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In this paper, we investigate the influence of the drain electrode on the dynamic switching behavior of AlGaN/GaN high-electron-mobility transistors on Si substrate. By adding a field plate to the drain electrode, a dramatic increase in the dynamic ON-resistance dynR \mathrm{\scriptscriptstyle ON} was identified. The dispersion effect is correlated with the high electric field below the drain field plate (DFP), the onset of which is caused by the full electron depletion from both the channel and the GaN cap layer. We show that the electron distribution is modified by the passivation method, backside bias, or surface charges and, hence, shifts the onset voltage of the trapping effect. Trapped electrons underneath the DFP are thought to be responsible for the measured rise of the dynR \mathrm{\scriptscriptstyle ON} . With the introduction of an extended ohmic drain contact, the influence of a metallization overhang at the drain edge can be suppressed. The detrapping energies associated with the surface defects were determined to 0.2, 0.3, and 0.7 eV, respectively. Simulations and measurements indicate that charges inside the passivation below the DFP worsen the switching behavior. [ABSTRACT FROM AUTHOR]

We report on electroluminescence (EL) emission from AlGaN/GaN high electron mobility transistors (HEMTs). Intensity maxima at the drain-side edge of the gate foot and at the drain-side edge of the gate field plate are observed. To relate the EL intensity profile to the electric field along the channel, 2D device simulations have been performed at different drain biases. The dependences of both EL maxima on the electric field reveal a threshold which closely correlates with the electric field strength at which a transfer of conduction band electrons from the zone centre minimum to satellite valleys sets in. We further analyze the dependence of the EL spectra on the drain voltage. The obtained results strongly suggest that the EL emission observed in AlGaN/GaN HEMTs is dominated by radiative inter-valley electron transitions. [ABSTRACT FROM AUTHOR]

Abstract: The influence of the electric field on the reliability of AlGaN/GaN HEMTs is investigated in this work. We first demonstrate that at a certain electric field strength at the gate edge the gate characteristics of the device changes. This degradation is irreversible and is strongly influenced by growth parameter. A drain-voltage step-stress method is applied to the devices for investigating different layouts, and a consequent application enabled us to assign parameters mitigating the peak field strength and improve reliability. [Copyright &y& Elsevier]