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This paper presents a 28-Gb/s transceiver in 32-nm SOI CMOS technology for chip-to-chip communications over high-loss electrical channels such as backplanes. The equalization needed for such applications is provided by a 4-tap baud-spaced feed-forward equalizer (FFE) in the transmitter and a two-stage peaking amplifier and 15-tap decision-feedback equalizer (DFE) in the receiver. The transmitter employs a source-series terminated (SST) driver topology which doubles the speed of existing half-rate designs. The high-frequency boost provided by the peaking amplifier is enhanced by adopting a structure with capacitively coupled parallel input stages and active feedback. A capacitive level-shifting technique is introduced in the half-rate DFE which allows a single current-integrating summer to drive the four parallel paths used for speculating the first two DFE taps. Error-free signaling at 28 Gb/s is demonstrated with the transceiver over a channel with 35 dB loss at half-baud frequency. In a four-port core configuration, the power consumption at 28~Gb/s is 693 mW/lane. [ABSTRACT FROM PUBLISHER]

A source synchronous I/O system based on high-density silicon carrier interconnects is introduced. Benefiting from the advantages of advanced silicon packaging technologies, the system uses 50 \mum-pitch \muC4s to reduce I/O cell size and fine-pitch interconnects on silicon carrier to achieve record-breaking interconnect density. An I/O architecture is introduced with link redundancy such that any link can be taken out of service for periodic recalibration without interrupting data transmission. A timing recovery system using two phase rotators shared across all bits in a receive bus is presented. To demonstrate these concepts, an I/O chipset using this architecture is fabricated in 45 nm SOI CMOS technology. It includes compact DFE-IIR equalization in the receiver, as well as a new all-CMOS phase rotator. The chipset is mounted to a silicon carrier tile via Pb-free SnAg \muC4 solder bumps. Chip-to-chip communication is achieved over ultra-dense interconnects with pitches of between 8 \mum and 22 \mum. 8\,\times\,10-Gb/s data is received over distances up to 4 cm with a link energy efficiency of 5.3 pJ/bit from 1 V TX and RX power supplies. 8\,\times\,9-Gb/s data is recovered from a 6-cm link with 16.3 dB loss at 4.5 GHz with an efficiency of 6.1 pJ/bit. [ABSTRACT FROM PUBLISHER]

This paper presents a 90-nm CMOS 10-Gb/s transceiver for chip-to-chip communications. To mitigate the effects of channel loss and other impairments, a 5-tap decision feed- back equalizer (DFE) is included in the receiver and a 4-tap baud-spaced feed-forward equalizer (FFE) in the transmitter. This combination of DFE and FFE permits error-free NRZ signaling over channels with losses exceeding 30 dB. Low jitter clocks for the transmitter and receiver are supplied by a PLL with LC VCO. Operation at 10-Gb/s with good power efficiency is achieved by using half-rate architectures in both transmitter and receiver. With the transmitter producing an output signal of 1200 mVppd, one transmitter/receiver pair and one PLL consume 300 mW. Design enhancements of a half-rate DFE employing one tap of speculative feedback and four taps of dynamic feedback allow its loop timing requirements to be met. Serial link experiments with a variety of test channels demonstrate the effectiveness of the FFE/DFE equalization. [ABSTRACT FROM AUTHOR]