stripes on top of the TES. A spectral performance of 1.58 ± 0.12 eV at 5.9 keV has been achieved, the best resolution seen in any of our devices with this pixel size. [ABSTRACT FROM AUTHOR]

We develop superconducting transition-edge sensor (TES) microcalorimeter focal planes for versatility in meeting the specifications of X-ray imaging spectrometers, including high count rate, high energy resolution, and large field of view. In particular, a focal plane composed of two subarrays: one of fine pitch, high count-rate devices and the other of slower, larger pixels with similar energy resolution, offers promise for the next generation of astrophysics instruments, such as the X-ray Integral Field Unit Instrument on the European Space Agency's ATHENA mission. We have based the subarrays of our current design on successful pixel designs that have been demonstrated separately. Pixels with an all-gold X-ray absorber on 50 and 75 μm pitch, where the Mo/Au TES sits atop a thick metal heatsinking layer, have shown high resolution and can accommodate high count rates. The demonstrated larger pixels use a silicon nitride membrane for thermal isolation, thinner Au, and an added bismuth layer in a 250-μm2 absorber. To tune the parameters of each subarray requires merging the fabrication processes of the two detector types. We present the fabrication process for dual production of different X-ray absorbers on the same substrate, thick Au on the small pixels and thinner Au with a Bi capping layer on the larger pixels to tune their heat capacities. The process requires multiple electroplating and etching steps, but the absorbers are defined in a single-ion milling step. We demonstrate methods for integrating the heatsinking of the two types of pixel into the same focal plane consistent with the requirements for each subarray, including the limiting of thermal crosstalk. We also discuss fabrication process modifications for tuning the intrinsic transition temperature ( Tc) of the bilayers for the different device types through variation of the bilayer thicknesses. The latest results on these “hybrid” arrays will be presented. [ABSTRACT FROM PUBLISHER]