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Electron traps in AlGaN/GaN high electron mobility transistors were studied by combining theoretical and experimental methods. Energy levels about EC-0.9 eV due to irradiation are identified by deep-level transient spectroscopy (DLTS). Two electron traps, H1 (EC-0.63 eV) and H2 (EC-0.9 eV), were observed in the DLTS spectra. H1 was produced in device or material manufacturing, and H2 was caused by displacement damage. First, we reported that the signal peak of H2 can contribute from three defects labeled H2-1, H2-2, and H2-3 with energies EC-0.77 eV, EC-0.9 eV, and EC-0.98 eV, respectively. According to defect migration temperature and first principles calculation results, it is found that different configurations of di-nitrogen vacancy structures are the source of EC-0.77 eV and EC-0.9 eV signals. The defect of EC-0.98 eV is more stable at high temperatures, which may be related to gallium vacancy. [ABSTRACT FROM AUTHOR]

This article investigates the displacement damage on AlGaN/GaN high-electron-mobility transistors (HEMTs) using the 30-MeV fluorine ions. The electrical degradation and the defects in HEMTs were examined before and after irradiation. Three defect states are detected in a deep-level transient analysis system (DLTS), including a broad surface state peak ($N_{1}$) and two bulk defect peaks ($H_{1}$ and $H_{2}$). The energy levels of these two defects are $E_{\mathrm {C}} 0.63$ eV ($H_{2}$) and $E_{\mathrm {C}} 0.91$ eV ($H_{1}$), respectively. There is a linear relationship between the concentration of $H_{1}$ and the fluorine ion fluence. The radiation damage and electrical performance degradation of AlGaN/GaN HEMTs are simulated by combining with simulation software of different methods. The calculated results are in agreement with the experimental data. The performance degradation caused by heavy ion of the device is mainly caused by the $H_{1}$ defect. The effect of defects with shallow energy level is shielded by the Fermi-level pinning in deeper energy level. Moreover, the defect distribution of GaN in AlGaN/GaN heterojunction plays a major role. It is found that the method of combining experimental data with multiscale simulation is an effective way to predict the radiation damage of devices. [ABSTRACT FROM AUTHOR]

This paper identifies the location of E C -0.9 eV trap caused by irradiation in AlGaN/GaN high electron mobility transistors (AlGaN/GaN-HEMTs). Helium ions at 40 keV and 400 keV were selected as the irradiation source. The 40 keV He ions only causes damage in the passivation and AlGaN layer, while the 400 keV He ions will cause damage mainly in GaN layer. The test results show that the threshold voltage of the device positive shift after 400 keV He ion irradiation. The carrier mobility and the Schottky barrier also show decreases. Deep level transient spectrum (DLTS) results show a defect with E C -0.9 eV in GaN layer after irradiation. While, the displacement damage in the passivation and AlGaN layer cause negative shift of the threshold voltage and the decrease of the carrier mobility. Combined with the DLTS and TCAD simulation, the location of defects with E C -0.9 eV caused by displacement damage is in the GaN layer. [ABSTRACT FROM AUTHOR]