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Revealing the ductile deformation mechanisms of ultra-hard brittle cubic silicon carbide (3C-SiC), as well as their correlations with microstructure evolution, are crucial for facilitating the ductile machinability of the ceramic material. In the present work, we report the formation of highly oriented high density stacking faults accompanied with suppressed amorphization and cracking in polycrystalline 3C-SiC in ultrasonic elliptical vibration-assisted diamond cutting, which contributes to significantly enhanced ductile material removal of the ceramic material compared to ordinary cutting. Specifically, characterizations of Raman spectroscopy on machined surface and cross-sectional transmission electron microscopy on subsurface, as well as molecular dynamics simulations of the two kinds of cutting processes, are jointly performed to elucidate the mechanisms of phase transformation and microstructure evolution that govern the ductile material removal of polycrystalline 3C-SiC under the vibration assistance. In particular, the formation mechanisms of highly oriented high density stacking faults emitted from grain boundaries are revealed. Current findings provide insights into the ductile deformation behavior of hard brittle ceramics enhanced by field-assisted deformation process. [ABSTRACT FROM AUTHOR]

The machinability of hard brittle polycrystalline ceramic has a strong correlation with internal microstructures and their accommodated deformation behavior. In the present work, we investigate the mechanisms governing the brittle-to-ductile transition behavior of polycrystalline 3C–SiC in diamond cutting by means of molecular dynamics simulations. Simulation results reveal the co-existence of dislocation slip and amorphization-dominated ductile deformation and cracking along grain boundaries-mediated brittle fracture, as well as the correlation of individual deformation modes with machining force variation and machined surface morphology. In addition, inter-granular fracture, grain boundary sliding and grain pull-up are also operating brittle deformation modes of polycrystalline 3C–SiC. The strong competition between above heterogeneous deformation modes determines the brittle-to-ductile transition behavior in grooving of polycrystalline 3C–SiC. Simulation results also demonstrate that grain size has a strong impact on the brittle-to-ductile transition and material deformation behavior of polycrystalline 3C–SiC under diamond cutting. [ABSTRACT FROM AUTHOR]

The transition of material removal mode of polycrystalline 3C-SiC cutting with temperature, i.e., from brittle mode cutting that is dominated by inter-granular fracture and grain pulling-out at low temperature to ductile mode cutting that is governed by intra-granular cracking and dislocation slip. [Display omitted] • Temperature-dependent mechanical properties of both grains and GBs in polycrystalline 3C-SiC at elevated temperatures are derived. • Temperature-dependent properties of 3C-SiC GBs are bridged between MD simulation and FE simulation with cohesive zone model. • There is transition from brittle mode by inter-granular fracture toductile mode by intra-granular cracking with temperature. While the deformation behavior of grain boundaries has a strong impact on the mechanical response of polycrystalline materials, investigating the coupled thermal–mechanical properties of grain boundaries in their real formats is crucial for enhancing the ductile machinability of hard brittle polycrystalline ceramic materials. In the present work, we report the thermal softening-suppressed inter-granular fracture, accompanied with enhanced stacking fault formation, increased healing ability of grain boundaries and promoted ductile material removal, in diamond cutting of polycrystalline 3C-SiC at elevated temperatures by multi-scale simulations. Molecular dynamics simulations and experiments of high temperature nanoindentations are performed to derive the temperature-dependent mechanical properties of bulk polycrystalline 3C-SiC. Furthermore, molecular dynamics simulations of Mode I (tension) and Mode II (shearing) loading of a Σ9<1 1 0>{1 2 2} symmetric tilt grain boundary at elevated temperatures are performed to extract the temperature-dependent mechanical properties of grain boundaries in polycrystalline 3C-SiC. A novel finite element model of heat treatment-assisted diamond cutting of polycrystalline 3C-SiC with the comprehensive consideration of thermal properties of both grains and grain boundaries at elevated temperatures is established to reveal the transition of material removal mode, grain boundary failure behavior, cutting force characteristics and chip profile with temperature. [ABSTRACT FROM AUTHOR]