1. Adhesion Performance and Microscope Morphology of UV-Curable Semi-interpenetrated Dicing Acrylic PSAs in Si-Wafer Manufacture Process for MCP
- Author
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Ji-Won Park, Hyun-Joong Kim, Kyoung-Mahn Kim, Jong-Min Ryu, Hyung-Il Kim, and Seung-Woo Lee
- Subjects
chemistry.chemical_classification ,Acrylate ,Materials science ,Surfaces and Interfaces ,General Chemistry ,Polymer ,Surfaces, Coatings and Films ,chemistry.chemical_compound ,Monomer ,chemistry ,Mechanics of Materials ,Materials Chemistry ,Wafer dicing ,Wafer ,Irradiation ,Adhesive ,Composite material ,Acrylic acid - Abstract
UV-curable acrylic pressure-sensitive adhesives (acrylic PSAs) have many applications in industry. As the Si-wafers become thinner, the acrylic PSAs for MCP need to show proper adhesion and leave little residue on the Si-wafer after UV irradiation when released from the dicing tapes. Strong adhesion is required in the dicing process to hold the Si-wafer before UV irradiation. On the other hand, weak adhesion strength is required after UV irradiation to prevent damage to the Si-wafers during the pick-up process. This study employed semi-interpenetrating polymer network-structured dicing of acrylic PSAs in the Si-wafer manufacture process. The binder PSAs contained 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AA). The adhesion performance of the peel strength on a Si-wafer was examined as a function of the UV dose. The results showed that the abovementioned two requirements were achieved using semi-IPN dicing acrylic PSAs using a hexafunctional acrylate monomer and a UV-curing system. FE-SEM and XPS reve...
- Published
- 2012