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We review recent advances in the HgCdTe material quality and detector performance achieved at Teledyne using molecular beam epitaxy growth and the double-layer planar hetero-junction (DLPH) detector architecture. By using an un-doped, fully depleted absorber, Teledyne’s DLPH architecture can be extended for use in high operating temperatures and other applications. We assess the potential achievable performance for long wavelength infrared (LWIR) hetero-junction p-lightly-doped n or p-intrinsic-n (p-i-n) detectors based on recently reported results for 10.7 μm cutoff 1 K × 1 K focal plane arrays (FPAs) tested at temperatures down to 30 K. Variable temperature dark current measurements show that any Shockley–Read–Hall currents in the depletion region of these devices have lifetimes that are reproducibly greater than 100 ms. Under the assumption of comparable lifetimes at higher temperatures, it is predicted that fully-depleted background radiation-limited performance can be expected for 10-μm cutoff detectors from room temperature to well below liquid nitrogen temperatures, with room-temperature dark current nearly 400 times lower than predicted by Rule 07. The hetero-junction p-i-n diode is shown to have numerous other significant potential advantages including minimal or no passivation requirements for pBn-like processing, low 1/f noise, compatibility with small pixel pitch while maintaining high modulation transfer function, low crosstalk and good quantum efficiency. By appropriate design of the FPA dewar shielding, analysis shows that dark current can theoretically be further reduced below the thermal equilibrium radiative limit. Modeling shows that background radiation-limited LWIR HgCdTe operating with f/1 optics has the potential to operate within √2 of background-limited performance at 215 K. By reducing the background radiation by 2/3 using novel shielding methods, operation with a single-stage thermo-electric-cooler may be possible. If the background radiation can be reduced by 90%, then room-temperature operation is possible.

Alternate substrates for molecular beam epitaxy growth of HgCdTe including Si, Ge, and GaAs have been under development for more than a decade. MBE growth of HgCdTe on GaAs substrates was pioneered by Teledyne Imaging Sensors (TIS) in the 1980s. However, recent improvements in the layer crystal quality including improvements in both the CdTe buffer layer and the HgCdTe layer growth have resulted in GaAs emerging as a strong candidate for replacement of bulk CdZnTe substrates for certain infrared imaging applications. In this paper the current state of the art in CdTe and HgCdTe MBE growth on (211)B GaAs and (211) Si at TIS is reviewed. Recent improvements in the CdTe buffer layer quality (double crystal rocking curve full-width at half-maximum ≈ 30 arcsec) with HgCdTe dislocation densities of ≤106 cm−2 are discussed and comparisons are made with historical HgCdTe on bulk CdZnTe and alternate substrate data at TIS. Material properties including the HgCdTe majority carrier mobility and dislocation density are presented as a function of the CdTe buffer layer quality.

This paper correlates measurements of minority carrier lifetime using photoconductivity transient or photoconductive decay (PCD) with measurements and analysis of current–voltage (I–V) on P + n photodiodes of the same layer. This analysis is done at the primary temperature of operation near 77 K. Measurements of minority carrier lifetime in n-type molecular beam epitaxy Hg1−x Cd x Te (MCT) on variable substrates of GaAs and CdZnTe are presented. The minority carrier lifetime from I–V analysis of P + n long-wave infrared (LWIR) photodiodes on CdZnTe (CZT) and GaAs substrates is similar to PCD analysis. Deviations occur for MCT/GaAs in the low-temperature extrinsic region associated with Shockley–Read–Hall (SRH) at 78 K in contrast to MCT/CZT at similar temperatures. The x-values in the formula Hg1−x Cd x Te for samples grown on CdZnTe and GaAs are 0.22 and 0.235, respectively. I–V analysis of variable-area LWIR photodiodes shows a calculated minority carrier diffusion coefficient of 2.3 cm2/s on lattice-matched CZT and 3 cm2/s on non-lattice-matched GaAs with diffusion lengths of approximately 24 μm and 20 μm, respectively.

The use of silicon as an alternative substrate to bulk CdZnTe for epitaxial growth of HgCdTe for infrared detector applications is attractive because of potential cost savings as a result of the large available sizes and the relatively low cost of silicon substrates. However, the potential benefits of silicon as a substrate have been difficult to realize because of the technical challenges of growing low-defect-density HgCdTe on silicon where the lattice mismatch is ∼19%. This is especially true for long-wavelength infrared (LWIR) HgCdTe detectors where the performance can be limited by the high (∼5 × 106 cm−2) dislocation density typically found in HgCdTe grown on silicon. The current status of LWIR (9 μm to 11 μm at 78 K) HgCdTe on silicon focal-plane arrays (FPAs) is reviewed. Recent progress is covered including improvements in noise equivalent differential temperature (NEDT) and array operability. NEDT of 99% are highlighted for 640 × 480 pixel, 20-μm-pitch FPAs.

It has been reported that the basic electrical properties of n-type long wave length infrared (LWIR) HgCdTe grown on silicon, including the majority carrier mobility (μ e) and minority carrier lifetime (τ), are qualitatively comparable to those reported for LWIR HgCdTe grown on bulk CdZnTe by molecular beam epitaxy (MBE). Detailed measurements of the majority carrier mobility have revealed important differences between the values measured for HgCdTe grown on bulk CdZnTe and those measured for HgCdTe grown on buffered silicon substrates. The mobility of LWIR HgCdTe grown on buffered silicon by MBE is reported over a large temperature range and is analyzed in terms of standard electron scattering mechanisms. The role of dislocation scattering is addressed for high dislocation density HgCdTe grown on lattice-mismatched silicon. Differences between the low temperature mobility data of HgCdTe grown on bulk CdZnTe and HgCdTe grown on silicon are partially explained in terms of the dislocation scattering contribution to the total mobility.

We used an InSb radiometric thermal imager to characterize the performance of 1″ × 1″ negative luminescent (NL) arrays. The devices grown on both CdZnTe (two arrays) and silicon (three arrays) as substrates have cut-off wavelengths ranging from 5.3 µm to 6.0 µm. The reverse-bias saturation current densities range from 0.3 A cm−2 (λco = 5.3 µm) to 1 A cm−2 (λco = 6.0 µm). The apparent array temperatures decrease by 37.9 K to 42.8 K under reverse bias, which corresponds to external NL efficiencies of 80–85%. Most of the inefficiency results from the non-ideal AR coating, whose reflectivity is ≈15% when weighted over the black body and atmospheric transmission spectra. It is highly encouraging that both the electrical and NL properties are slightly superior for the devices grown on silicon substrates.

