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In this paper, a comparison of different techniques for SiC high-voltage devices is performed using numerical simulations. In particular, the method of counter doping (CD) introduced in the junction termination extension (JTE) region to create a multizone termination effect is investigated. Simulation shows that compared with the other edge termination techniques, CD-JTE greatly reduces the sensitivity of breakdown voltage (BV) to JTE doses and surface charges. The multizone CD-JTE with outer rings shows that for a 30- \mu m thick epi-layer, 90% of the theoretical BV is achievable with a wide tolerance of 11\,\times \,10^{\mathrm {12}} /cm ^{2} to the JTE dose and 85% of the theoretical BV with an increased tolerance of 6.19\times 10^\mathrm 12 /cm ^2 to the positive surface charges, both superior to other JTE structures investigated in this paper. [ABSTRACT FROM AUTHOR]

Design and fabrication of 4H–SiC lateral high-voltage devices on semi-insulating substrates based on the charge compensation principle have been investigated in this work. In the simulation, field plates are critical in relieving the electric field crowding at junction corners at high reverse biases. By incorporating field plates with proper lengths, the breakdown voltage (BV) of a single-zone reduced-surface-field (RESURF) device with a 100- \mu\m drift region can be improved from 3360 to 5880 V. The BV can be further enhanced to 8000 V by using a two-zone RESURF structure. The reduction in BV by 10% charge imbalance variation is also improved from 49% for a single-zone structure to 36% for a two-zone structure. Simulation also shows that oxide charges and other surface charges will offset the optimized charge imbalance conditions and, therefore, should be considered in design if the amount is significant. A 4H–SiC JFET with a two-zone RESURF region was fabricated to demonstrate the advantages of lateral devices based on these concepts. The fabricated lateral 4H–SiC JFET has a BV of 4200 V and a specific on -resistance of 454 \m\Omega\cdot \cm^2. The figure of merit is as high as 38.8 \MW/cm^2. [ABSTRACT FROM AUTHOR]

AlGaN/GaN dual metal Schottky barrier diodes (SBD) are demonstrated on a silicon substrate. The anode is composed of two metals with different work functions to achieve a better trade-off between the forward and the reverse characteristics. The low work function metal Ti reduces the turn-on voltage and the high work function metal Ni at the edge of the anode reduces the reverse leakage current and maintains the breakdown voltage. The turn-on voltage of the Ni-SBD is reduced from 1.47 V to 0.57 V by employing the dual metal anode, and the breakdown voltages are virtually unaffected. [ABSTRACT FROM AUTHOR]