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Photonic integrated circuits (PICs) technologies in China have made rapid progress in the past decade. In this paper, recent advances and future prospective of PICs in China are introduced and discussed, respectively. More than nine major projects in the field of PICs have been issued. Various material platforms and technologies have been developed to realize photonic integrated devices for many applications focusing on broadband communication, such as optical and wireless network, optical interconnects, and optical coherent communication. Many research achievements and breakthrough have been made under the support of these projects, such as silicon photonics transceiver, InP-based transceiver, and optical and microwave signal processing chips. It can be expected that the PICs technology will be continuously supported in the next five years, since it has been considered as one of the key enabling technologies for supporting several national major assignments and strategies, such as broadband communication, supercomputing and datacenter. [ABSTRACT FROM AUTHOR]

ABSTRACT A distributed-feedback semiconductor laser array with buried heterostructure waveguide based on reconstruction equivalent chirp technique is experimentally demonstrated. The fabricated six-element laser array has channel spacing of 800 GHz and well meets the International Telecommunication Union standard, with relatively low threshold and high efficiency. Good single-longitudinal mode operation has been achieved at high injection current (120 mA) and high temperature (80°C), with side mode suppression ratios not lower than 40 dB, which is promising for the future wavelength division multiplexing systems. © 2015 Wiley Periodicals, Inc. Microwave Opt Technol Lett 57:1278-1281, 2015 [ABSTRACT FROM AUTHOR]

An asymmetric π equivalent phase shift sampled Bragg grating (SBG) semiconductor, which is consisted of two section with the same length but different sampling duty cycle 0.4 and 0.6, is investigated experimentally. By increasing the two injected currents of the studied laser from 15 mA to 120 mA, the lasing wavelength can be tuned by 2.1 nm. Combining selecting appropriate sampling period, the lasing wavelength of the laser can be tuned to meet the ITU-T standard. Because of high yield and low cost, this type of SBG laser is very beneficial for designing and fabricating monolithically integrated wideband multiwavelength laser array for photonic integrated circuits in next generation fiber-optic system. © 2012 Wiley Periodicals, Inc. Microwave Opt Technol Lett 55:692-696, 2013; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.27357 [ABSTRACT FROM AUTHOR]

We summarized the design, fabrication challenges and important technologies for multi-wavelength laser transmitting photonic integration. Technologies discussed include multi-wavelength laser arrays, monolithic integration and modularizing coupling and packaging. Fabrication technique requirements have significantly declined with the rise of reconstruction-equivalent-chirp and second nanoimprint mask technologies. The monolithic integration problem between active and passive waveguides can be overcome with Butt-joint and InP array waveguide grating technologies. The dynamic characteristics of multi-factors will be simultaneously measured with multi-port analyzing modules. The performance of photonic integration chips is significantly improved with the autoecious factors compensation packaging technique. [ABSTRACT FROM AUTHOR]

Packaging of distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this paper, DFB laser arrays of 4-channel @1310nm and 8-channel @1550nm are packaged. Our experimental results show that both these laser arrays have uniform wavelength spacing and larger than 35dB average Side Mode Suppression Ratio (SMSR). When I=35mA, we obtain the total output power of 1mW for 4-channel @1310nm, and 227μw for 8-channel @1550nm respectively. The high frequency characteristics of the packaged chips are also obtained, and the requirements for 4×10G or even 8×10G systems can be reached. Our results demonstrate the practical and low cost performance of REC technology and indicate its potential in the future fiber-to-the-home (FTTH) application. [ABSTRACT FROM AUTHOR]