The as-grown molecular beam epitaxy (MBE) (211)B HgCdTe surface has variable surface topography, which is primarily dependent on substrate temperature and substrate/epilayer mismatch. Nano-ripple formation and cross-hatch patterning are the predominant structural features observed. Nano-ripples preferentially form parallel to the \( [\bar {1}11] \) and are from 0 A to 100 A in height with a wavelength between 0.1 μm and 0.8 μm. Cross-hatch patterns result from slip dislocations in the three {111} planes intersecting the (211) growth surface. The cross-hatch step height is 4 ± 1 A (limited data set). This indicates that only a bi-layer slip (Hg/Cd + Te) in the {111} slip plane occurs. For the deposition of MBE (211)B HgCdTe/CdTe/Si, the reorientation of multiple nano-ripples coalesced into “packets” forms cross-hatch patterns. The as-grown MBE (211)B CdTe/Si surface is highly variable but displays nano-ripples and no cross-hatch pattern. Three types of defects were observed by atomic force microscopy (AFM): needle, void/hillock, and voids.

Preliminary results of a study of the hydrogenation of HgCdTe epilayers grown by molecular beam epitaxy on Si substrates using a glow-discharge plasma are presented. The aim of the program is to employ H to passivate the detrimental opto-electronic effects of threading dislocations present in the HgCdTe epilayers. Secondary ion mass spectroscopy depth profiling has been performed to characterize 1H and 2H incorporation. It has been found that H can be controllably incorporated in HgCdTe epilayers to levels in the 1014 cm−3 to 1018 cm−3 range while maintaining the sample at temperatures lower than 60°C. Profiles indicate that H accumulates in regions of known high defect density or in highly strained regions. Analysis of the H depth profile data indicates that the current density-time product is a good figure of merit to predict the H levels in the HgCdTe epilayer. There are progressive differences in the 1H and 2H uptake efficiencies as a function of depth. Magneto-Hall measurements show consistently higher mobilities at low temperatures for majority carriers in hydrogenated samples.

Characterization data are presented for arsenic-doped Hg1−xCdxTe epilayers, grown on CdZnTe substrates by molecular beam epitaxy. Arsenic incorporation is influenced both by the cracker-cell bulk temperature (As flux) and by the substrate surface temperature. An Arrhenius-type equation can be used to fit the As incorporation data, yielding characteristic energies of 1.54 and 6.61 eV for the As cell and HgCdTe surface temperatures, respectively, independent of alloy fraction. This relation allows significantly improved predictability and control in the As doping concentration. The effect of growth temperature on As incorporation is demonstrated using a multilayer test structure with composition stepped in a sequence, with x=0.6, 0.45, 0.3, 0.2, of n-type material, followed by the reverse sequence of As-doped material, with the As cell temperature held constant. Secondary ion mass spectroscopy profiles of this layer again indicate the strong As incorporation dependence on growth temperature. Composition profiles for as-grown and annealed pieces of the multilayer sample show greater interdiffusion for the As-doped region as compared to the undoped region, which is attributed to the Fermi-level enhancement effect.

We have fabricated a series of 256 pixel×256 pixel, 40 µm pitch LWIR focal plane arrays (FPAs) with HgCdTe grown on (211) silicon substrates using MBE grown CdTe and CdSeTe buffer layers. The detector arrays were fabricated using Rockwell Scientific’s double layer planar heterostructure (DLPH) diode architecture. The 78 K detector and focal plane array (FPA) performance are discussed in terms of quantum efficiency (QE), diode dark current and dark current operability. The FPA dark current and the tail in the FPA dark current operability histograms are discussed in terms of the HgCdTe epitaxial layer defect density and the dislocation density of the individual diode junctions. Individual diode zero bias impedance and reverse bias current-voltage (I-V) characteristics vs. temperature are discussed in terms of the dislocation density of the epitaxial layer, and the misfit stress in the epitaxial multilayer structure, and the thermal expansion mismatch in the composite substrate. The fundamental FPA performance limitations and possible FPA performance improvements are discussed in terms of basic device physics and material properties.

Variable magnetic field Hall and transient photoconductance lifetime measurements were performed on a series of undoped, In-doped, and As-doped HgCdTe samples grown by molecular beam epitaxy and metalorganic chemical vapor deposition. Temperature variation and, in the case of Hall, magnetic-field variation are needed to give a more complete picture of the mechanisms that control lifetimes in HgCdTe samples. Recent predictions of recombination lifetimes from full band structure calculations were compared to experimental lifetimes at various doping levels at long-wave infrared (LWIR) and mid-wave infrared (MWIR) compositions. For n-type material, lifetimes from low doping levels fall well below the predictions, implying that Shockley-Read-Hall (SRH) recombination is still dominant. MWIR samples have a lifetime that increases somewhat with carrier concentration, suggesting that In doping passivates the SRH defects for that composition. Lifetimes in p-type MWIR material appear to be well-explained by recent theoretical calculations. In p-type material, trapping states may be introduced during the incorporation and activation of As, since some samples with unusually long lifetimes had a distinctly different type of temperature dependence.

Growth of Hg1−xCdxTe by molecular beam epitaxy (MBE) has been under development since the early 1980s at Rockwell Scientific Company (RSC), formerly the Rockwell Science Center; and we have shown that high-performance and highly reproducible MBE HgCdTe double heterostructure planar p-on-n devices can be produced with high throughput for various single- and multiplecolor infrared applications. In this paper, we present data on Hg1−xCdxTe epitaxial layers grown in a ten-inch production MBE system. For growth of HgCdTe, standard effusion cells containing CdTe and Te were used, in addition to a Hg source. The system is equipped with reflection high energy electron diffraction (RHEED) and spectral ellipsometry in addition to other fully automated electrical and optical monitoring systems. The HgCdTe heterostructures grown in our large ten-inch Riber 49 MBE system have outstanding structural characteristics with etch-pit densities (EPDs) in the low 104 cm−2 range, Hall carrier concentration in low 1014 cm−3, and void density

The use of silicon as a substrate alternative to bulk CdZnTe for epitaxial growth of HgCdTe for infrared (IR) detector applications is attractive because of potential cost savings as a result of the large available sizes and the relatively low cost of silicon substrates. However, the potential benefits of silicon as a substrate have been difficult to realize because of the technical challenges of growing low defect density HgCdTe on silicon where the lattice mismatch is ∼19%. This is especially true for LWIR HgCdTe detectors where the performance can be limited by the high (∼5×106 cm−2) dislocation density typically found in HgCdTe grown on silicon. We have fabricated a series of long wavelength infrared (LWIR) HgCdTe diodes and several LWIR focal plane arrays (FPAs) with HgCdTe grown on silicon substrates using MBE grown CdTe and CdSeTe buffer layers. The detector arrays were fabricated using Rockwell Scientific’s planar diode architecture. The diode and FPA and results at 78 K will be discussed in terms of the high dislocation density (∼5×106 cm2) typically measured when HgCdTe is grown on silicon substrates.

