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Vertical, gigapascal-level mechanical stress (MS) is induced at different locations along the channel of 40-nm effective gate length planar CMOS field-effect transistor (FET) devices and electrical parameter variations are investigated. In both p-and n-channel devices, the threshold voltage, mobility, and ON-current are seen to change proportionally with the additional MS, while gate-induced drain-leakage current increases exponentially. A clear effect of the location of the applied force along the source–drain direction is observed on the transistor parameters. Simulations show that a mechanical load located closer to the FET source induces a stronger asymmetry between the source and drain stresses. This leads to asymmetric subband splitting/warping, which reduces the backscattering rate at the source, in line with theoretical predictions on the importance of the channel barrier near the source for current in quasi-ballistic transistors. [ABSTRACT FROM AUTHOR]

Sequential 3-D stacking of multiple CMOS device tiers in a single fabrication flow requires the development of reliable high- ${k}$ /metal gate (HKMG) stacks at a reduced thermal budget (<525 °C). The omission of the customary high-temperature gate-stack annealing results in excessive dielectric defect densities. We have recently demonstrated on MOS capacitors the insertion of “defect decoupling” layers–LaSiOx for nMOS and Al2O3 for pMOS–at the interface between SiO2 and HfO2 as a promising approach to engineer the high- ${k}$ band lineup and minimize charge trapping for improved bias-temperature-instability (BTI) reliability. In this article, we demonstrate this approach in planar transistors, which allows assessing the impact of defect decoupling on carrier mobility. First, a comparative study on the impact of LaSiOx and Al2O3 insertion is performed, highlighting the different strategies for improving positive BTI (PBTI) and negative BTI (NBTI) reliability. Second, a comprehensive investigation on the effects of LaSiOx and Al2O3 insertion is conducted with a focus on BTI reliability and channel carrier mobility: a lack of penalty (Al2O3) or even improved carrier mobility (LaSiOx) is reported for the dipole-inserted gate stacks. Furthermore, we explore the simplified dual gate-stack integration for CMOS flow. A severe PBTI reliability penalty is observed if an Al2O3 layer (for hole trap decoupling) is deposited in the nMOS gate-stack, even if on top of the beneficial LaSiOx (for electron trap decoupling). In contrast, the pMOS gate-stack is found to be more tolerant to the presence of a residual LaSiOx layer on top of the beneficial Al2O3 layer, suggesting a viable strategy for the simplified dual gate-stack integration. Finally, the reliability improvement is validated also on a FinFET test vehicle. [ABSTRACT FROM AUTHOR]

We present time-zero characterization and an investigation on bias temperature instability (BTI) degradation between 4 and 300 K on large area high- ${k}$ CMOS devices. Our measurements show that negative BTI (NBTI) on pMOSFETs freezes out when approaching cryogenic temperatures, whereas there is still significant positive BTI (PBTI) degradation in nMOSFETs even at 4 K. To explain this behavior, we use an efficient implementation of the quantum mechanical nonradiative multiphonon charge trapping model presented in Part I and extract two separate trap bands in the SiO2 and HfO2 layer. We show that NBTI is dominated by defects in the SiO2 layer, whereas PBTI arises mainly from defects in the HfO2 layer, which are weakly recoverable and do not freeze out at low temperatures due to dominant nuclear tunneling at the defect site. [ABSTRACT FROM AUTHOR]

This paper presents a physically unclonable function (PUF) based on the randomness of soft gate oxide breakdown (BD) locations in MOSFETs, namely, soft-BD PUF. The proposed PUF circuit features a self-limiting mechanism that generates exactly one soft-BD spot in a pair of NMOS transistors. Highly stable “0” and “1” bits with an equal probability of 0.5 are extracted based on the locations of the generated BDs. A differential readout scheme is employed based on the proposed reference-free sense amplifier (SA), resulting in good current sensitivity and side-channel attack resilience. The soft-BD PUF, fabricated in a 40-nm CMOS process, comprises all essential periphery circuits. Measurements show that the soft-BD PUF has good data stability in a wide operating range. The native bit error rate is 0% for $V_{\text {DD}}=1\,\,\text {V}$ and above, shown by measuring 10k readout cycles among 10k PUF cells. Data stability degrades at lower supply voltage and higher temperature due to the conductivity of PUF cells and the offset of SAs. Under the nominal $V_{\textrm {DD}}$ of 0.9 V in this technology, the throughput is shown to be at least 40 Mb/s and the PUF readout consumes only 51.8 fJ/bit. The averaged hamming weight and hamming distance are 0.497 and 0.496, respectively, showing a good randomness and uniqueness. The resulting PUF data show good statistical properties by passing all the relevant tests in the NIST 800-22 suite. [ABSTRACT FROM AUTHOR]

Negative bias temperature instability (NBTI)-generated defects (GDs) have been widely observed and known to play an important role in device’s lifetime. However, its characterization and modeling in nanoscaled devices is a challenge due to their stochastic nature. The objective of this paper is to develop a fast and accurate technique for characterizing the statistical properties of NBTI aging, which can be completed in one day and thus reduce test time significantly. The fast speed comes from replacing the conventional constant voltage stress by the voltage step stress (VSS), while the accuracy comes from capturing the GDs without recovery. The key advances are twofold: first, we demonstrate that this VSS-GD technique is applicable for nanoscaled devices; second, we verify the accuracy of the statistical model based on the parameters extracted from this technique against independently measured data. The proposed method provides an effective solution for GD evaluation, as required when qualifying a CMOS process. [ABSTRACT FROM PUBLISHER]

