5 results on '"Ben Khalifa N"'
Search Results
2. ICEB 2011: International Conference on Extrusion and Benchmark
- Author
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Donati, L., Tomesani, L., Ben Khalifa, N., Tekkaya, A.E., L. Donati, L. Tomesani, N. Ben Khalifa, and A. E. Tekkaya
- Subjects
FEM CODES ,Engineering ,extrusion ,BENCHMARK ,GeneralLiterature_MISCELLANEOUS - Abstract
The 4th International Conference on Extrusion and Benchmark (ICEB 2011) will be held in Bologna, Italy from October 3-5, 2011. A large number of extruders, die makers, software houses, and researchers will gather at the event to discuss the core technology of light metal extrusion. More than 50 abstracts have been accepted on light alloy extrusion processing and the first day will be dedicated to these sessions. Papers will be also presented on ultra light alloys and new applications for extruded profiles. Process optimization and solutions to extrusion related issues will be analyzed thoroughly by several contributors. The second day of the event will be mainly dedicated to the benchmark experiment and participant results where the results of two monitored experiments will be discussed. The Scientific Benchmark will focus on the different strategies for balancing the material flow in porthole dies and its die design will deal with issues of hollow profile production, such as seam welding mechanism and material flow. The 4th International Conference on Extrusion and Benchmark (ICEB 2011) will be held in Bologna, Italy from October 3-5, 2011. A large number of extruders, die makers, software houses, and researchers will gather at the event to discuss the core technology of light metal extrusion. More than 50 abstracts have been accepted on light alloy extrusion processing and the first day will be dedicated to these sessions. Papers will be also presented on ultra light alloys and new applications for extruded profiles. Process optimization and solutions to extrusion related issues will be analyzed thoroughly by several contributors. The second day of the event will be mainly dedicated to the benchmark experiment and participant results where the results of two monitored experiments will be discussed. The Scientific Benchmark will focus on the different strategies for balancing the material flow in porthole dies and its die design will deal with issues of hollow profile production, such as seam welding mechanism and material flow.
- Published
- 2011
3. Accurate welding line prediction in extrusion processes
- Author
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Kloppenborg, Thomas, Ben Khalifa, N., Tekkaya, A. Erman, Tekkaya, A. Erman, and Ben Khalifa, Noomane
- Subjects
Finite element method ,Engineering ,Extrusion ,Welding line ,Seam weld - Abstract
In contrast to conventional extrusion processes, where a lot of research is done on in the welding quality, in composite extrusion, research is investigated into the welding line positioning. As a result of the process principle, the reinforcing elements are embedded into the longitudinal welding line. Hence, an undefined material flow inside the welding chamber induces reinforcement deflection, which can lead to reduced mechanical properties, as momentum of inertia. Therefore and to reduce costly experimental investigations, a new method of an automated numerical welding line prediction was developed. The results form HyperXtrude finite element calculations are used for special particle tracing simulations to predict the welding line in the profile cross section accurately. The procedures of segmentation and characteristic extraction are presented to approximate the welding line by cubic spline functions. The method was fully programmed in the Java program language, and works well for all HyperXtrude process models consisting of tetrahedral elements.
- Published
- 2010
- Full Text
- View/download PDF
4. An assessment of the grain structure evolution during hot forward extrusion of aluminum alloy 7020
- Author
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Foydl, A., Ben Khalifa, N., Brosius, A., Tekkaya, A. Erman, Tekkaya, A. Erman, and Ben Khalifa, Noomane
- Subjects
Engineering ,Extrusion ,Finite element analysis ,Microstructure ,Aluminum - Abstract
The current investigation is concerned with the grain structure evolution in an Al-Zn alloy (EN AW-7020) during the hot forward extrusion process. In order to analyze that, a miniature hot forward extrusion setup was designed which allows the quenching of the extrusion butt immediately after extrusion. In order to gain a better understanding of the process, the shape of the deformed grains was analyzed and the process was simulated. The shape of these grains was indentified in two directions in the different grain zones, e.g. dead metal zone and shear zone. The FE simulations showing the different grain zones were also illustrated. Simulation results and the micrographs were quite promising to find parameters for simulation models in order to predict grain sizes with the method presented in the current research work.
- Published
- 2010
- Full Text
- View/download PDF
5. Effect of die design on the welding quality during solid state recycling of AA6060 chips by hot extrusion.
- Author
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Güley, V., Güzel, A., Jäger, A., Ben Khalifa, N., Tekkaya, A.E., and Misiolek, W.Z.
- Subjects
- *
WELDING , *QUALITY assurance , *SOLID state physics , *WASTE recycling , *INTEGRATED circuits , *METAL extrusion , *MECHANICAL properties of metals , *METAL microstructure - Abstract
Abstract: Solid state recycling of aluminum chips by hot extrusion is a novel processing technique, which utilizes remarkably lower energies compared to conventional recycling by remelting. The mechanical properties of the extruded profiles can be improved by optimizing the effect of extrusion die design on the welding quality of machining chips. The chips were extruded through two dies of different design to produce solid rectangular profiles. One of the dies was a flat-face die, which represents a conventional extrusion die design for production of solid aluminum profiles. The second die was a porthole die typically used for complex hollow and semi hollow aluminum profiles. AA6060 chips were compacted at room temperature into billets and hot-extruded at approximately 500°C to aluminum profiles. The microstructure and the mechanical properties of the profiles extruded through the flat-face and porthole dies were compared. The extrusion through the porthole die resulted in a much better welding of the chips and revealed more than 80% higher ductility compared to the profiles extruded through a flat-face die. The welding quality of the chips was studied using a two-step analytical approach: a criterion for the breaking of the oxide layers and an index for the welding quality. These analytical approaches were implemented with the help of subroutines in the FEM code, in which the results of the simulations were compared and confirmed by the experimental results. [Copyright &y& Elsevier]
- Published
- 2013
- Full Text
- View/download PDF
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