1. The Matrix Cracking Stress and Residual Thermal Stress of 2D SiC/SiC Composite Fabricated by PIP Process
- Author
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Hai Peng Qiu, Wei Jie Xie, Yan Yuan Liang, Bing Yu Zhang, Shan Hua Liu, Ling Wang, and Ming Wei Chen
- Subjects
010302 applied physics ,Materials science ,Composite number ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,Atomic and Molecular Physics, and Optics ,Stress (mechanics) ,Scientific method ,0103 physical sciences ,Residual thermal stress ,Thermal residual stress ,General Materials Science ,Composite material ,0210 nano-technology ,Matrix cracking - Abstract
A two dimensional silicon carbide fiber reinforced SiC matrix (2D SiC/SiC) composite fabricated by precursor infiltration pyrolysis (PIP) process used a liquid SiC ceramic precursor was obtained. Two key properties including matrix cracking stress and thermal residual stress were investigated for this PIP 2D SiC/SiC composites. Three methods were applied to determine the matrix cracking stress in order to obtained a trusted value, and the value of matrix cracking stress for SiC/SiC composite was 75±4 MPa. The thermal residual stress of the composites was calculated by linear regression line according to the loading-unloading-reloading stress-strain curve of the 2D SiC/SiC composite, and the result showed that the value of thermal residual stress of SiC matrix in composite was 20MPa, which means the PIP SiC matrix in the 2D SiC/SiC composite was under the compressive stress when the composite cooling down from the fabrication temperature to the room temperature.
- Published
- 2018
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