We calculate the radiative, Auger, and the Shockley-Read-Hall recombination rates with Fermi-Dirac statistics and accurate band structures to explain the measured temperature dependence and doping dependence of minority carrier lifetimes in three n- and one p-type sample. We show that a trap state tracking the conduction band edge with very small activation energy can explain the lifetimes in the n-doped samples considered here. Similarly, for moderately p-doped HgCdTe alloy, a trap level at 75 meV is needed to explain the observed lifetimes. In either case, movement of Fermi level with respect to the trap level explains the temperature dependence of the lifetimes.

This paper reports the further development of the model for the analysis of FTIR transmission spectra from the dual-color Hg1−xCdxTe (MCT) structures for the constituent layer thickness and alloy composition. The previously reported model1 was shown to suffer from excessively high uncertainty in the provided individual layer thickness and low convergence rate for some types of structures, attributed primarily to inaccuracies in the model representation of the MCT dielectric function. Since last report, we have substantially improved the FTIR analysis accuracy by developing a better MCT dielectric function approximation, which is based on the interpolation of the measured spectroscopic ellipsometry (SE) experimental spectral dielectric functions at few discrete alloy compositions. Based on this, the optical model for graded layers was also created and calibrated against the traditional FTIR data reduction technique. The new model was shown to produce the most accurate fits to the experimental FTIR transmission spectra from single- and two-color detector structures, and has demonstrated a better convergence rate. The new model was tested to predict both band cutoff wavelengths for the actual two-color MWIR/LWIR SUMIT detectors.15 We have demonstrated that the model prediction from as-grown structures was in good agreement with the actual two-color device data, as measured on performance evaluation chips (PECs), thus validating the modeling technique for routine postgrowth wafer screening.

We have initiated a joint effort to better elucidate the fundamental mechanisms underlying As-doping in molecular beam epitaxy (MBE)-grown HgCdTe. We have greatly increased the As incorporation rate by using an As cracker cell. With a cracker temperature of 700°C, As incorporation as high as 4×1020 cm−3 has been achieved by using an As-reservoir temperature of only 175°C. This allows the growth of highly doped layers with high quality as measured by low dislocation density. Annealing experiments show higher As-activation efficiency with higher anneal temperatures for longer time and higher Hg overpressures. Data are presented for layers with a wide range of doping levels and for layer composition from 0.2 to 0.6.

Variable magnetic-field Hall and transient photoconductance-lifetime measurements were performed on a series of undoped, In-doped, and As-doped HgCdTe samples grown by molecular beam epitaxy (MBE). Use of quantitative mobility-spectrum analysis (QMSA) combined with multiple carrier-fitting (MCF) techniques indicates that the majority of samples contain an interfacial n-type layer that significantly influences the interpretation of the electrical measurements. This n-type layer completely masks the high-quality electrical properties of undoped or low n-type In-doped HgCdTe, as well as complicating the interpretation of activation in As-doped p-type HgCdTe. Introduction of an intentional n-type background, typically created through doping with In to “recover” high mobility, is actually shown to increase the “bulk” layer conductivity to a level comparable to the interface layer conductivity. Photoconductance-lifetime measurements suggest that In-doping may introduce Shockley-Read-Hall (SRH) recombination centers. Variable-field Hall analysis is shown to be essential for characterizing p-type material. Photoconductance-lifetime measurements suggest that trapping states may be introduced during the incorporation and activation of As. Two distinctly different types of temperature dependencies were observed for the lifetimes of As-doped samples.

In the past several years, we have made significant progress in the growth of CdTe buffer layers on Si wafers using molecular beam epitaxy (MBE) as well as the growth of HgCdTe onto this substrate as an alternative to the growth of HgCdTe on bulk CdZnTe wafers. These developments have focused primarily on mid-wavelength infrared (MWIR) HgCdTe and have led to successful demonstrations of high-performance 1024×1024 focal plane arrays (FPAs) using Rockwell Scientific’s double-layer planar heterostructure (DLPH) architecture. We are currently attempting to extend the HgCdTe-on-Si technology to the long wavelength infrared (LWIR) and very long wavelength infrared (VLWIR) regimes. This is made difficult because the large lattice-parameter mismatch between Si and CdTe/HgCdTe results in a high density of threading dislocations (typically, >5E6 cm−2), and these dislocations act as conductive pathways for tunneling currents that reduce the RoA and increase the dark current of the diodes. To assess the current state of the LWIR art, we fabricated a set of test diodes from LWIR HgCdTe grown on Si. Silicon wafers with either CdTe or CdSeTe buffer layers were used. Test results at both 78 K and 40 K are presented and discussed in terms of threading dislocation density. Diode characteristics are compared with LWIR HgCdTe grown on bulk CdZnTe.

Hg1−xCdxTe is an important material for high-performance infrared detection for a wide spectral range, from 1.7 µm to beyond 14 µm. An accurate understanding of the relationship between optical absorption and bandgap energy of this semiconductor alloy is needed for pre-process layer screening, detector design, and interpretation of detector performance. There is currently a disparity among the infrared detector community in relating the optical absorption properties to HgCdTe alloy composition and bandgap energy. This disagreement may stem from a misunderstanding of absorption properties, where existing models were developed decades ago using either bulk material or material with nonuniform composition. In this work, we have initiated an investigation of the optical absorption properties of HgCdTe with uniform composition grown by molecular-beam epitaxy (MBE) with in-situ compositional control via spectroscopic ellipsometry. The absorption properties show unique characteristics in the bandtail region, with insignificant temperature dependence. The absorption properties above the bandgap suggest a hyperbolic bandstructure as opposed to the common assumption of a parabolic bandstructure. The temperature dependence of the bandgap energy shows good agreement to the commonly used expression developed previously by Hansen et al.

