Search

Promising interconnect materials continue to emerge and are considered as potential replacements for Cu interconnects. In this article, an interconnect technology/system codesign methodology is presented to efficiently optimize generic interconnects using ballistic materials. The key requirements of material-level characteristics to replace conventional Cu counterparts are quantified, such as the channel density, mean free path (MFP), and contact resistance. Furthermore, to achieve maximal chip-level throughput, two interconnect design schemes are proposed and optimized under a given number of metal layers, die area, and power density constraints. Results demonstrate that the optimal design scheme strongly depends on the power constraint, driving devices as well as material parameters, including the contact resistance. It is shown that up to 45% of the throughput improvement can be achieved by replacing both local and intermediate Cu interconnects at an ultralow-power budget. [ABSTRACT FROM AUTHOR]