1. Fused deposition modelling of dense complex-shaped SiCp/Al composites with excellent properties.
- Author
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Sun, Yezemou, Wu, Haibo, Zhang, Yong, Liu, Huan, Yang, Yitian, Pei, Bingbing, Han, Jianshen, Liu, Zehua, Wu, Xishi, and Huang, Zhengren
- Subjects
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FUSED deposition modeling , *SPACE vehicles , *ELECTRONIC packaging , *THERMAL properties , *THERMAL conductivity , *ALUMINUM composites - Abstract
• SiC p /Al composites were prepared based on Fused Deposition Modelling (FDM) • Higher SiC volume fraction were obtained compared to other additive manufacturing methods. • complex-structure composites were prepared with excellent properties. SiC p /Al composites are widely used in space vehicles, electronic packaging, automobiles, rail vehicles and other fields due to their excellent mechanical and thermal properties. Complex-shaped SiC p /Al parts are usually manufactured by mechanical processing, which is expensive and time-consuming due to the high hardness of SiC phase. As a highly effective 3D molding method, Fused Deposition Modelling (FDM) of the complex-structure SiC p /Al composites was reported for the first time in this paper. SiC p /Al composites was densified by pressureless infiltration after FDM, and as-acquired bulk possessed high densification of 92.67 % and the SiC volume fraction of 43.2 %. Moreover, excellent performances were also presented, including flexural strength of 211 MPa, thermal conductivity of 112(W/m·K), and the thermal expansion coefficient of 8.67 × 10-6K−1. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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