Search

• Detailed parameter variation during sputter deposition of MoNbTaWZr films. • Influence of duty cycle, Ar pressure and pulse frequency analyzed and discussed. • Parameters enabling high energetic growth conditions lead to amorphous microstructure. • Films deposited with low energetic growth conditions have a crystalline bcc structure. • Impact of microstructure and morphology on electrical resistivity discussed. Within this study a series of MoNbTaWZr thin films were synthesized using high power impulse magnetron sputtering (HiPIMS) with varying the deposition parameters: duty cycle from 0.5 to 100 % (i.e. DC magnetron sputtering (DCMS)), Ar pressure from 0.5 to 3 Pa and pulse frequency from 25 to 200 Hz. The structure of the deposited films was analyzed by X-ray diffraction and scanning and transmission electron microscopy. In addition, the electrical resistivity and the residual stress of the films was determined. The influence of the deposition parameter variation on structure and properties of the MoNbTaWZr films is discussed on the established framework of film growth conditions achievable with HiPIMS and DCMS and how they can be influenced by adapting the deposition parameters. The performed work is intended to contribute to a comprehensive understanding about synthesis-structure-property relations for refractory high entropy alloy thin films while using MoNbTaWZr films as a model system. [ABSTRACT FROM AUTHOR]

This study presents detailed microstructural investigations on single and bilayer thin films of two medium entropy alloys (MEAs) synthesized using magnetron sputter deposition. Single layer thin films of CoCrFeNi and AlCoCrFe show single-phase face-centered cubic (fcc) and body-centered (bcc) structure, respectively. The bilayer thin film consisting of CoCrFeNi (fcc) and AlCoCrFe (bcc) has a sharp interface between them with an equiatomic composition. Nanodiffraction was used to characterize planar defects in the fcc films. This first study on bilayer film of two MEAs is transformative to other systems and will help fundamental studies on high entropy alloys. Image, graphical abstract [ABSTRACT FROM AUTHOR]

High entropy alloy (HEA) thin films are potential candidates to act as diffusion barrier between Cu and Si in microelectronics. To evaluate the suitability of refractory HEAs, six different HEA thin films based on the MoNbTaW system and alloyed with Ti, V, Cr, Mn, Zr or Hf have been deposited by high power impulse magnetron sputtering with a thickness of 20 nm on Si substrates. The bi-layer architecture was completed by a 150 nm thick top-layer of Cu. The microstructure of the bi-layers before and after annealing in vacuum up to 800 °C was investigated by X-ray diffraction to observe possible phase changes or formations. In addition, resistance measurements and confocal laser scanning microscopy were employed to check for potential barrier failure. The lowest onset temperature for barrier failure of 600 °C was found for MoNbTaWZr, whereas the highest of 700 °C was observed for CrMoNbTaW. The obtained results for the failure temperature are discussed in terms of microstructure, strain and cohesive energy of the HEA films as well as the enthalpy of mixing between the elements in the HEA and Cu. A direct correlation between the mixing enthalpy of the fifth alloying element with Cu and the barrier failure temperature was observed. [Display omitted] • Suitability of refractory high entropy alloys as diffusion barriers. • Synthesis by high power impulse magnetron sputtering. • Best barrier performance for CrMoNbTaW with failure temperature at 750 °C • No correlation between film microstructure and diffusion barrier performance. • Mixing enthalpy of elements in HEA with Cu plays decisive role. [ABSTRACT FROM AUTHOR]