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Abstract-The source/drain region of amorphous GaInZnO thin-film transistor with self-aligned top-gate structure was defined by simple NH[sub3] plasma treatment instead of complicated processes, such as ion implantation and activation. When the source/drain region of active layer was exposed to NH[sub3] gas plasma, the series resistance of the transistor decreased considerably. It exhibited electrical properties, such as a field-effect mobility of 6 cm[sup2]/V s, a threshold voltage of 0.21 V, and a subthreshold swing of 0.23 V/dec. [ABSTRACT FROM AUTHOR]

We fabricated gallium-indium-zinc oxide (GIZO) thin film transistors (TFTs) having a double-gated (DG) structure and studied the back gate effect on device performance. DG GIZO TFTs showed better threshold voltage (Vth), swing factor (S), and on/off current than those with a single gate. With the variation in back gate bias, the device performance significantly changes due to the modification of field distribution near the GIZO channel. It is believed that our DG structure is an effective way to improve the performance of GIZO oxide transistors and suppress the formation of an accumulation layer at the back surface. [ABSTRACT FROM AUTHOR]

We have demonstrated a self-aligned top-gate amorphous gallium indium zinc oxide thin film transistor (a-GIZO TFT). It had a field effect mobility of 5 cm2/V s, a threshold voltage of 0.2 V, and a subthreshold swing of 0.2 V/decade. Ar plasma was treated on the source/drain region of the a-GIZO active layer to reduce the series resistance. After Ar plasma treatment, the surface of the source/drain region was divided into In-rich and In-deficient regions. The a-GIZO TFT also had a constant sheet resistance of 1 kΩ/□ for a film thickness of over 40 nm. The interface between the source/drain Mo metal and the Ar plasma-treated a-GIZO indicated a good Ohmic contact and a contact resistivity of 50 μΩ cm2. [ABSTRACT FROM AUTHOR]