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Compact solid‐state refrigeration systems that offer a high specific cooling power and a high coefficient of performance (COP) are desirable in a wide range of applications where efficient and localized heat transfer is required. Here, a double‐unit electrocaloric (EC) polymer‐based refrigeration device with high intrinsic thermodynamic efficiency is demonstrated using a flexible EC polymer film with improved performance by doping plasticizer and an electrostatic actuation mechanism. The double‐unit refrigeration device achieves a large temperature span of 4.8 K, which is 71% higher than that of the single‐unit device. A specific cooling power of 3.6 W g−1 and a maximum COP of 8.3 for the cooling device are produced. The surface temperature of a central processing unit (CPU) cooled by an active EC device is 22.4 K lower than that of the CPU cooled in air. The highly efficient and compact EC cooling device demonstrated here not only leapfrogs the performance of existing solid‐state cooling technologies, but also brings solid state cooling closer to reality for a variety of practical applications that require compact or mechanically flexible refrigeration. [ABSTRACT FROM AUTHOR]

The availability and the high-efficiency of the device for cooling the central processing unit provides a unique option for thermal management of microcircuits in the future. Electrocaloric effect, electrostatic actuating, high efficiencies, microelectronics cooling, solid-state cooling Keywords: electrocaloric effect; electrostatic actuating; high efficiencies; microelectronics cooling; solid-state cooling EN electrocaloric effect electrostatic actuating high efficiencies microelectronics cooling solid-state cooling 1 1 1 04/10/21 20210408 NES 210408 In article number 2003771, Rujun Ma and co-workers report a highly efficient double-unit solid-state refrigeration device based on two-layer modified electrocaloric polymer stacks actuated by electrostatic forces. [Extracted from the article]