1. A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler.
- Author
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Kosuge, Atsutake, Mizuhara, Wataru, Shidei, Tsunaaki, Takeya, Tsutomu, Miura, Noriyuki, Taguchi, Masao, Ishikuro, Hiroki, and Kuroda, Tadahiro
- Subjects
ELECTRIC connectors ,DIRECTIONAL couplers ,TRANSMITTERS (Communication) ,COMPLEMENTARY metal oxide semiconductors ,ELECTROMAGNETIC interference ,COMPUTER interfaces - Abstract
A noncontact and housing-less thin–thick connecting method was developed for mobile industry processor interface (MIPI) applications. This paper describes the world's first 0.15-mm-thick connector using a vertical directional coupler (VDC) which enables simultaneous two-link communication with one coupler without fatal performance degradation. We have analyzed the conditions for isolating two links in a coupler, and the design method is discussed. A fully balanced pulse transmitter implemented in 90-nm CMOS technology significantly suppressed electromagnetic interference (EMI), which agrees well with MIPI requirements. An experimental liquid crystal display interface system reached a maximum data rate of 2.3 Gb/s/link at a bit error rate of less than 10^-12 and a power consumption of 1.47~pJ/b. The timing margin of single link was 320 ps (=64% U.I.) and of two links was 305 ps (=61% U.I.) at 2.0 Gb/s. [ABSTRACT FROM AUTHOR]
- Published
- 2014
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