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Highlights: Detailed summary of current trends in the advancement of flexible EMI shielding materials. The theoretical shielding mechanisms and the latest concept of "green shielding" index (gs) are outlined. Functional applications of flexible EMI shielding materials are introduced from thermal conductivity, hydrophobicity to transparency, sensing even multiple functions. Exclusive insights in challenges and future design strategies opportunities for flexible EMI shielding materials are provided. With rapid development of 5G communication technologies, electromagnetic interference (EMI) shielding for electronic devices has become an urgent demand in recent years, where the development of corresponding EMI shielding materials against detrimental electromagnetic radiation plays an essential role. Meanwhile, the EMI shielding materials with high flexibility and functional integrity are highly demanded for emerging shielding applications. Hitherto, a variety of flexible EMI shielding materials with lightweight and multifunctionalities have been developed. In this review, we not only introduce the recent development of flexible EMI shielding materials, but also elaborate the EMI shielding mechanisms and the index for "green EMI shielding" performance. In addition, the construction strategies for sophisticated multifunctionalities of flexible shielding materials are summarized. Finally, we propose several possible research directions for flexible EMI shielding materials in near future, which could be inspirational to the fast-growing next-generation flexible electronic devices with reliable and multipurpose protections as offered by EMI shielding materials. [ABSTRACT FROM AUTHOR]

Environmentally friendly thermal interface materials (TIMs) with bidirectional high thermal conductivities have aroused considerable interests for addressing the heat dissipation issue in integrated circuits. Although graphene-based TIMs exhibit excellent in-plane thermal conductive performance, their through-plane thermal conductivity is commonly less than 3 Wm−1K−1 owing to the vast interfacial phonon scattering, significantly limiting their practical applications. In this study, a strategy aimed at building TIMs with controllable heat transfer pathways both along the in-plane and through-plane directions is proposed by incorporating micron-diamonds (MDs) in graphene nanoplatelets/nanofibrillated cellulose (GNPs/NFC) composite film via a facile and green self-assembly method. The morphology of the obtained MDs@GNPs/NFC composite film can be precisely tailored from a hierarchical structure to a 3D solid foam-like structure to tailor heat transfer paths. By adjusting the loading and particle size of MDs, a through-plane thermal conductivity of 8.85 Wm−1K−1 was achieved accompanied with a simultaneously high in-plane thermal conductivity of 32.01 Wm−1K−1. The excellent bidirectional thermal conductive performance is integrated with high-efficiency Joule heating capability, outstanding nonflammability, as well as superior electromagnetic shielding performance, showing a promising future in advanced electronic devices. [Display omitted] [ABSTRACT FROM AUTHOR]