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Solution‐processed copper(I) thiocyanate (CuSCN) typically exhibits low crystallinity with short‐range order; the defects result in a high density of trap states that limit the device's performance. Despite the extensive electronic applications of CuSCN, its defect properties are not understood in detail. Through X‐ray absorption spectroscopy, pristine CuSCN prepared from the standard diethyl sulfide‐based recipe is found to contain under‐coordinated Cu atoms, pointing to the presence of SCN− vacancies. A defect passivation strategy is introduced by adding solid I2 to the processing solution. At small concentrations, the iodine is found to exist as I− which can substitute for the missing SCN− ligand, effectively healing the defective sites and restoring the coordination around Cu. Computational study results also verify this point. Applying I2‐doped CuSCN as a p‐channel in thin‐film transistors shows that the hole mobility increases by more than five times at the optimal doping concentration of 0.5 mol.%. Importantly, the on/off current ratio and the subthreshold characteristics also improve as the I2 doping method leads to the defect‐healing effect while avoiding the creation of detrimental impurity states. An analysis of the capacitance‐voltage characteristics corroborates that the trap state density is reduced upon I2 addition. [ABSTRACT FROM AUTHOR]

Hole Transports In article number 2209504, Pichaya Pattanasattayavong and co‐workers, report that X‐ray absorption spectroscopy reveals the incomplete coordination environment around Cu(I) centers in CuSCN which can be associated with SCN− vacancies acting as hole‐trapping states. Doping with an optimal amount of I2 leads to defect‐healing and a drastic improvement in hole transport. [ABSTRACT FROM AUTHOR]