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This article has shown the design and characterization of silicon-integrated thin-film micro-transformers and their application in a quasi-resonant flyback converter. Two micro-transformers with different turn ratios of 4:4 and 3:3 were designed. The micro-transformers in this study have elongated spiral shape windings sandwiched between two layers of the thin-film magnetic core, and this structure can leverage the anisotropic core property. The micro-transformers were built on a silicon substrate using micro-electro-mechanical systems (MEMSs) fabrication process to ensure a high integration level and high power density. The inductance of 4:4 and 3:3 micro-transformers are 57.3 and 31.5 nH, respectively, their coupling coefficients are 90.5% and 82.7% at 30–40 MHz, and the measured quality factors are 7.82 at 21 MHz and 8.94 at 35 MHz, respectively. A resonant flyback converter topology deploying with a high electron mobility transistor [Gallium nitride (GaN)] was used to evaluate the electrical performance of two micro-transformers. Two resonant flyback converters operating at zero voltage switching (ZVS) reached the maximum conversion efficiency of 46.4% (3:3) and 45.7% (4:4), respectively, with 3.3 V input. The 3:3 micro-transformer developed in this work achieved the highest power density of 128 mW/mm2 with a similar efficiency compared to other cored micro-transformers. The loss analysis of the flyback conversion circuit shows that the main losses in the circuit are the copper winding loss of the micro-transformer and the eddy current loss of the magnetic core. The conversion efficiency of the circuit will be improved by applying thicker copper and core lamination in the future. [ABSTRACT FROM AUTHOR]

This letter demonstrates an on-silicon integrated thin film coupled inductor using a novel cascade matrix concept to suit multiphase integrated voltage regulator (IVR) applications. The novel cascade matrix coupled (CMC) stripline inductor facilitates all-phase-coupled configuration to reduce the phase ripple current in IVRs. It also shows excellent scalability and neat floor planning. Moreover, the proposed CMC inductor uses double layer metal scheme for windings and interconnects, which significantly reduces the ac winding resistance. A four-phase CMC inductor has been successfully fabricated on-silicon substrate and characterized, which uses conventional thin film magnetic core deposition process to achieve in-plane magnetic uniaxial anisotropy. The device occupies 3.2 × 1.7 mm2 floor area and provides 19.5 nH phase inductance with 120 mΩ dc resistance. The saturation current for each phase is up to 0.4 A when the phase inductance drops by approximately 20%. The coupling coefficient between any two phases of the proposed CMC inductor is 0.27, much higher and more controllable than that of toroid core-based coupled inductors. [ABSTRACT FROM AUTHOR]

In this work a stacked winding thin film magnetic core microinductor is proposed to improve the ratio of inductance to dc resistance (DCR). This article also describes an improved ac winding loss model accounting for the asymmetric 2-D magnetic fields present within the device. Two six-turn single layer and stacked winding devices are fabricated, and small signal measurements are presented with dc inductance of 150 nH and DCR of $0.35~\Omega $ for the stacked winding inductor, and with DCR of $0.47~\Omega $ for the single winding inductor. In this case, the total DCR of stacked winding inductor is reduced by approximately 25% compared with the corresponding single layer structure with an equivalent inductance and device area. [ABSTRACT FROM AUTHOR]

Inductor-on-silicon research to date has focused on optimizing technologies for maximum power density and efficiency, with most design procedures based on computationally intensive methods. In this paper, a simple and intuitive method for designing microinductors based on a given dc–dc converter specification, which includes accurate models for all loss components, is presented. A detailed examination of variations in designs to realise the same circuit performance is presented. Finally, finite element analysis simulations demonstrating the accuracy of the models are given, along with measured results. [ABSTRACT FROM AUTHOR]

This paper details the design, fabrication, and characterization of silicon-integrated microtransformers for isolated bias supplies. Racetrack-shaped microtransformers were designed and fabricated using the advanced double-layer metal (DLM) microfabrication process. The DLM devices have high inductance density of more than 80 nH/mm2 with an efficiency of approximately 78.2% at 20 MHz at 0.5-W output. This is the highest efficiency and power density reported for an integrated transformer in the literature. The inductance drop is less than 20% with a bias current of 0.35 A with up to 6-kV dc breakdown voltage achieved. [ABSTRACT FROM AUTHOR]

Microfabricated inductors experience increasing interest and research activity because of their high potential in buck converters for power supply in package and power supply on chip applications. This paper details the modeling and optimization of microfabricated racetrack inductors. The analytical expressions derived characterize inductance, efficiency, and power density based on geometrical parameters, inductor current, and switching frequency. An accurate analysis of the inductor current that includes the impact of losses is performed to determine the switching frequency, the ac copper losses, and the core losses. The presented model is compared to finite element method simulations and reported results of three microfabricated inductors. Finally, the optimum tradeoff between efficiency and power density is identified using the Pareto front, which results from the evaluation of a large number of microfabricated inductors in the design space defined by the application. [ABSTRACT FROM AUTHOR]

What is the future of integrated inductor design on silicon for power conversion applications at frequencies up to 100 MHz—is it magnetic-core or air-core inductors. This study presents measured results for two microfabricated inductors (magnetic core and air core), which have been designed to operate at 20 MHz and occupy a substrate area of less than 10 mm^2. The inductor technology and design are briefly discussed. An optimized inductor design study is, then, presented. Both magnetic-core and air-core inductor designs are compared and evaluated, in terms of inductance and efficiency per unit area for frequencies up to 100 MHz. The design of the microinductors is discussed and an analytical design optimization program is used to model the devices for the maximum efficiency and inductance. The introduction of laminations with high-frequency core inductors will also be examined within the study. A 100 MHz magnetic-core inductor design with three laminations gives a 36 nH inductance, with 96.4% efficiency and an area of 3 mm^2. A comparable air-core design also gives a 36 nH inductance, with 93.45% efficiency and an area of just 2.6 mm^2. [ABSTRACT FROM AUTHOR]