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The development of flexible and stretchable devices is crucial for realizing future electronics. In particular, for dielectric layer, conventional inorganic materials are limited by their brittle nature, while organic materials suffer from a low dielectric constant. Here, a novel intrinsically photopatternable high‐k Parylene‐based thin film (Parylene‐OH) is fabricated via a chemical vapor deposition process based on the Gorham method, which provides pin‐hole free, conformal polymeric film on any type of surface. Parylene‐OH can be photo‐patterned by UV crosslinking without further lithography processes and dielectric constant of Parylene‐OH increases from 6.05 to 7.53 after crosslinking, without degrading other parameters, making it comparable to conventional high‐k dielectric, Al2O3. Flexible In─Ga─Zn─O (IGZO) thin‐film transistors (TFTs) with patterned dielectric layers can withstand higher strain owing to the localized pattern of each unit. A CMOS inverter integrated with n‐type IGZO and p‐type Te TFTs is successfully fabricated. Parylene‐OH can be used in the future of state‐of‐the‐art flexible electronic devices. [ABSTRACT FROM AUTHOR]

All-solution processing of large-area organic electronics requires multiple steps of patterning and stacking of various device components. Here, we report the fabrication of highly integrated arrays of polymer thin-film transistors and logic gates entirely through a series of solution processes. The fabrication is done using a three-dimensional crosslinker in tetrahedral geometry containing four photocrosslinkable azide moieties, referred to as 4Bx. 4Bx can be mixed with a variety of solution-processable electronic materials (polymer semiconductors, polymer insulators, and metal nanoparticles) and generate crosslinked network under exposure to UV. Fully crosslinked network film can be formed even at an unprecedentedly small loading, which enables preserving the inherent electrical and structural characteristics of host material. Because the crosslinked electronic component layers are strongly resistant to chemical solvents, micropatterning the layers at high resolution as well as stacking the layers on top of each other by series of solution processing steps is possible. To enable the large-area manufacture of solution-processed organic electronics, direct photocrosslinking processes has emerged as a promising technology solution. Here, the authors report an efficient universal crosslinking agent for micropatterning of stacked multi-layered organic electronics. [ABSTRACT FROM AUTHOR]