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Accurate measurement of the junction temperature Tj is crucial for ensuring safe operation and evaluating the performance of silicon carbide (SiC) metal–oxide–semiconductor field-effect transistors (MOSFETs). In this paper, the junction temperature of a half-bridge is monitored by combining transient voltage and current peaks across the lower device. Both theoretical analysis and switch tests validate that the peak induced voltage and peak reversed current during the commutation transient exhibit a linear relationship with the temperature of the corresponding devices. The impact of load current and bus voltage on the measurement results is also investigated. Moreover, the effectiveness of the proposed method is confirmed by carrying out tests at different temperatures, and the feasibility of online implementation is discussed. The experimental results show that the proposed method has high linearity and sensitivity and can simultaneously provide temperature information for both devices of a half-bridge. [ABSTRACT FROM AUTHOR]

This letter proposes an indirect power dissipation level short circuit protection (IPDL-SCP) method for silicon carbide (SiC) metal-oxide semiconductor field-effect transistors (mosfets). Due to differences between normal conducting and short-circuit (SC) conditions, this method is triggered by the voltage oscillation vss at the parasitic inductance (Lss) of the source and directly monitoring vds of SiC mosfet. For verification, the short circuit protection circuit is tested and proved functional on the SC test bench. Experimental results show that the protection circuit can respond to both hard switching fault (HSF) and fault under load (FUL), while the fastest response delays are 75 ns for HSF and 170 ns for FUL. Comparisons with other commonly used SC protection methods have also been made, which show that the proposed IPDL-SCP method has better performance in shorter protection delays. [ABSTRACT FROM AUTHOR]

Wide bandgap (WBG) devices offer the advantages of high frequency, high efficiency, and high power density to power converters due to their excellent performance. However, their low parasitic capacitance and fast switching speed also make them more susceptible to switching oscillations. The switching oscillations can cause voltage and current overshoots, shoot-through, electromagnetic interference, additional power loss, and even device damage, which can seriously affect the performance of power converters and systems. However, a comprehensive and in-depth overview is lacking on this topic. This article reviews the types, the causes and negative effects, the effects of parasitic parameters and suppression methods of these switching oscillations, which is helpful for practical engineering. First, the switching oscillations are divided into different types, and their causes and negative effects are reviewed. Then, the effects of different parasitic parameters on the switching oscillations are overviewed. It is found that due to the different physical structures of silicon carbide metal-oxide-semiconductor field-effect transistors, enhancement-mode gallium nitride high-electron mobility transistors (eGaN HEMTs), and cascode GaN HEMTs, the effects are also different. Finally, the main methods of suppressing the switching oscillations are summarized, and the advantages and disadvantages of these methods are presented. Furthermore, future research works on this topic and the conclusion of this paper are drawn, which will help readers deepen their understanding of the switching oscillations of WBG devices, and inspire readers to better use WBG devices for high-frequency and high-efficient power conversion. [ABSTRACT FROM AUTHOR]