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A systematic experimental evaluation of the thermal stability of Ru metal gate electrodes in direct contact with SiO2 and Hf-based dielectric layers was performed and correlated with electrical device measurements. The distinctly different interfacial reactions in the Ru/SiO2, Ru/HfO2, and Ru/HfSiOx film systems were observed through cross-sectional high-resolution transmission electron microscopy, high angle annular dark field scanning transmission electron microscopy with electron-energy-loss spectra, and energy dispersive x-ray spectra analysis. Ru interacted with SiO2, but remained stable on HfO2 at 1000 °C. The onset of Ru/SiO2 interfacial interactions is identified via silicon substrate pitting possibly from Ru diffusion into the dielectric in samples exposed to a 900 °C/10-s anneal. The dependence of capacitor device degradation with decreasing SiO2 thickness suggests Ru diffuses through SiO2, followed by an abrupt, rapid, nonuniform interaction of ruthenium silicide as Ru contacts the Si substrate. Local interdiffusion detected on Ru/HfSiOx samples may be due to phase separation of HfSiOx into HfO2 grains within a SiO2 matrix, suggesting that SiO2 provides a diffusion pathway for Ru. Detailed evidence consistent with a dual reaction mechanism for the Ru/SiO2 system at 1000 °C is presented. [ABSTRACT FROM AUTHOR]

We have demonstrated that the resistance switching (RS) effect can be controlled by the modification of the electrode configurations and the carrier densities in the Ag/SrTiO3 and Ag/Nb-doped SrTiO3(Nb:STO) structures. The elimination of the Schottky junction in the metal/Nb:STO completely destroys the RS effect, which suggests that the RS effect originates from the modification of Schottky-like barrier formed at the interface of metal/Nb:STO. The rectifying I-V curves revealed that the change in resistance was attributed to the trapping or detrapping carriers at the interface. The carrier density plays an important role in the determination of RS effect. The presence of the RS in SrTiO3 requires an appropriate doping level to provide conditions for trapping carriers at the interface. [ABSTRACT FROM AUTHOR]

Abstract: The effect of device fabrication temperature on the work function of ruthenium (Ru) metal gate and its bilayers was investigated. The work function shows strong temperature dependence when Ru electrodes are deposited on silicon oxide, SiO2, but not on hafnium silicates (HfSiO x ). Specifically, the work function of Ru on SiO2 increased from 4.5 eV at 500 °C to 5.0 eV at 700 °C. On further annealing to 900 °C or higher, the work function dropped to about 4.4 eV. In the case of HfSiO x , the work function of Ru changed by less than 100 mV over the same temperature range. Identical temperature dependence was observed using hafnium (Hf)/Ru and tantalum (Ta)/Ru bilayers. However, the peak values of the work function decreased with increasing Hf/Ru and Ta/Ru thickness ratios. Materials analysis suggests that these trends are driven by interactions at the Ru metal gate–dielectric interface. [Copyright &y& Elsevier]

We have demonstrated that the resistance switching (RS) effect can be controlled by the modification of the electrode configurations and the carrier densities in the Ag/SrTiO3 and Ag/Nb-doped SrTiO3(Nb:STO) structures. The elimination of the Schottky junction in the metal/Nb:STO completely destroys the RS effect, which suggests that the RS effect originates from the modification of Schottky-like barrier formed at the interface of metal/Nb:STO. The rectifying I-V curves revealed that the change in resistance was attributed to the trapping or detrapping carriers at the interface. The carrier density plays an important role in the determination of RS effect. The presence of the RS in SrTiO3 requires an appropriate doping level to provide conditions for trapping carriers at the interface. [ABSTRACT FROM AUTHOR]