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A class of carbon-nanotube (CNT) composite materials was developed to take advantage of the precise high-aspect-ratio shape of patterned vertically grown nanotube forests. These patterned forests were rendered mechanically robust by chemical vapor infiltration and released by etching an underlying sacrificial layer. We fabricated a diverse variety of functional MEMS devices, including cantilevers, bistable mechanisms, and thermomechanical actuators, using this technique. A wide range of chemical-vapor-depositable materials could be used as fillers; here, we specifically explored infiltration by silicon and silicon nitride. The CNT framework technique may enable high-aspect-ratio MEMS fabrication from a variety of materials with desired properties such as high-temperature stability or robustness. The elastic modulus of the silicon-nanotube and silicon nitride-nanotube composites is dominated by the filler material, but they remain electrically conductive, even when the filler (over 99% of the composite's mass) is insulating. [ABSTRACT FROM AUTHOR]

This paper proposes a model for predicting the piezoresistive effect in microfiexures experiencing bending stresses. Linear models have long existed for describing piezoresistivity for members in pure tension and compression. However, extensions of linear models to more complex loading conditions do not match with experimental results. A second-order model to predict piezoresistive effects in tension, compression, and more complex loading conditions is proposed. A reduced form of the general second-order model is presented for thin flexures in bending. A three-step approach is used to determine the piezoresistive coefficients for this reduced-form model. The approach is demonstrated for two sets of n-type polysilicon. The predictive ability of the model is investigated by comparing the results to the experimental results using the new piezoresistive model and coefficients. One of the ways to implement the model is with multiphysics finite element analysis (FEA). The piezoresistive FEA for flexures algorithm is a FEA implementation of the unidirectional form of the model for flexures. The results presented in this paper are for the simplified cases of long thin flexures experiencing bending and axial loads. This new model could contribute to optimized sensors and feedback control of microdevices, nanopositioning, and self-sensing microdevices. [ABSTRACT FROM AUTHOR]

Although the use of compliance or elastic flexibility in microelectromechanical systems (MEMS) helps eliminate friction, wear, and backlash, compliant MEMS are known to be sensitive to variations in material properties and feature geometry, resulting in large uncertainties in performance. This paper proposes an approach for design stage uncertainty analysis, model validation, and robust optimization of nonlinear MEMS to account for critical process uncertainties including residual stress, layer thicknesses, edge bias, and material stiffness. A fully compliant bistable micromechanism (FCBM) is used as an example, demonstrating that the approach can be used to handle complex devices involving nonlinear finite element models. The general shape of the force-displacement curve is validated by comparing the uncertainty pre- dictions to measurements obtained from in situ force gauges. A robust design is presented, where simulations show that the estimated force variation at the point of interest may be reduced from ±47 µN to ±3 µN. The reduced sensitivity to process variations is experimentally validated by measuring the second stable position at multiple locations on a wafer. [ABSTRACT FROM AUTHOR]

A new class of bistable mechanisms, the fully compliant tensural bistable micromechanism (FTBM) class, is introduced. The class consists of linear bistable micromechanisms that undergo tension loads, in addition to the bending loads present, through their range of motion. Proof-of-concept designs fabricated in two different microelectromechanical systems (MEMS) surface micromachining processes were demonstrated. Three sets of refined designs within the FTBM class were designed using optimization methods linked with nonlinear finite element analysis (FEA), then fabricated and tested. Measured force and displacement performance are compared to values obtained by FEA. On-chip actuation of the bistable mechanisms was achieved using thermomechanical in-plane microactuators (TIMs). The FTBM class of bistable mechanisms explores a relatively new design space for fully compliant micromechanisms, and mechanisms from this class have promise in such applications as micro shutter positioning, microvalves, and electrical microrelays. [ABSTRACT FROM AUTHOR]

Abstract: Predicting the force capabilities of thermal microactuators is a key issue when designing to meet specific size and power requirements. This paper uses simulation and experimental measurements to characterize the force capabilities of chevron-shaped thermal in-plane microactuators. Force measurements are obtained using a novel dual stage in situ force gauge that performs the functions of both a fixed load spring and a movable force gauge. Results show that a significant decrease in performance can occur for some designs due to higher-order asymmetric buckling, which may be caused by an offset load or process variations. Nonlinear finite element models are used to simulate the behavior, provide predictions of the force output capability, and develop design rules for mitigating the effect of asymmetric buckling. [Copyright &y& Elsevier]