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A new hyperbranched polysiloxane containing maleimide (HPMA) was synthesized through the reaction between N-(4-hydroxyphenyl) maleimide and 3-glycidoxypropyltrimethoxysilane, which was then used to prepare cyanate ester (CE) resin-based hybrids (coded as HPMA x/CE, where x is the weight fraction of HPMA in the hybrid). The curing behavior of uncured hybrids and the typical properties (impact strength and dielectric properties) of cured hybrids were systemically investigated. Results show that the performance of hybrids is greatly related with the content of HPMA. Hybrids have obviously lower curing temperature than CE, overcoming the poor curing characteristics (higher curing temperature and longer curing time) of neat CE, for example, the curing peak temperature of HPMA20/CE is about 65°C lower than that of CE. In the case of cured resin and hybrids, the hybrids exhibit decreased dielectric constant and loss than CE resin; moreover, the former also exhibits lower water absorption than the latter. Specifically, the dielectric loss of HPMA15/CE hybrid is only about 27% of that of neat CE resin. In addition, the hybrids with suitable contents of HPMA have significantly improved impact strengths. The overall improved properties suggest that HPMA x/CE hybrids have great potential in applications needing harsh requirements of curing feature, dielectric properties, and toughness. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012 [ABSTRACT FROM AUTHOR]

A novel method is proposed to synthesize new mesoporous silica containing amine groups (MPSA), and it was further employed to modify bismaleimide-dialllyl bisphenol (BD)/cyanate ester (CE) resin to form novel MPSA/BD/CE hybrids; in addition, the typical properties of MPSA/BD/CE were systematically investigated. Results show that these hybrids have very low dielectric constant and loss as well as good thermal properties. Compared with BD/CE resin, all hybrids have not only decreased dielectric constant and loss but also similar dependence of dielectric properties on frequency over the whole frequency from 10 to 106 Hz. Specifically, with the addition of MPSA to BD/CE resin, the dielectric constant reduces from 3.5 to 3.0, and the dielectric loss is only 85% of that of BD/CE resin. Note that all hybrids show better thermal resistance (reflected by higher glass transition temperature, decreased maximum degradation rate, and higher char yield at 800°C) than BD/CE resin. All these differences in macro-properties are attributed to the different structure between MPSA/BD/CE hybrids and BD/CE resin. Copyright © 2011 John Wiley & Sons, Ltd. [ABSTRACT FROM AUTHOR]

High curing temperature is the key disadvantage of cyanate esters. A novel catalyst system was developed, which is a hybrid catalyst system (HC) consisting of UV activated tricarbonyl cyclopentadienyl manganese (Catalyst I) and Catalyst II derived from dibutyl tin dilaurate. The effect of HC on the reactivity of 2, 2′-bis(4-cyanatophenyl) isopropylidene (BADCy) monomer, and that on the dielectric and thermal properties of cured resin were investigated. Results show that HC displays an attractive synergy effect on catalyzing BADCy over its two components. Compared with the curing exothermic peak of BADCy, that of BADCy/HC system appears at significantly lower temperature (which is at least 120°C lower than the former). In addition, cured BADCy/HC resin also exhibits interesting synergy effect in integrated performance, that is, it has much better thermal resistance and dielectric properties than cured BADCy, BADCy/Catalyst I, and BADCy/Catalyst II resins. The BADCy/HC resin can be used as high performance matrices for advanced composites and adhesives. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers [ABSTRACT FROM AUTHOR]

A high performance modified cyanate ester (CE) resin system with significantly improved toughness, water resistance and dimensional stability was developed by copolymerizing CE resin with liquid crystalline epoxy resin (LCE) for electronic packaging. Four LCE/CE resins with different contents of LCE were prepared to systemically evaluate the effect of the content of LCE on the key properties of the modified system such as mechanical, dielectric and thermal properties as well as water resistance. Results reveal that the addition of LCE to CE can not only decrease the curing temperature of CE, but also significantly improve the integrated properties including mechanical and dielectric properties, thermal resistance as well as water resistance of cured resin. For example, compared with the whole exothermic peak of CE, that of LCE10/CE significantly shifts toward low temperature with a gap of about 15°C. On the other hand, the impact strength of cured LCE10/CE resin (22 kJ/m) is about 2.1 times of that of CE resin; while the water absorption of the former is only 81.2% of that of the latter. In addition, cured LCE/CE resins also exhibit lower and more stable dielectric loss than CE resin over the whole frequency range from 10 to 10 Hz. All these improvements in macro-performance by the addition of LCE to CE resin are not only ascribed to the cross-linked chemical structure, but also attributed to the rigid structure of liquid crystalline resin. The outstanding integrated properties of LCE/CE resins suggest great potential to be applied in the field of high performance electronic packaging. [ABSTRACT FROM AUTHOR]

High-performance thermosetting resins should have good toughness and stiffness, so simultaneously toughening and stiffening is the main target in developing high-performance resins. A novel modified cyanate ester resin with improved toughness and stiffness was developed by copolymerizing 2,2′-bis(4-cyanatophenyl)isopropylidene (CE) with hyperbranched polyphenylsilsesquioxane (HBPPSi). The mechanical properties and their nature were systematically investigated from the viewpoint of structure-property relations using positron annihilation lifetime spectroscopy and spectral analyses. It is found that a suitable content of HBPPSi in CE resin can effectively improve toughness and stiffness. In the case of the CE resin modified with 10 wt% HBPPSi, its impact and flexural strengths are 21 kJ m−2 and 148 MPa, respectively, about 2.6 and 1.4 times of those of neat CE resin. The flexural modulus increases from 3.0 (for neat CE resin) to 3.4 GPa. The results of dynamic mechanical analyses also corroborate the static mechanical properties. The improved toughness and stiffness of CE resin can be attributed to the synergistic effect resulting from changes of both polymer chain structure and aggregation state structure. These attractive features of HBPPSi/CE resins suggest that the method proposed herein may be a new approach for the development of high-performance resins for cutting-edge industries. Copyright © 2011 Society of Chemical Industry [ABSTRACT FROM AUTHOR]

Abstract: A novel kind of modified bismaleimide/cyanate ester (BCE) resins by copolymerizing with hyperbranched polysiloxane including high content of phenyl (HBPSi) was first reported. The effect of HBPSi on the curing mechanism, and that on the dielectric properties and flame retardancy of cured networks were systemically investigated. Results show that compared with BCE resin, HBPSi/BCE resin has obviously different cross-linked structure, and thus leading to simultaneously improved dielectric properties and flame retardancy. The reactions between HBPSi and the decomposition structure of BCE resin change the thermo-oxidative degradation mechanism of the first step in the thermo-oxidative degradation; in addition, the presence of HBPSi in BCE resin also significantly reduces the mass loss rate (MLR) and increases char yield at 800 °C under an air atmosphere. Therefore, the positive effect of HBPSi on improving the flame retardancy is attributed to the condensed phase mechanism. On the other hand, HBPSi/BCE resins exhibit improved dielectric properties (including decreased dielectric constant and loss) with increasing the content of HBPSi. More importantly, this investigation demonstrates that designing new polysiloxane with suitable chemical structure is important to develop high performance resins with attractive flame retardancy and dielectric properties. [Copyright &y& Elsevier]