Continuing CMOS performance scaling requires developing MOSFETs of high-mobility semiconductors and InGaAs is a strong candidate for n-channel. InGaAs MOSFETs, however, suffer from high densities of border traps, and their origin and impact on device characteristics are poorly understood at present. In this paper, the border traps in nMOSFETs with an In0.53Ga0.47As channel and Al2O3 gate oxide are investigated using the discharging-based energy profiling technique. By analyzing the trap energy distributions after charging under different gate biases, two types of border traps together with their energy distributions are identified. Their different dependences on temperature and charging time support that they have different physical origins. The impact of channel thickness on them is also discussed. Identifying and understanding these different types of border traps can assist in the future process optimization. Moreover, border trap study can yield crucial information for long-term reliability modeling and device time-to-failure projection. [ABSTRACT FROM AUTHOR]

Positive charges (PCs) in gate dielectric shift the threshold voltage and cause a time-dependent device variability. To assess their impact on circuits, it is useful to know their distribution for a wide energy range both within and beyond silicon bandgap. Such a distribution is still missing, and a technique for its extraction has not been demonstrated yet. The central objective of this paper is, for the first time, to develop a new fast technique and to demonstrate its capability for probing the energy distribution of PCs over such a wide energy range. Results show that PCs can vary significantly with energy level. The PCs in different energy regions clearly originate from different defects. The PCs below the valence band edge are as-grown hole traps that are insensitive to stress time and temperature, and substantially higher in thermal SiON. The PCs above the valence-band edge are from created defects. The PCs within the bandgap have a peak near Ev + 0.8 eV and saturate for either longer stress time or higher stress temperature. In contrast, the PCs above a conduction band edge, namely the antineutralization positive charges, do not saturate, and their generation is clearly thermally accelerated. [ABSTRACT FROM AUTHOR]

We report extensive experimental results of the negative bias temperature instability (NBTI) reliability of SiGe channel pMOSFETs as a function of the main gate-stack parameters. The results clearly show that this high-mobility channel technology offers significantly improved NBTI robustness compared with Si-channel devices, which can solve the reliability issue for sub-1-nm equivalent-oxide-thickness devices. A physical model is proposed to explain the intrinsically superior NBTI robustness. [ABSTRACT FROM AUTHOR]

As the CMOS device dimensions shrink to nanometer scale, the time-dependent VTH variability (heteroskedasticity) becomes evident due to the reduced number of stochastically behaving traps in the gate oxide. Consequently, the bias temperature instability (BTI) lifetime of nanometer-sized devices can only be correctly described in the form of time- (or workload-) dependent distributions. This paper discusses a streamlined procedure to obtain BTI lifetime projections for nanometer-scaled devices from the combination of measurements of a small sample set of nanoscaled devices and several large area test devices. [ABSTRACT FROM AUTHOR]

One of the most important degradation modes in CMOS technologies, the bias temperature instability (BTI) has been known since the 1960s. Already in early interpretations, charge trapping in the oxide was considered an important aspect of the degradation. In their 1977 paper, Jeppson and Svensson suggested a hydrogen-diffusion controlled mechanism for the creation of interface states. Their reaction–diffusion model subsequently became the dominant explanation of the phenomenon. While Jeppson and Svensson gave a preliminary study of the recovery of the degradation, this issue received only limited attention for many years. In the last decade, however, a large number of detailed recovery studies have been published, showing clearly that the reaction–diffusion mechanism is inconsistent with the data. As a consequence, the research focus shifted back toward charge trapping. Currently available advanced charge-trapping theories based on switching oxide traps are now able to explain the bulk of the experimental data. We give a review of our perspective on some selected developments in this area. [ABSTRACT FROM PUBLISHER]

We present the first experimental report of dose-enhancement effects due to interconnects in deep-submicron CMOS, using ad hoc designed MOSFETs with different metal layouts. We demonstrate that the presence of metal-i tracks in the proximity of the device active areas may significantly modify the response to X-rays. The impact of the secondary electron emission from metal-1 layers is strongly dependent on the relative position to the transistor lateral isolation and LDD spacers. [ABSTRACT FROM AUTHOR]

We present new original experimental results on the effects produced by single heavy-ion strikes on minimum-size MOSFETs manufactured in a 0.1-μm CMOS technology. We show that, whereas large-width samples do not suffer from any particular degradation when struck by a single ion, minimum size devices, which are the real building block of modern digital circuits, display small but significant changes in the electrical characteristics. In particular, we identify and classify the different types of degradation occurring after irradiation with high-LET particles and attribute them to ion strikes occurring in different parts of the MOSFET: gate oxide, LDD spacers, and STI. Even though the observed changes do not compromise the device functionality, they clearly indicate that, as the feature size is scaled into the decananometer range, single heavy-ion strikes will have a growing effect on digital circuits. [ABSTRACT FROM AUTHOR]

Abstract: In deeply scaled CMOS technologies, Bias Temperature Instability (BTI) is one of the most critical degradation mechanisms impacting the device reliability. This study presents the BTI evaluation of gates covering both the PMOS and NMOS degradation in a workload dependent, atomistic trap-based, stochastic BTI model. The gate propagation delay depends on the gate intrinsic delay, the input signal characteristics, and the output load. In this paper, the impact of (1) duty factor, (2) periodic clock-based and non-periodic random input sequences, (3) gate, and (4) drive strength to the BTI degradation are investigated. Statistical studies show a mean degradation of 3% and a worst-case of 27%. Moreover, the near-critical paths with lower drive strength cells are 3.7× more susceptible to BTI degradation than the critical paths with higher drive strength cells. Next, the relative degradations of the propagation delays for the well-known gates (i.e. INV, NAND, NOR, AOI) are presented. Under the same stress stimuli, degradations of the gate propagation delays differ by 4.5×. [Copyright &y& Elsevier]