We report the development and fabrication of two-color mid-wavelength infrared (MWIR) and short-wavelength infrared (SWIR) HgCdTe-based focal-plane arrays (FPAs). The HgCdTe multilayers were deposited on bulk CdZnTe (ZnTe mole fraction ∼3%) using molecular beam epitaxy (MBE). Accurate control of layer composition and growth rate was achieved using in-situ spectroscopic ellipsometry (SE). Epilayers were evaluated using a variety of techniques to determine suitability for subsequent device processing. These techniques included Fourier transform infrared (FTIR) spectroscopy, Hall measurement, secondary ion mass spectroscopy (SIMS), defect-decoration etching, and Nomarski microscopy. The FTIR transmission measurements confirmed SE's capability to provide excellent compositional control with run-to-run x-value variations of ∼0.002. Nomarski micrographs of the as-grown surfaces featured cross-hatch patterns resulting from the substrate/epilayer lattice mismatch as well as various surface defects (voids and "microvoids"), whose densities ranged from 800-8,000 cm-2. A major source of these surface defects was substrate particulate contamination. Epilayers grown following efforts to reduce these particulates exhibited significantly lower densities of surface defects from 800-1,700 cm-2. Dislocation densities, as revealed by a standard defect-decoration etch, were 2-20 × 105cm-2, depending on substrate temperature during epitaxy. The FPAs (128 × 128) were fabricated from these epilayers. Preliminary performance results will be presented.

Hg1-xCdxTe is an important material for infrared (IR) detection applications where the bandgap of the alloy varies from semimetal to 1.4 eV. The large variation in bandgap energy with HgCdTe composition causes difficulty in controlling detector-cutoff wavelength, particularly for the long-wavelength IR and very-long-wavelength infrared (VLWIR, greater than 12 µm) spectral bands. Our ability to control the HgCdTe composition and compositional profile during growth by molecular beam epitaxy (MBE) is improved significantly by using automated feedback control from spectroscopic ellipsometry (SE) measurements, where the standard deviation in the error in composition has improved by a factor of 5, from σ = 0.0081 to σ = 0.0016. To improve our ability to predict cutoff wavelength from IR transmission measurements, we have used a model of the absorption in HgCdTe to revise our past empirical cutoff relationship to include the effect of compositional grading. We have achieved a mean detector-cutoff wavelength of 14.1 µm and standard deviation of σ = 0.25 µm for a series of 19 processed layers with a target cutoff of 14 µm. The excellent control in VLWIR detector cutoff we have observed is attributed to automated compositional control and an improved cutoff-prediction model.

State-of-the-art large-area photovoltaic (PV) detectors fabricated in HgCdTe grown by molecular beam epitaxy (MBE) have been demonstrated for the Crosstrack Infrared Sounder (CrIS) instrument. Large-area devices (1 mm in diameter) yielded excellent electrical and optical performance operating at 81 K for λc ∼ 15 µm, at 98 K for λc ∼ 9 µm, and λc ∼ 5-µm spectral cutoffs. Fabricated detectors have near-theoretical electrical performance, and Anti Reflection coated quantum efficiency (QE) is greater than 0.70. Measured average RoA at 98 K is 2.0E7 Ωcm2, and near-theoretical QEs greater than 0.90 were obtained on detectors with λc ∼ 5-µm spectral cutoffs. These state-of-the-art large-area PV detector results reflect high-quality HgCdTe grown by MBE on CdZnTe substrates in all three spectral bands of interest.

In the last few years Rockwell has developed a novel simultaneous unipolar multispectral integrated HgCdTe detector and focal plane array technology that is a natural and relatively straightforward derivative of our baseline double layer planar heterostructure (DLPH) molecular beam epitaxial (MBE) technology. Recently this technology was awarded a U.S. patent. This simultaneous unipolar multispectral integrated technology (SUMIT) shares the high performance characteristics of its DLPH antecedent. Two color focal plane arrays with low-1013 cm−2s−1 background limited detectivity performance (BLIP D*) have been obtained for mid-wave infrared (MWIR, 3–5 m) devices at T>130 K and for long-wave infrared (LWIR, 8–10 m) devices at T∼80 K.

A semi-empirical constraint to the thermodynamical model for growth of Hg1−xCdxTe (MCT) by molecular beam epitaxy is described. This constraint, derived by forcing the population of Hg atoms in a surface layer to be proportional to the HgTe fractional growth rate, can determine an optimal total growth rate for specific beam fluxes and substrate temperature. Utilizing improved growth conditions determined by this model has resulted in MCT layers with consistently lower visible defect density (e.g., voids). The majority of recent layers grown using the constrained conditions has achieved defect densities limited by the CdZnTe substrate. On the highest quality substrates, total defect densities have consistently been reduced to the 100–200 cm−2 range using the improved conditions for compositions x=0.2 to x=0.6. On more typical substrates, the total defect density is 1000–1500 cm−2. This compares with densities of 3000–5000+ cm−2 for old layers grown under non-optimized conditions. The density of voids has remained about the same upon using the improved conditions, and is determined primarily by the Te precipitate content of the substrate, but microdefect (hillock) density has been reduced by almost a factor of ten.

Very long wavelength infrared (VLWIR; 15 to 17 µm) detectors are required for remote sensing sounding applications. Infrared sounders provide temperature, pressure and moisture profiles of the atmosphere used in weather prediction models that track storms, predict levels of precipitation etc. Traditionally, photoconductive VLWIR (λc >15 µm) detectors have been used for sounding applications. However, photoconductive detectors suffer from performance issues, such as non-linearity that is 10X – 100X that of photovoltaic detectors. Radiometric calibration for remote sensing interferometry requires detectors with low non-linearity. Photoconductive detectors also suffer from non-uniform spatial optical response. Advances in molecular beam epitaxy (MBE) growth of mercury cadmium telluride (HgCdTe) and detector architectures have resulted in high performance detectors fabricated in the 15 µm to 17 µmm spectral range. Recently, VLWIR (λc ∼ 17 µm at 78 K) photovoltaic large (1000 µm diameter) detectors have been fabricated and measured at flux values targeting remote sensing interferometry applications. The operating temperature is near 78 K, permitting the use of passive radiators in spacecraft to cool the detectors. Detector non-AR coated quantum efficiency >60% was measured in these large detectors. A linear response was measured, while varying the spot size incident on the 1000 µm detectors. This excellent response uniformity, measured as a function of spot size, implies that low frequency spatial response variations are absent. The 1000 µm diameter, λc ∼ 17 µm at 78 K detectors have dark currents ∼160 µA at a −100 mV bias and at 78 K. Interfacing with the low (comparable to the contact and series resistance) junction impedance detectors is not feasible. Therefore a custom pre-amplifier was designed to interface with the large VLWIR detectors operating in reverse bias. A breadboard was fabricated incorporating the custom designed preamplifier interfacing with the 1000 µm diameter VLWIR detectors. Response versus flux measurements were made on the large VLWIR detectors and non-linearity

Long wavelength infrared molecular beam epitaxy (MBE) grown p-on-n Hg1−xCdxTe double layer planar heterostructure (DLPH) detectors have been characterized to determine the dominant mechanisms limiting their performance. Material defects have been identified as critical factors that limit 40K performance operability. This effort has concentrated on identifying microscopic defects, etch pit density (EPD) and relating these defects to the device performance. Visual inspection indicates defect densities as high as 105 per cm2 with a spatial extent as observed by atomic force microscope in the range of micrometers extending several micrometers beneath the surface. At high EPD values (greater than low 106 cm−2) zero bias resistance (R0) at 40K decreases as roughly as the square of the EPD. At 78K, however, measured R0 is not affected by the EPD up to densities as high as mid-106 cm−2. Visual defects greater than 2–3 µm than ∼2 µm in size (micro-void defects) result in either a single etch pit or a cluster of etch pits. Large variations in a cross-wafer etch pit distribution are most likely a major contributor to the observed large spreads in 40K R0. This study gives some insight to the present limitation to achieve higher performance and high operability for low temperature infrared applications on MBE grown HgCdTe material.

