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Graphite-based metal transition-layer substrates hold great potential for preparing large-area diamond films and achieving crack-free release. In this study, a five-inch crack-free free-standing diamond film was prepared on a graphite substrate with a sacrificial Mo/Ti double-layer transition layer using direct-current arc plasma jet chemical vapor deposition (DC jet CVD). The interfacial bonding and diffusion behavior between the diamond and the transition layers were investigated. The effect of abundant metal particles and elemental diffusion between layers on film adhesion and stress release are discussed and analyzed. The surface of Ti layer prepared by the multi-arc ion-plating contains numerous metal particles that provide a template for the fine-crystalline Mo layer. Metal particles are encapsulated and embedded in the diamond and act as anchors that ensure the stability of the substrate–diamond bond during high-temperature deposition. After deposition, those metal particles act as weak points and play crucial stress-release roles. Mutual elemental diffusion occurs between the Ti, Mo, and diamond layers. Ti penetrates the Mo layer to form a continuous 140-nm-thick thin layer during the initial deposition period, facilitating diamond nucleation. Carbon from the plasma and diamond diffuses into the metal transition layer. Thermal stress generated between the diamond and the graphite substrate is released by destroying the metal transition layer with high thermal expansion coefficient and low elastic modulus during cooling from the deposition temperature. Cracks rapidly propagate along the interface between destroyable transition layers and graphite substrate, which results in the liftoff of a fully crack-free diamond film. [Display omitted] [ABSTRACT FROM AUTHOR]

Diamond is a highly attractive material for many applications in material science, engineering, chemistry, and biology because of its favorable properties. The preparation of large-area freestanding diamond plate can greatly reduce the production cost of diamond and promote the industrialization of diamond. In this study, the dual-magnetic field mode was introduced to optimize the magnetic field distribution in direct current arc plasma jet chemical vapor deposition (DC Jet CVD) system, and the arc plasma was effectively controlled under the coupling of electric field and magnetic field. The uniformity of the plasma distribution above the substrate surface is significantly improved, resulting in long-term stable and uniform growth of the 8-inch freestanding diamond plate. The influence of dual-magnetic field mode on magnetic field generation, arc feature, and reactive group distribution was studied. 8-inch freestanding diamond plates with an average thickness of 2.8 mm were prepared by dual-magnetic controlled DC Jet CVD. The results showed that the 8-inch diamond plate preferred a high (220) orientation, and the deviation of thickness of which was around 10 % of the averaged values. Raman spectroscopy of diamond revealed a 6.6 cm−1 of full width at half maximum (FWHM) and calculated 1.20 GPa compressive stress in the 8-inch diamond plate. By means of mechanical and thermal property measurements, the large area diamond plate shows a robust structure with the average values of three-point bending fracture strength of 987.2 MPa, and extremely high thermal conductivity of 1797.8 W/(m·k) as well. The deviation of three-point bending fracture strength and the thermal conductivity over the 8-inch diamond plate was around 7.9 % and 12.6 % of the respective averaged values. [Display omitted] • A uniform and robust 8-inch diamond plate was prepared using a dual-field DC arc CVD system. • The average three-point bending fracture strength of the 8-inch diamond plate was 987.23 MPa, and the average thermal conductivity was 1797.80 W/(m•K). • The effect of dual magnetic field mode on the distribution of arc morphology and arc plasma groups was analyzed using a high-speed camera and filter. [ABSTRACT FROM AUTHOR]

In this study, standard diamond bars were prepared using an ultra-thick diamond plate, and the bars had sizes consistent with the International Organization for Standardization (ISO) 14704:2016(E) three-point bending method for measuring the fracture strength. Ultra-thick diamond plate with dimensions of 125 mm (diameter) × 6.5 mm (thickness) were deposited using direct current arc plasma jet chemical vapour deposition. After cutting, grinding, and polishing, 12 diamond bars meeting the requirements of the ISO standard were prepared (36 mm × 4 mm × 3 mm) and tested for fracture strength using the cited ISO standard and elastic modulus using deflection measurements. The fracture strength of the ultra-thick diamond plate was found to be 580 ± 66 MPa. In addition, for comparison, the fracture strengths of standard ZnS, sapphire, and alumina were also analysed. Crucially, this is the first report of the fracture strength of standard-sized diamond plate. The effects of the defects and grain size on the crack formation and failure of the diamond film were analysed. The diamond's fracture strength was affected by the sample thickness, which caused the gradual accumulation of defects as this dimension increased, but not by its length and width. The elastic moduli of sapphire and alumina were compared. Overall, the measurement of the fracture strengths of ultra-thick diamond plate via the ISO standard is important for industrial applications. [ABSTRACT FROM AUTHOR]

In this study, the effect of defects on fracture toughness in different directions was investigated. Two diamond films with a diameter of 122 mm and as-deposited thicknesses of 2.2 and 1.5 mm, respectively, were deposited by DC arc plasma jet chemical vapor deposition. To accurately obtain the fracture toughness, the films were ground and polished to 1.6 and 0.8 mm, respectively. The results indicate that many defects, including pores, are introduced into the films during the growth process, particularly on the side close to the growth surface in thicker film. The size of pores reaches micrometres, which affects the fracture toughness under loading in different directions. Due to the minimum grain size, both films exhibit a maximum toughness of 8.2 and 10.0 MPa·m1/2, respectively, with growth-surface cracks. For the thinner sample, the maximum value is followed by that of the edge-surface cracks. As the grain size of the edge surface falls between that of the growth surface and that of the nucleation surface, the results indicate that fracture toughness is affected by grain size. However, the number of pores near the growth side increases when the thickness exceeds 0.8 mm. Pores reduce the toughness, resulting in the minimum fracture toughness (6 MPa·m1/2) of the thicker diamond film with edge-surface laser cracks. The sample with an edge-surface sharp pre-crack has a similar fracture toughness of 5.6 MPa·m1/2. This study provides guidance for selecting the applied load direction. • Two thick diamond films with thicknesses 2.18 and 1.48 mm were deposited. • Fracture toughnesses of the diamond films in three directions were investigated. • Numerous pores were formed in the diamond films during orientation growth. • Due to the effect of pores, the toughness values among three directions differ. [ABSTRACT FROM AUTHOR]

