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Owing to increased performance capabilities over their LED counterparts, Gallium Nitride (GaN) based Laser Diodes (LDs) are becoming more prevalent in several applications, including lighting, visible light communications, medical spectroscopy, and atom cooling. For many of these applications, a tunable, precise wavelength is necessary such that chromatic aberrations are minimized and that specific wavelengths with narrow linewidth can be utilized for atomic transitions or filtered communications systems. This paper discusses one method of achieving single-mode lasing operation in GaN LDs, namely the deeply-etched sidewall grating Distributed Feedback (DFB) LD. Optical characteristics of such devices will be discussed, as well as their feasibility for optical communications.

Over the past 20 years, research into Gallium Nitride (GaN) has evolved from LED lighting to Laser Diodes (LDs), with applications ranging from quantum to medical and into communications. Previously, off-the-shelf GaN LDs have been reported with a view on free space and underwater communications. However, there are applications where the ability to select a single emitted wavelength is highly desirable, namely in atomic clocks or in filtered free-space communications systems. To accomplish this, Distributed Feedback (DFB) geometries are utilised. Due to the complexity of overgrowth steps for buried gratings in III-Nitride material systems, GaN DFBs have a grating etched into the sidewall to ensure single mode operation, with wavelengths ranging from 405nm to 435nm achieved. The main motivation in developing these devices is for the cooling of strontium ions (Sr+ ) in atomic clock applications, but their feasibility for optical communications have also been investigated. Data transmission rates exceeding 1 Gbit/s have been observed in unfiltered systems, and work is currently ongoing to examine their viability for filtered communications. Ultimately, transmission through Wavelength Division Multiplexing (WDM) or Orthogonal Frequency Division Multiplexing (OFDM) is desired, to ensure that data is communicated more coherently and efficiently. We present results on the characterisation of GaN DFBs, and demonstrate their capability for use in filtered optical communications systems.

We have realised InGaN/GaN distributed feedback laser diodes emitting at a single wavelength in the 42X nm wavelength range. Laser diodes based on Gallium Nitride (GaN) are useful devices in a wide range of applications including atomic spectroscopy, data storage and optical communications. To fully exploit some of these application areas there is a need for a GaN laser diode with high spectral purity, e.g. in atomic clocks, where a narrow line width blue laser source can be used to target the atomic cooling transition. Previously, GaN DFB lasers have been realised using buried or surface gratings. Buried gratings require complex overgrowth steps which can introduce epi-defects. Surface gratings designs, can compromise the quality of the p-type contact due to dry etch damage and are prone to increased optical losses in the grating regions. In our approach the grating is etched into the sidewall of the ridge. Advantages include a simpler fabrication route and design freedom over the grating coupling strength.Our intended application for these devices is cooling of the Sr+ ion and for this objective the laser characteristics of SMSR, linewidth, and power are critical. We investigate how these characteristics are affected by adjusting laser design parameters such as grating coupling coefficient and cavity length.

Gallium nitride (GaN) laser diodes are becoming popular sources not only for lighting but for applications ranging from communications to quantum. This paper presents the use of a commercial, off-the-shelf laser diode, with an emission wavelength of 450 nm, for visible light communication, both in free space and for underwater scenarios. Data rates up to 15 Gbit/s have been achieved by making use of orthogonal frequency division multiplexing (OFDM). In addition, distributed feedback (DFB) lasers have been realised emitting at a single wavelength which lend themselves towards applications where high spectral purity is crucial such as atomic clocks or filtered free space transmission systems. These devices have the grating structure etched into the sidewall of the ridge and work is ongoing to measure the linewidth of these lasers with the intended application of cooling Sr+ ions.

We report on the design, fabrication, and characterization of InGaN/GaN distributed feedback laser diodes emitting at a single wavelength around 430 nm. Third-order sidewall-etched gratings were used which have the advantage of a simple fabrication route with no need for overgrowth. We carried out waveguide modeling to find the effective modal indices of the grating and calculate the coupling coefficient. The laser ridge and the grating were formed by electron beam lithography followed by inductively coupled plasma etching. The as-cleaved lasers emitted in the pulsed regime with an SMSR of 22 dB and a peak single-mode output power of 40 mW. Slope efficiency was similar for both Fabry–Perot and DFB chips demonstrating that performance is not compromised by the addition of the grating.

We report on InGaN/GaN distributed feedback laser diodes with high order gratings emitting at a single wavelength around 428 nm. The 39th order notched gratings have the advantage of a simplified fabrication route with no need for overgrowth. The laser ridge and grating were formed by electron beam lithography followed by ICP etching. The as-cleaved lasers emitted in the pulsed regime with a peak single-mode output power of 15 mW. Optimization of the grating design should lead to higher power single wavelength operation.

We report on deeply etched sidewall grating DFB lasers in the InGaN/GaN material system emitting at a single wavelength around 434 nm. GaN lasers have a wide range of applications in communications, displays and storage. The availability of a single wavelength device with a good side mode suppression ratio (SMSR) would allow further applications to be addressed such as sources for laser cooling and Fraunhofer line operation for solar background free communications. Sidewall etched gratings have the advantage of fabrication with no need for overgrowth and have been demonstrated in a range of other material systems and wavelengths. Importantly for GaN based devices, this design has the potential to minimise fabrication induced damage to the epi structure. We investigated two laser designs, one with 80 % duty-cycle 3rd order gratings and another with 39th order partial gratings. Simulation of the 2D waveguide sections was carried out to find the optimal grating width. For fabrication, the laser ridge and gratings were patterned in a single step using electron beam lithography and ICP etched to a depth of 500 nm. Contact metal was deposited and the sample thinned and cleaved into 1 mm long cavities. The as-cleaved 3rd order lasers emit in the pulsed regime with a SMSR of 20 dB and a peak single-mode output power of 40 mW. The output power is similar to that of parallel processed FP lasers. The 39th order lasers also exhibit narrow spectral width at an output power of 10 mW.

The development of nanofabrication techniques for creating high aspect ratio (∼50:1) sub-10 nm silicon nanowires (SiNWs) with smooth, uniform, and straight vertical sidewalls using an inductively coupled plasma (ICP) etching process at 20 °C is reported. In particular, to improve the quality and flexibility of the pattern transfer process for high aspect ratio SiNWs, hydrogen silsesquioxane, a high-resolution, inorganic, negative-tone resist for electron-beam lithography has been used as both the resist for defining sub-10 nm patterns and the hard mask for etching the underneath silicon material. The effects of SF6/C4F8 gas flow rates, chamber pressure, platen power and ICP power on the etch rate, selectivity, and sidewall profile are investigated. To minimize plasma-induced sidewall damage, moderate plasma excitation power (ICP power of 600 W) and low ion energy (platen power of 6–12 W) were used. Using the optimized etch process at room temperature (20 °C), the authors have successfully fabricated sub-1...

This paper describes a robust process for the fabrication of highly doped Silicon-On-Insulator nanowires and devices. The process uses electron-beam lithography, lowdamage dry etch and controlled thermal oxidation to deliver consistent, reproducible and reliably nanowires of nominal widths from 100 nm down to sub-5 nm etched to a depth of 55 nm in silicon. Initial electrical measurements indicate metallic behavior for the widest wires and below a particular width, the wires become depleted showing electrical behaviour consistent with Coulomb blockade at room temperature.