Excess low frequency noise is investigated for the first time in infrared MBE grown LWIR Hg1−xCdxTe double layer planar heterostructure (DLPH) detectors grown on lattice matched substrates. LWIR detectors having R0Aopt values at 40K in the 101–107 Θ-cm2 range have been characterized as a function of temperature between 120 and 20K. Detectors with R0Aopt≥103Θ-cm2 at 40K have theoretical diffusion limited performance down to 78K and detectors with R0Aopt ≥105 Θ-cm2 at 40K are within a factor of two of theoretical diffusion limited performance for T>65K. Activation energies extracted from noise (Vd=−100 mV) and dark current (Vd=−100 mV) vs temperature measurements were detector dependent. The activation energy for detectors with R0Aopt≈106 Θ-cm2 at 40K is ∼0.90*Eg to 0.99*Eg. The noise measured between 78 and 105K in the intermediate performance (R0Aopt∼103–104 Θ-cm2 at 40K) detectors are higher than the noise measured in the higher performance (R0Aopt∼105–107 Θ-cm2) detectors. In addition, the excess low frequency noise and the dark current at −100 mV in the intermediate and poor (R0Aopt∼101 Θ-cm2) performance detectors are temperature independent. For each detector measured, the activation energy extracted from noise (Vd=−100 mV) vs temperature measurements is equal to the activation energy extracted from the total dark current (Vd=−100 mV) vs temperature measurements. For different dark current mechanisms, the excess low frequency noise varies with temperature and also with area within statistical accuracy in the same manner as the total dark current through the detector. At 78K, the Tobin14 expression holds in the general sense for equal area detectors dominated by different current mechanisms and also for detectors with a wide range of implant dimensions (Aimp=3.85×10−7 cm2 to Aimp=6.25×10−4 cm2). Following measurements, the detectors were stripped of the passivation and overlaying metal layers and dressed by a defect etch to reveal defects in each detector. A correlation among noise, leakage current and defect type has been determined for each detector.

The current-voltage characteristics and quantum efficiencies of double layer planar heterostructure photodiodes were investigated. Results are reported on devices with cutoff wavelengths of 1.8, 2.4, and 3.3 µm. For these respective devices, the dominant currents for temperatures >250,>200,>150K are diffusion currents limited by shallow Shockley-Hall-Read (SHR) processes. The remarkable result is that the electrical and optoelectronic properties of these devices of diverse cut-off wavelength can be explained by simple models using independently measured layer parameters such as the minority carrier lifetimes. For all three cases, the analysis suggests that the same shallow (SHR) centers located at 78% of the energy gap are causing the observed effects. These traps located in then-type base of the device are not influenced by the magnitude of n-type doping and this observation was used to significantly improve the performance of the devices and validate the predictive capability of the models used in the analysis. The shallow centers appear to be process induced rather than grown-in. This assertion is based on the observation that changes in the annealing process led to an order of magnitude improvement in the minority carrier lifetime.

We report the results of in situ arsenic doping by molecular beam epitaxy using an elemental arsenic source. Single Hg1−xCdxTe layers of x ∼0.3 were grown at a lower growth temperature of 175°C to increase the arsenic incorporation into the layers. Layers grown at 175°C have shown typical etch pit densities of 2E6 with achievable densities as low as 7E4cm−2. Void defect densities can routinely be achieved at levels below 1000 cm−2. Double crystal x-ray diffraction rocking curves exhibit typical full width at half-maximum values of 23 arcsec indicating high structural quality. Arsenic incorporation into the HgCdTe layers was confirmed using secondary ion mass spectrometry. Isothermal annealing of HgCdTe:As layers at temperatures of either 436 or 300°C results in activation of the arsenic at concentrations ranging from 2E16 to 2E18 cm−3. Theoretical fits to variable temperature Hall measurements indicate that layers are not compensated, with near 100% activation after isothermal anneals at 436 or 300°C. Arsenic activation energies and 77K minority carrier lifetime measurements are consistent with published literature values. SIMS analyses of annealed arsenic doping profiles confirm a low arsenic diffusion coefficient.

The capability of growing state-of-the-art middle wavelength infrared (MWIR)-HgCdTe layers by molecular beam epitaxy (MBE) on large area silicon substrates has been demonstrated. We have obtained excellent compositional uniformity with standard deviation of 0.001 with mean composition of 0.321 across 1.5″ radii. R0A as high as 5 × 107 ω-cm2 with a mean value of 7 × 106 Θ-cm2 was measured for cut-off wavelength of 4.8 µm at 77K. Devices exhibit diffusion limited performance for temperatures above 95K. Quantum efficiencies up to 63% were observed (with no anti-reflection coating) for cut-off wavelength (4.8–5.4) µm @ 77K. Excellent performance of the fabricated photodiodes on MBE HgCdTe/CdTe/Si reflects on the overall quality of the grown material in the MWIR region.

Results are presented for minority carrier lifetime in n-type molecular beam epitaxy Hg1−xCdxTe with x ranging from 0.2 to 0.6. It was found that the lifetime was unintentionally degraded by post-growth annealing under Hg saturated conditions in a H2 atmosphere that was both time and temperature dependent. This effect was minimal or non-existent for x∼0.2 material, but very strong for x ≥ 0.3. Hydrogen was identified as responsible for this degradation. Identical annealing in a He atmosphere avoids this degradation and results in neartheoretical lifetime values for carrier concentrations as low 1 × 1015 cm−3 in ≥0.3 material. Modeling was carried out for x∼0.2 and x∼0.4 material that shows the extent to which lifetime is reduced by Shockley-Real-Hall recombination for carrier concentrations below 1 × 1015 cm−3, as well as for layers annealed in H2. It appears that annealing in H2 results in a deep recombination center in wider bandgap HgCdTe that lowers the lifetime without affecting the majority carrier concentration and mobility.

