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This work investigates a composite prepared with polyester and hexagonal boron nitride (hBN) in terms of the properties required in the material for microelectronics applications. The influence of filler loading and the surface treatment of hBN with a silane coupling agent (γ‐aminopropyl triethoxy silane) is studied. It has been observed that the silane‐modified hBN improves the compatibility and adhesion with the matrix as verified by SEM images. The experimental investigation reveals that the addition of hBN in polyester unwillingly rises the density, voids content, and water absorption rate. Though, the increment is limited with surface‐modified hBN. The material's mechanical properties improve with filler loading over a particular range of filler loading. The material's thermal conductivity and glass transition temperature increase with hBN content, whereas the coefficient of thermal expansion reduces. Polyester when filled with 40 wt% of the silane‐hBN, the thermal conductivity improves around six times that of unfilled polyester. The dielectric properties are marginally augmented with filler loading whereas, the increase in frequency results in the reduction of dielectric properties. It can be observed from the overall experimental analysis that the developed material can be used in different microelectronic applications. Highlights: A new class of composite is developed with polyester and raw/modified hBN.Composite with modified hBN shows improved physical/mechanical properties.Thermal properties of polyester improved appreciably with treated hBN.The dielectric properties of composites remain well within the range.The fabricated composites are recommended for microelectronics applications. [ABSTRACT FROM AUTHOR]

Linz‐Donawintz (LD) slag is a solid waste produced during the basic oxygen furnace process of steel making and is more often disposed of on nearby land causing a disturbance in vegetation and human health. Hence, judicial management of LD slag is a need for an hour. For this purpose, the usability of LD slags as a reinforcement material in epoxy composites was investigated in the present work. In this investigation, the physical properties (density, void content, water absorption rate), mechanical properties (tensile properties, flexural properties, compressive strength, hardness), and tribological properties (sliding wear behavior) are reported. From the experimental investigation, it is found that the density, void content, and water intake capacity increase with LD slag loading. The maximum voids present in the composite is 1.92% for epoxy/40 wt. % LD slag composite. Similarly, maximum water uptake of only 0.6% is observed for composite with maximum filler content and for maximum immersion time. Further, it is observed that the strength of composite under tensile and flexural loading was compromised slightly. At 40 wt. % of LD slag, the measured tensile and flexural strength are 20.8 MPa and 28.78 MPa respectively. The strength of composites under compressive loading increases with filler content and reaches a maximum of 108 MPa for epoxy/40 wt. % LD slag composite. The high hardness of filler assists in increasing the hardness of the composites. The hardness of neat epoxy is Shore‐D number 75 which increases to Shore‐D number 84. With increased hardness, ultimately the specific wear rate under dry sliding conditions reduces. Taguchi's L25 orthogonal array having four factors, each at five different levels is implemented to conduct the sliding wear tests. A forecast model is built on an artificial neural network (ANN) which successfully envisages the sliding wear performance of the composite under investigation inside and outside the experimental domain. [ABSTRACT FROM AUTHOR]

In the present article, an investigation is presented on epoxy‐based composites where the discontinuous phases are microsized boron nitride and sisal fiber (SF). Both the reinforcing materials are surface modified before incorporating them into the epoxy matrix. Hexagonal boron nitride (hBN) surface is treated by silane‐coupling agent, whereas the aqueous NaOH solution is used to modify the surface of SF. The effect of fillers on the physical, mechanical, thermal, and dielectric properties of hybrid composites is studied through experimentation. The result shows that the inclusion of hBN increases the thermal conductivity of epoxy appreciably and dielectric constant marginally, while the inclusion of SF reduces the thermal conductivity marginally and dielectric constant appreciably. The maximum thermal conductivity of 1.88 W/m‐K is obtained for the combination of 30 wt% hBN and 3 wt% SF. For the same combination, the dielectric constant is 4.57 at 1 GHz, which is almost similar to neat epoxy. Also, other properties like compressive strength, hardness, glass‐transition temperature, and coefficient of thermal expansion improve when combinations of ceramic filler and natural fiber were incorporated in the epoxy matrix. Due to outstanding comprehensive properties, epoxy/hBN/SF composites found potential application in wide microelectronic applications. [ABSTRACT FROM AUTHOR]

Physical, mechanical, thermal, and dielectric behavior of surface modified hexagonal boron nitride (hBN) in epoxy matrix was investigated in this paper. Effective treatment of microsize boron nitride involved silane coupling agent, (γ‐aminopropyl)triethoxysilane such that the coating resulted from the treatment amounted to 2% of the weight of silane coupling agent of the treated BN. The present work revealed that the chemical treatment of BN surface could effectively enhance the adhesion between matrix and filler material. The dispersion and wettability of the BN powder in epoxy matrix after surface treatment were improved. These imparted improved physical and excellent mechanical and thermal properties to the developed material. The experimental study on thermal properties of fabricated composites indicated that incorporation of modified particles exhibits improved glass transition temperature. As filler loading increases, coefficient of thermal expansion of composite decreases which further decreases when treated filler were used. Further, appreciable improvement in thermal conductivity is obtained when treated hBN is used in place of untreated one. The dielectric properties are investigated for wide frequency range and filler content and found to be increased with hBN content and decrease with frequency enhancement. Furthermore, mechanical properties of such composites were also largely enhanced when treated fillers were used. With modified properties, the presently developed material is suitable for microelectronic applications. [ABSTRACT FROM AUTHOR]

Kota stone dust (KSD) and fly ash (FA) are the wastes generated from the construction industry and thermal power plant, respectively. In the present work, a novel hybrid composite is developed to utilize KSD and FA as reinforcing phases in the epoxy matrix. The hand lay‐up method is adopted for the fabrication of 12 sets of samples. Four sets are prepared with single filler KSD and eight samples are prepared with a hybrid combination of KSD and FA. The prepared samples are undergone physical and mechanical tests. To understand the compatibility between filler‐matrix and visualize the dispersion of fillers in epoxy, micrographs are taken using the scanning electron microscope. The density and void contents of the material increases with an increase in filler content. The maximum water absorption measured is 0.96% for the combination of epoxy with 40 wt% KSD and 10 wt% FA. From mechanical testing, maximum tensile strength and flexural strength obtained is 34.4 MPa and 65.4 MPa, respectively, for a combination of epoxy with 20 wt% KSD and 5 wt% FA. Compressive strength and hardness increase with either of the content of the filler and reaches 116.28 MPa and 104 Shore D number, respectively, with 40 wt% KSD and 10 wt% FA. From experimentation, it was found that mechanical properties of the hybrid composites are better as compared to that of single filler composites though physical properties are slightly compromised by hybridization of fillers. [ABSTRACT FROM AUTHOR]