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Bidentate diamine and amino‐alcohol ligands have been used to form solid, water‐soluble, and air‐stable monomeric copper complexes of the type [Cu(NH2CH2CH(R)Y)2(NO3)2] (1, R=H, Y=NH2; 2, R=H, Y=OH; 3, R=Me, Y=OH). The complexes were characterized by elemental analysis, mass spectrometry, infrared spectroscopy, thermal gravimetric analysis, and single‐crystal X‐ray diffraction. Irrespective of their decomposition temperature, precursors 1–3 yield highly conductive copper features [1.5×10−6 Ω m (±5×10−7 Ω m)] upon atmospheric‐pressure plasma‐enhanced sintering. Hot off the press: Bidentate diamine and amino‐alcohol ligands are used to form solid, water‐soluble, and air‐stable monomeric copper complexes. Irrespective of their decomposition temperature, the precursors each yield highly conductive copper features upon atmospheric‐pressure plasma‐enhanced sintering. [ABSTRACT FROM AUTHOR]

For the first time, the plasma‐assisted inkjet printing of metal‐organic decomposition (MOD) inks is demonstrated to provide an easily up‐scalable method toward the deposition of highly conductive silver features on paper. Atmospheric plasma sintering methods provide a fast and effective alternative to thermal treatment. This high‐speed, room‐temperature approach ensures the immediate conversion of the MOD inks after printing and thus overcomes wetting issues typically encountered in porous substrates—a mechanical solution to a chemical problem. [ABSTRACT FROM AUTHOR]

The Cover Feature shows bidentate diamine and amino‐alcohol ligands, which are used to form solid, water‐soluble, and air‐stable monomeric copper complexes for low‐temperature plasma‐assisted inkjet printing of conductive copper. More information can be found in the Full Paper by C. E. Knapp et al. on page 850 in Issue 11, 2018 (DOI: 10.1002/open.201800131). [ABSTRACT FROM AUTHOR]

The developments in inkjet printing technology and the printed electronics industry in the past two decades have provided cost-effective, environmentfriendly, and reliable alternates to traditional methods of fabricating electrical devices. However, most commercial metallic inks require high sintering temperatures to form desired functional patterns, which limits the applications of printed electronics in scenarios that require electrical devices on thermally sensitive substrates, like biomaterials or bio-synthetic composite materials. This study provides the synthetic route of a novel silver-based metal organic decomposition (MOD) ink which is used to form highly conductive silver films on the thermally sensitive skin-inspired silk/epoxy composite substrates by directly inkjet printing with accurate pattern control, whilst self-decomposing and sintering at room temperature. The fabricated silver patterns on the thermally sensitive silk/epoxy composite substrate are highly conductive with conductivity of 4.65 × 104 S m-1. These silver patterns also show impressive malleability as bulk silver films, which can be further developed into motion sensors for wearable devices or medical applications. Our strategy provides a general platform for electronic functionalization without temperature constraints. The particle-free, reactive silver-precursor, and lower sintering temperature of the ink also widen the choices of substrates, as exemplified herein with outstanding printing quality and high electrical conductivity (1.20 × 106 S m-1) also achieve on paper. [ABSTRACT FROM AUTHOR]

The field of printed electronics strives for lower processing temperatures to move toward flexible substrates that have vast potential: from wearable medical devices to animal tagging. Typically, ink formulations are optimized using mass screening and elimination of failures; as such, there are no comprehensive studies on the fundamental chemistry at play. Herein, findings which describe the steric link to decomposition profile: combining density functional theory, crystallography, thermal decomposition, mass spectrometry, and inkjet printing, are reported. Through the reaction of copper(II) formate with excess alkanolamines of varying steric bulk, tris‐co‐ordinated copper precursor ions: "[CuL3]," each with a formate counter‐ion (1–3) are isolated and their thermal decomposition mass spectrometry profiles are collected to assess their suitability for use in inks (I1–3). Spin coating and inkjet printing of I1,2 provides an easily up‐scalable method toward the deposition of highly conductive copper device interconnects (ρ = 4.7–5.3 × 10−7 Ω m; ≈30% bulk) onto paper and polyimide substrates and forms functioning circuits that can power light‐emitting diodes. The connection among ligand bulk, coordination number, and improved decomposition profile supports fundamental understanding which will direct future design. [ABSTRACT FROM AUTHOR]