Search

Multifunctional materials that are lightweight and thermally conductive but electrically insulating are important for modern electronics, computer, and telecommunication technologies. Here, a novel foam structure of a polymer/matrix composite filled with ceramic platelets with improved thermal conductivity is reported. Such improvement is caused by the stress-induced alignment of thermally conductive fillers in the cell wall of the plastic foam. The foam structure is very promising for use as a lightweight electronic packaging material owing to its light weight, thermal conduction ability, electrical insulation, and good processability. [ABSTRACT FROM AUTHOR] more...