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Your search keyword '"Tilmant, Pascal"' showing total 2 results
Start Over Author "Tilmant, Pascal" Topic compound semiconductor
2 results on '"Tilmant, Pascal"'

1. Air-bridge interconnection and bondpad process for non-planar compound semiconductor devices

Author

Ulliac, Gwenn, Garidel, Sophie, Vilcot, Jean-Pierre, and Tilmant, Pascal

Subjects
*SEMICONDUCTORS, *SEMICONDUCTOR industry, *CRYSTALS, *ELECTRIC conductivity
Abstract

Abstract: We present a versatile metallic air-bridge process that can be used either for high relief compound semiconductor devices or interconnections schemes. Our technology uses conventional contact photolithography and does not require dry-etching techniques allowing a fast fabrication time, reliable production and cost effectiveness. It is based on the use of only one photoresist and one electroplating step. [Copyright &y& Elsevier]

Published
2005
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2. Versatile bondpad report process for non-planar compound semiconductor devices

Author

Garidel, Sophie, Vilcot, Jean-Pierre, Zaknoune, Mohammed, and Tilmant, Pascal

Abstract

We present a versatile bondpad report process that can be used either for high relief compound semiconductor devices or interconnection schemes. It is based on the use of two different polymers (photoresists) and one electroplating step. [Copyright &y& Elsevier]

Published
2004
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