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AMD's 6th generation “Carrizo” APU, targeted at 12–35 W mobile computing form factors, contains 3.1 billion transistors, occupies 250.04 mm $^{2}$ and is implemented in a 28 nm HKMG planar dual-oxide FET technology with 12 metal layers. The design achieves a 29% improvement in transistor density compared to the 5th generation “Kaveri” APU, also a 28 nm design, and implements several power management features resulting in area and power improvements similar to a technology shrink. Increased power density makes meeting the thermal limits required for reliability and power distribution to the APU's processors substantial design challenges. Pre-silicon thermal analysis is used to understand and take advantage of thermal gradients. Adaptive voltage-frequency scaling in the processor core as well as wordline and bitline assist techniques in the L2 cache enable lower minimum voltage requirements.

Codenamed “Zen”, AMD's next-generation, high-performance ×86 core targets server, desktop, and mobile client applications. Utilizing Global Foundries' energy-efficient 14nm LPP FinFET process, the 44mm2 Zen core complex unit (CCX) has 1.4B transistors and contains a shared 8MB L3 cache and four cores (Fig. 3.2.7). The 7mm2 Zen core contains a dedicated 0.5MB L2 cache, 32KB L1 data cache, and 64KB L1 instruction cache. Each core has a digital low drop-out (LDO) voltage regulator and digital frequency synthesizer (DFS) to independently vary frequency and voltage across power states.

This paper describes key circuit innovations in a new x86-64 micro-architecture AMD code-named “Bulldozer” , . It is implemented in 32 nm high-K metal gate SOI CMOS. It occupies 30.9 mm-2, contains 213 million transistors, reduces the number of F04 gates per cycle by more than 20% compared to a previous processor in the same technology , and demonstrates superior frequency scaling across voltage. The module includes two independent integer cores but shares the fetch, decode, floating-point, and L2 cache units to maximize single-threaded performance and multi-threaded throughput while significantly improving power and area efficiency compared to fully replicated CPU cores. The design includes a new soft-edged flop (SEF) family to enable high frequency and low power. Achieving power efficiency in combination with high-frequency design is a particular challenge, and this paper describes several of the unique approaches to power optimization that have been employed in the design. The gate-count reduction and power optimization enable faster frequencies in the same power envelope compared to previous designs.

AMD's 2-core “Bulldozer” module contains 213 million transistors in an 11-metal layer 32nm HKMG SOI CMOS process and is designed to operate from 0.8 to 1.3V. This new micro-architecture [1] improves performance and frequency while reducing area and power compared to a previous AMD x86–64 CPU in the same process [2]. To achieve these goals, the design reduced the number of FO4 inverter delays/cycle by more than 20%, achieving higher frequencies in the same power envelope even with increased core counts. The 2-core CPU module area (including 2MB L2 cache) is 30.9mm2 (Fig. 4.5.7).