1. Microstructural studies of W–10wt.% Cu composites prepared by using ultrafine composite powder
- Author
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Yang Qi, Tinghui Zhang, Benzhe Sun, Yan Liu, Zhuang Zhigang, Mingjie Niu, Jiupeng Song, and Yang Yu
- Subjects
Pressing ,Thermal conductivity ,Materials science ,Residual stress ,Composite number ,Sintering ,High density ,Composite material ,Nanoscopic scale ,Grain size - Abstract
Tungsten–copper (W–Cu) composites containing 10 wt.% Cu (W–10Cu) were prepared by pressing and sintering a type of ultrafine composite powder. Constituent phases, grain size and orientation relationship between W and Cu grains were characterized and investigated. The results show that W–10Cu composites are composed of W and Cu elementary substance and orientation relationship between W and Cu grains is defined as 1 ¯ 1 ¯ 4 Cu / / 0 1 ¯ 1 W and (131)Cu//(200)W. The existence of the orientation relationship depends largely on the two factors. First, the grain sizes of both W and Cu were in the nanoscale range. Secondly, the interplanar spacing between both phases can match well owing to the residual stress of the W/Cu interface. Consequently, the obtained composites exhibited high density and excellent thermal conductivity.
- Published
- 2014