Mid wavelength infrared p-on-n double layer planar heterostructure (DLPH) photodiodes have been fabricated in HgCdTe double layers grown in situ by liquid phase epitaxy (LPE), on CdZnTe and for the first time on CdTe/sapphire (PACE-1). Characterization of these devices shed light on the nature of the material limits on device performance for devices performing near theoretical limits. LPE double layers on CdZnTe and on PACE-1 substrates were grown in a horizontal slider furnace. All the photodiodes are p-on-n heterostructures with indium as the n-type dopant and arsenic the p-type dopant. Incorporation of arsenic is via implantation followed by an annealing step that was the same for all the devices fabricated. The devices are passivated with MBE CdTe. Photodiodes have been characterized as a function of temperature. R0Aimp values obtained between 300 and 78K are comparable for the two substrates and are approximately a factor of five below theoretical values calculated from measured material parameters. The data, for the PACE-1 substrate, indicates diffusion limited performance down to 110K. Area dependence gives further indications as to the origin of diffusion currents. Comparable R0Aimp for various diode sizes indicates a p-side origin. R0A and optical characteristics for the photodiodes grown on lattice-matched CdZnTe substrates and lattice mismatched PACE-1 are comparable. Howover, differences were observed in the noise characteristics of the photodiodes. Noise was measured on 50 × 50 µm devices held under a 100 mV reverse bias. At 110K, noise spectrum for devices from the two substrates is in the low 10−15 A/Hz1/2 range. This value reflects the Johnson noise of the room temperature 1010 Ω feedback resistor in the current amplifier that limits the minimum measurable noise. Noise at 1 Hz, −100 mV and 120K for the 4.95 µm PACE-1 devices is in the 1–2 × 10−14 A/Hz1/2, a factor of 5–10 lower than previously grown typical PACE-1 n+-on-p layers. Noise at 120K for the 4.60 µm PACE-1 and LPE on CdZnTe was again below the measurement technique limit. Greatest distinction in the noise characteristics for the different substrates was observed at 163K. No excess low frequency noise was observed for devices fabricated on layers grown by LPE on lattice-matched CdZnTe substrates. Photodiode noise measured at 1Hz, −100 mV and 163K in the 4.60 µm PACE-1 layer is in the 1–2×10−13 A/Hz1/2, again a factor of 5–10 lower than previously grown PACE-1 n+-on-p layers. More variation in noise (4×10−13−2×10−12 A/Hz1/2) was observed for devices in the 4.95 µm PACE-1 layer. DLPH devices fabricated in HgCdTe layers grown by LPE on lattice-matched CdZnTe and on lattice-mismatched PACE-1 have comparable R0A and quantum efficiency values. The distinguishing feature is that the noise is greater for devices fabricated in the layer grown on lattice mismatched substrates, suggesting dislocations inherent in lattice mismatched material affects excess low frequency noise but not zero bias impedance.

The results of arsenic incorporation in HgCdTe layers grown by molecular beam epitaxy (MBE) are reported. Obtained results indicate that arsenic was successfully incorporated as acceptors in MBE-HgCdTe layers after a low temperature anneal. Secondary ion mass spectrometry and Hall effect measurements confirm that arsenic is incorporated with an activation yield of up to 100%. This work confirms that arsenic can be used as an effective dopant of MBE-HgCdTe after a low temperature annealing under Hg-saturated conditions.

The molecular beam epitaxy (MBE) growth technology is inherently flexible in its ability to change the Hg1−xCdxTe material’s bandgap within a growth run and from growth run to growth run. This bandgap engineering flexibility permits tailoring the device architecture to the various specific requirements. Material with active layer x values ranging from ∼0.198 to 0.570 have been grown and processed into detectors. This wide range in x values is perfectly suited for remote sensing applications, specifically the National Polar Orbiting Environmental Satellite System (NPOESS) program that requires imaging in a multitude of infrared spectral bands, ranging from the 1.58 to 1.64 µm VSWIR (very short wave infrared) band to the 11.5 to 12.5 µm LWIR (longwave infrared) band and beyond. These diverse spectral bands require high performance detectors, operating at two temperatures; detectors for the VSWIR band operate near room temperature while the SWIR, MWIR (mid wave infra red), LWIR and VLWIR (very long wave infrared) detectors operate near 100K, because of constraints imposed by the cooler for the NPOESS program. This paper uses material parameters to calculate theoretical detector performance for a range of x values. This theoretical detector performance is compared with median measured detector optical and electrical data. Measured detector optical and electrical data, combined with noise model estimates of ROIC performance are used to calculate signal to noise ratio (SNR), for each spectral band. The SNR are compared with respect to the meteorological NPOESS system derived focal plane. The derived system focal plane requirements for NPOESS are met in all the spectral bands.

This paper describes our progress to improve the material quality, reproducibility, and flexibility of molecular beam epitaxial (MBE) growth of HgCdTe. Data, statistics, and yields according to defined screen criteria are presented for n-type layer carrier concentration and mobility, void defect density, and dislocation density for more than 100 layers. Minority carrier lifetime data are also presented. Continued improvements in impurity reductiont have allowed us to achieve, for the first time, reproducible, low n-type carrier concentration in the mid-1014 cnr−3 range with high electron mobility. Data are presented that show that low dislocation density films are obtained for growth on CdZnTe substrates with a wide range of Zn concentration. Results are presented from a nine-growth run first pass success demonstration run to further assess material quality reproducibility and flexibility of wavelength band tuning. These results demonstrate the promising potential of MBE growth for flexible manufacturing of HgCdTe for infrared focal plane arrays.

