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We examined the slicing technique of silicon wafers with little kerf loss using an ultrafine wire tool. As the first step, we performed microgrooving with an ultrafine wire tool. The thinning of the wafer and the decrease in kerf loss can minimize production costs. We discuss the strength characteristics and the microgrooving performance of the ultrafine wire tool. The main results are as follows. The relative velocity greatly affects the grooving properties. The ultrafine wire tool easily breaks when the relative speed is high. When the ultrafine wire tool and abrasives with large diameter grains are used, the ultrafine wire easily breaks and chipping in the work material easily occurs; furthermore, the ultrafine wire strays.