15 results on '"Tianxiang Wu"'
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2. Response Surface Analysis of Process Parameters for Thermocompression Ultrasonic Flip Bonding of Chips
3. A 90‐ to 115‐GHz superheterodyne receiver front‐end for W‐band imaging system in 28‐nm complementary metal‐oxide‐semiconductor
4. Ultrasonic-Assisted Micro-Silver Paste Sintering for Flip-Chip Bonding
5. Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging
6. Research on the Mechanical Properties of Magnetorheological Damping and the Performance of Microprobe Test Process
7. A 23‐ to 28‐GHz 5‐bit switch‐type phase shifter with 1‐bit calibration based on optimized ABCD matrix design methods for 5G MIMO system in 0.15‐μm GaAs
8. A 10‐MHz to 50‐GHz low‐jitter multiphase clock generator for high‐speed oscilloscope in 0.15‐μm GaAs technology
9. A single-vision dual imaging optical system in flip chip alignment
10. A 0.2-Terahertz Ceramic Relic Detection System Based on Iterative Threshold Filtering Imaging and Neural Network
11. A Sub-6G SP32T Single-Chip Switch with Nanosecond Switching Speed for 5G Applications in 0.25 μm GaAs Technology
12. Optical–electrical characteristic of green based on GaN micro-LED arrays
13. A 12-Bit 50 MS/s Split-CDAC-Based SAR ADC Integrating Input Programmable Gain Amplifier and Reference Voltage Buffer
14. Wafer-Scale Functional Circuits Based on Two Dimensional Semiconductors with Fabrication Optimized by Machine Learning
15. A 130-to-220-GHz Frequency Quadrupler with 80 dB Dynamic Range for 6G Communication in 0.13-μm SiGe Process
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