1. Erosion mechanism and cutting performance of MPCVD multilayer diamond thick film-Si3N4 brazed inserts.
- Author
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Song, Xin, Wang, Hua, Wang, Xinchang, and Sun, Fanghong
- Subjects
THICK films ,DIAMOND films ,ALUMINUM alloys ,CHEMICAL vapor deposition ,EROSION ,MICROWAVE plasmas ,DIAMONDS - Abstract
For fabricating brazed inserts in machining difficult-to-machine materials, chemical vapor deposition (CVD) diamond thick films are potential candidates for polycrystalline diamond (PCD). In the present study, monolayer microcrystalline diamond (MCD), monolayer nanocrystalline diamond (NCD), and multilayer diamond thick films were respectively deposited on the Si
3 N4 substrates by the high-power density (HPD) microwave plasma CVD (MPCVD) technique, which were then brazed on WC–Co. Their microstructures, growth rates, and film quality were systematically studied. Within the multilayer film, in order to enhance the secondary nucleation on as-deposited MCD layers and promote the consecutive growth of NCD layers, increasing the nitrogen addition level was much more effective than increasing the methane/hydrogen ratio. The NCD interpositions could guarantee layer thickening, while suppressing the growing up of individual micro diamond grains. As revealed by Raman spectra, the multilayer structure could help restrain the accumulation of the residual stress with increasing the thickness. Besides, the multilayer diamond thick film also presented much enhanced erosive wear resistance, as compared with the monolayer MCD or NCD, because the NCD interlayers could prevent intergranular cracks from further propagating. Finally, cutting performances of various brazed inserts were evaluated, in the case of dry-turning the high-silicon aluminum alloy (40 wt.% Si), demonstrating that the multilayer structure could result in the enhancement of the impact toughness of cutting edges, and improve the machining quality. [ABSTRACT FROM AUTHOR]- Published
- 2022
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