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Epoxy-based composites with high insulation and thermal conductivity are desirable materials for electronic and electrical applications. However, resolving the tradeoff between insulation and thermal conductivity remains challenging. Based on the functional requirement, we designed and fabricated a cactus-like double-oriented epoxy composite by combining magnetic orientation and ice-templated methods. Semiconducting SiC endowed the composite with field-grading characteristics, thus relieving local electric field stress along the horizontal direction, while BN with high thermal conductivity promoted heat dissipation along the vertical direction. The composite exhibited its highest performance with 15 vol% filler, improving the breakdown voltage and thermal conductivity by 43.7% and 1312% compared with pure epoxy, respectively, outperforming recently developed packaging materials. It is believed that this work offers an efficient strategy for the fabrication of the filler structure and provides insights on the simultaneous enhancement in insulation and thermal conductivity of polymer composites. [ABSTRACT FROM AUTHOR]

In this paper, a resin with high adhesion, easy curing, good flexibility, and high temperature resistance was prepared from polyimide fiber paper. First, in order to improve the toughness and curability of impregnating resin, epoxy resin was modified by addition of vinyl silicone resin. Subsequently, ternary resin with high temperature stability was obtained by polyimide resin addition. Among the investigated conditions, the optimal additive amount of vinyl silicone resin and polyimide resin was 30% and 5%, respectively. The prepared ternary resin has better toughness, crosslinking degree, high temperature stability (5% mass loss at 339.2 °C) and no obvious glass transition at high temperature. Finally, the polyimide fiber paper-based composite material was impregnated with modified epoxy resin and ternary resin, respectively. The results shows that the paper-based composite material impregnated with modified epoxy resin has a better fiber bonding degree, a smooth surface, and contact angle could reach up to 148.71°. Meanwhile, the paper-based composite material impregnated with ternary resin has good high temperature resistance, and the tensile index of the paper-based composite material could reach up to 35.1 N·m/g at 200 °C. [ABSTRACT FROM AUTHOR]