6 results on '"Chen, Yuanming"'
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2. Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating
3. Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation
4. Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process
5. Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method
6. Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application
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