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This study investigates the microstructure damage mechanism of the difficult-to-machine material nickel-base single crystal superalloy DD5 by analyzing the working condition load and crystal deformation. The complexity of the macroscopic and microscopic deformation phenomena during the machining process makes it challenging to study the damage mechanism of the workpiece. Hence, crystal kinematics equation is established using true stress-true strain theory, and the internal force balance and constitutive model of the crystal are analyzed. The proposed theory is applied to finite element processing and experimental analysis of the workpiece, and the subsurface deformation behavior is studied from a mechanistic perspective.The stress model is employed to explore the plastic flow phenomenon of the material during the machining process, and the influence of stress and shear force on the subsurface of the workpiece is discussed. The theoretical analysis of crystal deformation, based on the principles of materials science and mechanics, uncovers the relationship between subsurface deformation curvature and stress. The study delves into the effects of the grinding process on subsurface damage and deformation by analyzing the phenomena of plastic flow, plastic slip, and plastic winding in the subsurface microstructure. The results indicate that at grinding speed v s = 25 m/s and grinding depth a p = 60 μm, the damage to the subsurface deformation layer is minimal. The grinding process considerably impacts the stress exerted on the workpiece, with an amplitude ranging from 1.255 × 103 to 1.286 × 103. Conversely, the strain on the workpiece is relatively less affected by the grinding process, exhibiting an amplitude of 2.366–3.568. Moreover, when the normal stress and shear force of the abrasive particles form 45° angle, the subsurface deformation of DD5 manifests a distinct slip distortion at an approximate 45° curvature. • When the subsurface reaches internal stress balance f + div ∑ = 0 , the shear force is ν and the internal force is 1 − 2 ν. • With the development of technology, a grinding speed of v s = 25 m/s and grinding depth of a p = 60 μm can result in an effective removal of nickel-based superalloy DD5. • During grinding, the grinding depth is directly proportional to the true strain, whereas the grinding speed is inversely proportional to the true strain. • Subsurface crystal plastic slip and grinding direction mostly display 45° angle slip. [ABSTRACT FROM AUTHOR]