Short wave infrared (SWIR) devices have been fabricated using Rockwell’s double layer planar heterostructure (DLPH) architecture with arsenic-ion implanted junctions. Molecular beam epitaxially grown HgCdTe/CdZnTe multilayer structures allowed the thin, tailored device geometries (typical active layer thickness was ∼3.5 µm and cap layer thickness was ∼0.4 µm) to be grown. A planar-mesa geometry that preserved the passivation advantages of the DLPH structure with enhanced optical collection improved the performance. Test detectors showed Band 7 detectors performing near the radiative limit (∼3-5X below theory). Band 5 detector performance was ∼4-50X lower than radiative limited performance, apparently due to Shockley-Hall-Read recombination. We have fabricated SWIR HgCdTe 256 × 12 × 2 arrays of 45 um × 45 µm detector on 45 µm × 60 µm centers and with cutoff wavelength which allows coverage of the Landsat Band 5 (1.5−1.75 µm) and Landsat Band 7 (2.08−2.35 µm) spectral regions. The hybridizable arrays have four subarrays, each having a different detector architecture. One of the Band 7 hybrids has demonstrated performance approaching the radiative theoretical limit for temperatures from 250 to 295K, consistent with test results. D* performance at 250K of the best subarray was high, with an operability of ∼99% at 1012 cm Hz1/2/W at a few mV bias. We have observed 1/f noise below 8E-17 AHz 1/2 at 1 Hz. Also for Band 7 test structures, Ge thin film diffractive microlenses fabricated directly on the back side of the CdZnTe substrate showed the ability to increase the effective collection area of small (nominally

This paper describes recent advances in MBE HgCdTe technology. A new 3 inch production molecular beam epitaxy (MBE) system, Riber Model 32P, was installed at Rockwell in 1994. The growth technology developed over the years at Rockwell using the Riber 2300 R&D system was transferred to the 32P system in less than six months. This short period of technology transfer attests to our understanding of the MBE HgCdTe growth dynamics and the key growth parameters. Device quality material is being grown routinely in this new system. Further advances have been made to achieve better growth control. One of the biggest challenges in the growth of MBE HgCdTe is the day-to-day control of the substrate surface temperature at nucleation and during growth. This paper describes techniques that have led to growth temperature reproducibility within + - 1°C, and a variation in temperature during substrate rotation within 0.5°C. The rotation of the substrate during growth has improved the uniformity of the grown layers. The measured uniformity data on composition for a typical 3 cm × 3 cm MBE HgCdTe/CdZnTe shows the average and standard deviation values of 0.229 and 0.0006, respectively. Similarly, the average and standard deviation for the layer thickness are 7.5 and 0.06 µm, respectively. P-on-n LWIR test structure photodiodes fabricated using material grown by the new system and using rotation during growth have resulted in high-performance (R0)A, quantum efficiency) devices at 77 and 40K. In addition, 128 × 28 focal plane arrays with excellent performance and operability have been demonstrated.

Extrinsic p-type doping of long wavelength infrared-HgCdTe double layer heterostructure for p-on-n device application requires good control of the p-type dopant, regardless of the doping technique. The approach is to place the electrical junction ahead of the compositional interface, thus avoiding quantum efficiency reduction. This research addresses the As and P doping of HgCdTe by an implant/diffusion process. The data demonstrates an enhanced atomic diffusion process for As and P from an ion implanted source, within the single phase domain, with a diffusion rate orders of magnitude higher than the rate under Hg-saturated conditions at the same temperature. This work also reveals a new phenomenon, namely, a transition in the enhanced diffusion of both As and P from an exponential to a Gaussian redistribution. This transition is controlled by temperature at a given PHg. Gaussian diffusion dominates at high temperatures, T >400°C. The diffusion coefficient of the Gaussian mechanism decreases as the PHg increases, from Dp ~2 x 10-11 cm2/s at PHg ~0.02 atm to Dp ~3 x 10-14 cm2/ s under Hg-saturated conditions (quartz ampoule) at 440°C. The difference in the diffusion coefficients between open tube and closed tube (quartz ampoule), under nominally Hg-saturated conditions, indicates that PHg is undersaturated regardless of the Hg-source proximity. The deviation of PHg from saturation is estimated from the annealing furnace temperature profile up to a maximum of 50%. Variation of the diffusion coefficient close to Hg saturation appears to be sharply dependent on the actual PHg value (example: Dp ~1 x 10-12 cm2/s in open-tube anneal vs Dp ~3 x 10-14 cm2/s in closed tube at nominally the same temperature, T = 440°C). Comparative anneals of As and P showed faster diffusion rates for P than for As in both mechanisms.

P-on-n mercury cadmium telluride (MCT) heterostructures grown by MOCVD with As and In as n- and p-type dopants, respectively, are examined by measuring the Seebeck and Hall coefficients between 20 and 320K. The results are analyzed regarding doping and composition of the layers by least squares fitting the experimental profiles with the calculated temperature dependencies. The electron and hole densities of the layers are calculated taking into account Fermi-Dirac statistics, a nonparabolic conduction band, a parabolic valence band, a discrete acceptor level, and fully ionized donors. For the Seebeck coefficient, the relation we previously showed to be valid for p-type MCT is used. This relation relies on the thermoelectric effect in a temperature gradient resulting from the diffusion of nondegenerate carriers scattered by LO-phonons. lt also fits the observed thermoelectric properties of n-type MCT in a wide temperature range. The doping and structural parameters determined from the t hermoelectric measurements agreed very well with As and In profiles obtained from secondary ion mass spectroscopy measurements and the data obtained from analyses of infrared transmission measurements.

Etch pit density and spatial compositional uniformity data are presented for organometallic vapor phase epitaxial Hg1−x Cdx Te grown by the direct alloy and interdiffused growth methods. For alloy growth, composition variation is as low as Δx=0.004 and 0.02 over 2- and 3-in diam areas, respectively; while for growth on CdZnTe substrates, etch pit density values lower than 2×105 cm−2 have been achieved. For interdiffused growth on CdZnTe, etch pit density values lower than 5×105 cm−2 have been obtained, while the composition variation is usually Δx≤0.004 and 0.014 over 2- and 3-in diam areas, respectively. Data demonstrate that the choice of particular CdZnTe substrate strongly affects the subsequent etch pit density measured in the layer. Reasonably uniform n-type doping over 3-in diam area using the source triethylgallium is also reported for both growth methods.

Using a double-modulation, infrared photoluminescence technique, the authors have examined a variety of long-wavelength, HgCdTe materials under development for focal-plane array applications. Near-bandgap photoluminescence was easily observed in 'good quality' HgCdTe at 77 K, and they demonstrate the feasibility of using this technique for routine characterization of HgCdTe prior to device processing. Information regarding minority carrier lifetime, compositional uniformity, and native defects is obtained from photoluminescence data.

The critical steps in the development of MOVPE for the fabrication of MCT focal plane arrays (FPAs) are outlined. Improved purity of the source organometallics has enabled background donor concentrations in the mid 1014 cm-3 to be achieved, together with controlled back doping with donors or acceptors. Large area alloy uniformity is possible by the interdiffused multilayer process (IMP). However, large FPAs will need to be grown onto Si substrates to avoid thermal stress on the hybridized structure. Preliminary results are presented on a 256*256 element MWIR array. Results are also presented on optical in situ monitoring that will form the basis of improved epitaxial control in the future.

