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Abstract: Segregation of implanted As during steam oxidation of Si wafers is shown to result in a highly enriched, thin layer of As at the interface between the oxide and the underlying Si. Also, the oxidation rate was found to increase by as much as a factor of ∼2 depending on the depth distribution and fluence of the implanted As impurity. The thin As layer collected at the interface can be used in the design of very shallow junctions. This mechanism enables the formation of a narrow, degenerately doped layer of Si, which can be tailored to have a thickness of only few monolayers depending on the fluence of the implantation used. [Copyright &y& Elsevier]

Abstract We report on formation of epi-layer of Si x Ge 1-x by taking standard procedure in CMOS technology. The competitive process of solid solubility of Ge dopant into Si and SiO 2 is the key to engineer atomically sharp, low defect very thin epitaxial layer at the interface of oxide-Si. Oxidation time process was used to control the distribution of the doped Ge ions at the interface of Si with oxide and in the oxide layer. Implanted samples (35 keV and 1 × 1016 Ge+/cm2) were oxidized at 1050 °C for 30–90 min. RBS-Channeling analysis shows two separate peaks of Ge corresponds to different depths after oxidation. Corroborate with high resolution microscopy and elemental analysis, we determined the first peak as enriched layer of Si x Ge 1-x at the interface of SiO 2 Si. Less than 10 nm epitaxially grown interfacial layer is very low in defects, and Ge ions are fully substituted into the host lattice. The second peak originated from diffusion of Ge into SiO 2 resulted in a segregated layer containing Ge in oxide film. Technological demand on forming Si x Ge 1-x layer for CMOS application through standard routes is what we address in this research. Highlights • Ge implantation and dry oxidation were used to form very thin mixed Si x Ge 1-x layer. • A rich Ge layer was formed after dry oxidation at 1050 °C. • Very thin Si x Ge 1-x layer is in epitaxial relation to the silicon substrate. • Some Ge ions are segregated in top oxide layer. [ABSTRACT FROM AUTHOR]