In order to realize the practical use of diamond as a semiconductor material, large-area single-crystal diamond wafers with uniform quality are required. Mosaic growth is an effective method to produce inch-grade single-crystal diamonds. However, the quality of the wafer is limited by the junction interface seriously, because cracking occurs easily due to the high internal stress. In this paper, the repetition growth method was adopted to grow mosaic splicing single-crystal diamond without polycrystalline diamond interface. The high-quality single crystal diamond slices were reduplicated by microwave plasma chemical vapor deposition (MPCVD). The substrates were obtained by cutting a piece of CVD diamond along a plane perpendicular to 〈001〉 (with a (100)-oriented surface). The evolution of the growth characteristics around the junction of the substrates at different stages was studied. The results show that the surface of the epitaxial layers gradually evolves from blurry terraces to a regular well-ordered step flow. When the substrates have the same deviation direction and the off-direction angles are within 3°, the junction of the substrates can connect smoothly. Raman mapping shows that there is a mixture of tensile stress and compressive stress near the junction. As the thickness of the epitaxial layer increases from 280 μm to 560 μm, the range of tensile stress near the joint area expands from 85 μm to 150 μm, the maximum tensile stress increases from 0.08 GPa to 0.16 GPa. In addition, the value of FWHM in the X-ray rocking curve is less than 2.80 cm−1 around the junction, which indicates good crystal quality. [Display omitted] • The evolution of growth characteristics around the junction in the mosaic diamond was studied. • The mosaic boundary evolved from blurry terraces to a well-ordered step flow and finally connected. • The lowest value of tensile stress near the joint area was reported as the film thickness increased. • The larger FWHM of Raman peak around the junction is caused by the increased tensile stress. • The "inherit" effect of NV content of the epitaxial layer was observed for the corresponding substrate. [ABSTRACT FROM AUTHOR]

To improve the transmittance of chemical vapor deposition (CVD) diamond, erbium(III) oxide (Er 2 O 3) antireflective films were deposited on CVD diamond substrates by radio frequency (RF) magnetron sputtering. Effects of deposition temperature on structure, chemical composition and properties of the samples were investigated. A strong correlation was observed between the deposition temperature and crystalline structure evolution of the Er 2 O 3 antireflective films. With rising deposition temperature, the deposition rate, grain size and surface roughness of the Er 2 O 3 antireflective films increased. Changes of composition and chemical bonding of the films were analyzed. Results showed that the amount of bonding between Er and O atoms surface as the temperature increased. The films were structured by amorphous, monoclinic and cubic phase, with preferential orientations of C-Er 2 O 3 {222} at deposition temperature increased to 400 °C. A thickness of 10 nm transition layer was observed between the Er 2 O 3 antireflective films and the CVD diamond substrates by transmission electron microscopy (TEM). Moreover, the transition layer feature primarily consisted of Er, O and C. The hardness and modulus of Er 2 O 3 antireflective films were increased for higher deposition temperature, which positively affects the IR transmittance and adhesion strength of the Er 2 O 3 antireflective films on CVD diamond substrates. • The maximum transmittance of Er 2 O 3 /diamond sample was 80% in 7–11 μm range. • Texturization of Er 2 O 3 film interface was studied by HRTEM. • The higher deposition temperature favors crystallization of Er 2 O 3 film. • This study meets the requirements of windows for infrared (IR) imaging systems coating in the LWIR range. [ABSTRACT FROM AUTHOR]

[Display omitted] • The La-doped Er 2 O 3 anti-reflection films was prepared by the power of magnetron sputtering. • The compound of La 2 O 3 formed along the grain boundary of the columnar crystal structure of the polycrystalline film. • The highest hardness and yield strength of the La-doped Er 2 O 3 film was two times higher than that of pure Er 2 O 3 film. • The transmittance of the La-doped Er 2 O 3 anti-reflection films only decreased 1% after erosion. The composition and microstructure consisting of anti-reflection films was obtained by the power of magnetron sputtering. X-ray photoelectron spectroscopy (XPS) and High-resolution transmission electron microscopy (HRTEM) provided evidence to support that the doping La element exists as oxide in the grain boundaries of the matrix Er 2 O 3 films. The undoped and La-doped Er 2 O 3 films show a columnar crystal structure of the main cubic (2 2 2) plane. Twinning and a large number of dislocations show up in the undoped Er 2 O 3 films due to the competitive growth of the columnar crystal. In addition, the La-doped Er 2 O 3 films show a lower roughness (RMS) value in comparison with undoped Er 2 O 3 films. The grain size of columnar crystals decreases significantly with increasing La concentration in the La-doped Er 2 O 3 films. The fine grains resulted in the La-doped Er 2 O 3 films developing high mechanical and impact resistance properties, with an increase in hardness from 12.6 ± 2.1 GPa to 26.1 ± 3.4 GPa and the eroding area rate decreasing from 38.9 % to 1.9 %. Moreover, the La-doped Er 2 O 3 anti-reflection films on the chemical vapor deposition (CVD) diamond substrate maintained 74 % transmittance in the long-wavelength infrared range of 8–12 μm after sand eroding. [ABSTRACT FROM AUTHOR]