1. Ni-SiC Nanocomposites Electroplating Process under Ultrasonic and Agitation.
- Author
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Liu, Wei Qiao, Lei, Wei Ning, Wang, Chuang Ye, Qian, Hai Feng, and Ding, Li Hong
- Subjects
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NANOCOMPOSITE materials , *HYDROGEN-ion concentration , *THIN films , *METALLOGRAPHIC specimens , *ELECTROFORMING - Abstract
Ni-SiC nanocomposite coating was fabricated on the copper substrate by eletrodeposition technique with the aid of ultrasonic and agitation. The effects of cathodic current density, temperature, stirring rate and surfactants on the micro-hardness and deposition rate of Ni-SiC composite were studied. The optimal process parameters were determined by orthogonal test as follows: cathodic current density 5 A/dm2, suspension amount of SiC 4g/L, temperature 30°, pH 4.0, and stirring rate 200 rpm. The hardness of the films was tested by digital micro hardness tester. The surface morphology and microstructure of the films were inspected by metallographic system. The results show that, with proper ultrasonic and agitation, the surface becomes compacter and smoother, the porosity is decreased and the nickel crystalline is also refined. The hardness of the nano-composite coating is remarkably improved compared with the conventional electroforming coating. [ABSTRACT FROM AUTHOR]
- Published
- 2015
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