Initial results using a valved Te source for molecular beam epitaxial growth of Hg1−xCdxTe are described. Unlike the case for a conventional Knudsen effusion cell where the flux is controlled primarily by temperature, flux from the valved source is controlled primarily by a variable orifice capable of good closure so that the cell temperature can be fixed at the operating temperature. Operating characteristics of the source are described, and include being able to nearly instantaneously change the flux magnitude at will. Using the source for HgCdTe growth has resulted in promising composition reproducibility improvement in initial growth runs.

The authors compare the material properties of conventional- and interdiffused-grown layers of Hg1-xCdxTe/GaAs grown by metalorganic chemical vapour deposition (MOCVD). These results are also compared with those of state-of-the-art LPE HgCdTe/CdZnTe grown from Te-rich solutions. Data are presented on surface morphology, compositional uniformity, double-crystal X-ray diffraction, chemical defect etching, Hall effect, minority carrier lifetime and laser-beam-induced current (LBIC) characterisation on (111)B, (221) and (100) orientations. The compositional uniformity is 3.3% for 3 in diameter HgCdTe/GaAs. The interdiffused growth method results in better compositional uniformity than the conventional method, while the structural quality of layers grown by both techniques is similar. Etch pit densities of (1-2)*106 cm-2 are routinely obtained for (111)B and (221) orientations, while values as low as 5*105 cm-2 have been occasionally observed. Initial data are also presented for HgCdTe layers grown on (100)GaAs/Si substrates.

Layers of epitaxial Hg1−xCdxTe have been grown by metalorganic chemical vapor deposition (MOCVD) on GaAs/Si substrates. Data is presented on surface morphology, compositional uniformity, double crystal x‐ray diffraction, chemical defect etching, laser beam induced current imaging, and Hall effect. Compositional uniformity is 6% for 3 in. diam areas and 0.6% for the interior 2 in. diam area. The material characteristics of these layers are in the range suitable for fabrication of infrared detectors. The material characteristics are compared with those of similar layers grown on bulk GaAs substrates.

Low-leakage high-performance photovoltaic detectors were fabricated from long-wavelength infrared (LWIR) HgCdTe epitaxial material grown by metal-organic chemical vapour deposition (MOCVD) on GaAs substrates. Layers were grown by two different MOCVD techniques, a conventional alloy growth and an interdiffused multiple-layer growth. MOCVD HgCdTe layers were characterised by background electron concentrations of (1-3)*1015 cm-3 with electron mobilities up to 200000 cm2 V-1 s-1 at 77 K. Surface and cross-section dislocation densities were 106-107 cm-2 and occasionally (4-5)*105 cm-2. GaAs substrates were (100) and (111B) misoriented towards 110. The layer structure in which the devices were fabricated consisted of an absorbing LWIR HgCdTe layer grown on a buffer of CdTe. A thin layer (1-2 mu m) of wide-band-gap HgCdTe was grown last. Devices were fabricated in a single as well as double layers using a mesa geometry with a native oxide passivation. Junctions were formed at 2-3 mu m depth by a low-energy arsenic implant ( approximately 100 keV) which behaved as a finite diffusion source during the post-implant anneal. The best measured zero-bias resistance-area products (R0A) at 77 K were 1.67 Omega cm2 for the alloy layers for a cut-off wavelength of lambda c=14.94 mu m and 7.22 Omega cm2 for the interdiffused multiple layers for lambda c=15.92 mu m at 77 K. The results indicated a definite device performance improvement in double-layer compared to single-layer structures. Analysis of the transport properties for a device fabricated in a single layer with a cut-off wavelength of lambda c=8.35 mu m at 77 K and 9.1 mu m at 40 K suggested that the deviation from thermal processes occurs at temperatures of approximately 40 K.

SIMS has been used on both unimplanted and B‐ion implanted LPE grown HgCdTe to study the distribution of the Li impurity background. In unimplanted layers Li decorates some types of crystal defects and also reflects the p/n distribution in the layer. In implanted layers Li decorates the implantation‐induced damage and also reveals the junction region. Ion‐implanted junctions have been evaluated by Hall, differential Hall, EBIC, C–V, and TEM techniques and the results correlated with the features exhibited by the Li distribution. The Li distribution analysis reinforces our previous understanding that implanted junctions are several microns deep, n+/p−, graded in the p region and formed by implant‐induced native donors.

We compare the material properties of Hg 1- x Cd x Te grown by conventioanal organometallic vapor phase epitaxy (OMVPE) with those obtained interdiffused multilayer OMVPE. Both are compared with material properties of state-of-the-art LPE Hg 1- x Cd x Te grown from Te-rich solutions. The Hg 1- x Cd x Te layers were grown on bulk CdTe, sapphire (Al 2 O 3 ) and GaAs substrates. Layers were characterized by optical microscopy, IR transmission, Hall effect, double crystal X-ray diffraction, electron microprobe and secondary ion mass spectroscopy (SIMS). Better crystallinity and smoother morphologies are obtained by conventional OMVPE; interdiffused multilayer OMVPE currently results in better compositional uniformity and reproducibility. The observed differences can be interpreted on the basis of growth kinetics. Both techniques yield Hg 1- x Cd x Te epitaxial layers with LPE-like qualities.

The imaging cathodoluminescence capability of a scanning electron microscope (SEM) was complemented by etch pit (EP) measurements and secondary ion mass spectroscopy (SIMS) to characterize structures of HgCdTe LPE grown both on CdTe and CdTe/sapphire (PACE‐1) (Ref. 1: W. E. Tennant, IEDM Technical Digest 1983, 704) substrates. In addition to providing the source for luminescence, the high‐power‐density SEM beam was exploited to perform in situ annealing which improved the CL efficiency and aided in the analysis. Selected CL/SEM data are shown for substrates, epilayers and interfaces. CdTe Bridgman grown substrates exhibited defect structures (twins, dislocations, precipitates, subgrain structure) and substantial differences in CL efficiency and response to electron beam (EB) annealing. Cd annealing of Bridgman substrates increases CL efficiency, removes sensitivity to EB annealing, and causes impurity redistribution as measured by SIMS. PACE‐1 substrates show higher defect density, an absence of subgrains...

A melt-mixing LPE growth technique to obtain a graded composition AlxGa1−xAs layer is described. The graded bandgap AlGaAs/GaAs solar cell requires the Al fraction (x) in the AlxGa1−xAs surface layer to increase from the junction towards the surface. The graded composition AlxGa1−xAs layer creates a built-in electric field for minority carriers which improves the carrier collection process. This graded bandgap solar cell should enable one to realize the full potential of GaAs as a material for solar energy conversion. Quantitative evaluation of the composition profile for these graded layers is needed to develop the proper growth technique and to understand the resulting solar cell characteristics. Rutherford backscattering analysis technique is described which has been successfully used to profile such layers.