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Herein, a selective passivation of p‐GaN via hydrogen plasma treatment for InGaN single‐quantum‐well (SQW) red light‐emitting diodes (LEDs) is reported. Insulating regions are formed on the p‐GaN top surface via hydrogen plasma treatment, suppressing current injection beneath the p‐pad and along the mesa perimeter to increase light output and mitigate non‐radiative recombination. The fabricated LEDs demonstrate a high on‐wafer light output power density of >88 mW cm−2, a peak on‐wafer external quantum efficiency of 0.65%, and on‐wafer wall‐plug efficiency of 0.41% with a 645 nm peak emission wavelength at 10 mA (7.2 A cm−2) current injection. Further, the temperature dependence of InGaN SQW red LEDs is compared with their AlGaInP counterparts. InGaN SQW red LEDs exhibit a high characteristic temperature of 208 K and a small redshift coefficient of 0.072 nm K−1 at 72 A cm−2 current injection, which are almost 3 and 2 times better than the characteristics of AlGaInP red LEDs, respectively. [ABSTRACT FROM AUTHOR]

We report p-GaN passivation via hydrogen plasma used to create current blocking regions (CBRs) in InGaN-based green LEDs with standard dimensions of 280 × 650 μm2. The CBRs are created before mesa etching in two variants: underneath the opaque metal p-pad and both underneath the p-pad and along the device's mesa perimeter. The peak EQE increased by 13% and 23% in the first and the second cases, respectively, in comparison to the reference LED with no CBR. With a high injection current of 50 A/cm2, the EQE value increased by 2% in the case of CBRs underneath the p-pad as well as by 14% in the case of CBRs both underneath the p-pad and along the mesa perimeter (relative to the reference sample with no CBR). [ABSTRACT FROM AUTHOR]

We investigated the effect of the sidewall passivation by hydrogen plasma on the InGaN green micro-LED performance. Hydrogen passivation deactivates the surface region of p-GaN around the perimeter of the device mesa. Thus, hole injection is suppressed in this region, where etching-caused material degradation results in leakage current, decreasing device efficiency. We have confirmed the hydrogen passivation effect on LED square pixels with sizes of 20 and 100 ÎĽ m. For smaller LEDs, the reverse leakage current has reduced more than tenfold, and the external quantum efficiency of LEDs was enhanced 1.4-times due to the suppression of the non-radiative recombination. [ABSTRACT FROM AUTHOR]

InGaN-based LEDs are efficient light sources in the blueâ€"green light range and have been successfully commercialized in the last decades. Extending their spectral range to the red region causes a significant reduction in LED efficiency. This challenge hinders the integration of red, green, and blue LEDs based on III-nitride materials, especially for full-color micro-LED displays. We review our recent progress on InGaN-based red LEDs with different chip sizes from hundreds to tens of micrometers, including the epitaxial structures, device fabrication, and optical performance (peak wavelength, full-width at half-maximum, light output power, efficiency, temperature stability, and color coordinates). [ABSTRACT FROM AUTHOR]

GaN-based light-emitting devices have the potential to realize all visible emissions with the same material system. These emitters are expected to be next-generation red, green, and blue displays and illumination tools. These emitting devices have been realized with highly efficient blue and green light-emitting diodes (LEDs) and laser diodes. Extending them to longer wavelength emissions remains challenging from an efficiency perspective. In the emerging research field of micro-LED displays, III-nitride red LEDs are in high demand to establish highly efficient devices like conventional blue and green systems. In this review, we describe fundamental issues in the development of red LEDs by III-nitrides. We also focus on the key role of growth techniques such as higher temperature growth, strain engineering, nanostructures, and Eu doping. The recent progress and prospect of developing III-nitride-based red light-emitting devices will be presented. [ABSTRACT FROM AUTHOR]

We demonstrated amber InGaN $47\times 47\,\,\mu \text{m}^{{2}}$ micro-light-emitting diodes ($\mu $ LEDs) with the peak wavelength of 606 nm and full-width at maximum (FWHM) of 50 nm at 20 A/cm2. The amber $\mu $ LEDs exhibited a 33-nm blue-shift of the peak wavelength and obtain broader FWHMs to approximately 56 nm at 5 to 100 A/cm2. The peak on-wafer external quantum efficiency was 0.56% at 20 A/cm2. The characteristic temperature was 50–80 K at 20 to 60 A/cm2 but increased to 120–140 K at 80 to 100 A/cm2. The strong increase in the characteristic temperature from 60 to 80 A/cm2 could mainly be attributed to the saturation of the Shockley-Read-Hall non-radiative recombination at high current densities. [ABSTRACT FROM AUTHOR]

We fabricated indium gallium nitride (InGaN) red light-emitting diodes (LEDs) with a peak emission wavelength of 649 nm and investigated their electroluminescence (EL) properties. An additional separated peak in the EL spectrum of the red LEDs at 20 mA was observed at 465 nm. This additional peak also exhibits a blue-shift with increasing currents as does the main emission peak. Using high-resolution microscopy, we observed many point-like emission spots in the EL emission images at the currents below 1 mA. However, these emission spots cannot be identified at currents above 5 mA because the red emission from quantum wells (QWs) is much stronger than that emitted by these spots. Finally, we demonstrate that these emission spots are related to the defects generated in red QWs. The measured In content was lower at the vicinity of the defects, which was regarded as the reason for separated short-wavelength emission in red InGaN LEDs. [ABSTRACT FROM AUTHOR]